CPC1006N

CPC1006N IXYS | Alldatasheet

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 Security  Passive Infrared Detectors (PIR)  Data Signalling  Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment—Patient/Equipment Isolation  Aerospace  Industrial Controls  Designed for EN50130-4 Compliant Security Systems  1500Vrms Input/Output Isolation  Only 0.5mA of LED Current Required to Operate  Small 4-Pin SOP Package  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Immune to Radiated EM Fields  Tape & Reel Version Available  Flammability Rating UL 94 V-0 The CPC1006N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500V rms of input to output isolation. The relay outputs are constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. Using IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays, the CPC1006N offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Switching Characteristics of Normally-Open Devices Form-A IF ILOAD 10% 90% ton toff Approvals 2 3 + Control – Control Load Load  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 CPC1006N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 70 mW T otal Power Dissipation 2 400 mW Isolation Voltage Input to Output 1500 V rms ESD Rating, Human Body Model 4 kV Operational T emperature -40 to +85 ºC Storage T emperature -40 to +125 ºC 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous I F=0.5mA I L - - 75 mA rms / mADC Peak t=10ms I LPK - - ±350 mA P On-Resistance 1 IF=0.5mA, IL=75mA R ON -7 1 0  Off-State Leakage Current I F=0mA, VL=60VP ILEAK --1 A Switching Speeds T urn-On I F=2mA, VL=10V ton - - 10 ms T urn-Off t off - - 10 ms Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -5 - p F Input Characteristics Input Control Current to Activate 2 IL=75mA I F - 0.1 0.5 mA Input Control Current to Deactivate - I F 0.05 - - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1 - p F 1 Measurement taken within 1 second of on-time. 2 For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 2mA is recommended. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1006N www.ixysic.com 3R05 On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=0.5mA, IL=75mA) LED Forward Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=75mA) Blocking Voltage (VP) 83 84 85 86 87 88 89 90 91 Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=0mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=2mA, IL=75mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=2mA, IL=75mA) Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Forward Voltage (V) Device Count (N) Temperature (ºC) -40 -20 0 20 40 60 80 100 IF (mA) 0.06 0.08 0.10 0.12 0.14 0.16 0.18 Typical IF for Switch Operation vs. Temperature (IL=50mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 100 200 300 400 500 600 Typical Turn-On Time vs. Temperature (IL=50mA) IF=1mA IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 200 300 400 500 600 700 Typical Turn-Off Time vs. Temperature (IL=50mA) IF=5mA IF=2mA IF=1mA Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=5mA IF=2mA IF=1mA IF=50mA IF=20mA IF=10mA LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (Ps) 100 150 200 250 300 Typical Turn-On Time vs. LED Forward Current (IL=50mA) LED Forward Current (mA) 0 1 02 03 04 05 0 Turn-Off Time (Ps) 443 444 445 446 447 448 449 Typical Turn-Off Time vs. LED Forward Current (IL=50mA) PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 CPC1006N Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) Typical On-Resistance vs. Temperature (IF=1mA, IL=50mA) Load Voltage (V) Load Current (mA) -100 -50 100 Typical Load Current vs. Load Voltage (IF=0.5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) Maximum Load Current vs. Temperature (IF=1mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=60V) Load Voltage (V) 0 1 02 03 04 05 06 0 Output Capacitance (pF) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (mA) 100 200 300 400 500 600 700 800 Energy Rating Curve (IF=0.5mA) PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION CPC1006N www.ixysic.com 5R05 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1006N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1006N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1006N-R05 ©Copyright 2018, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/30/2018 For additional information please visit our website at: www.ixysic.com CPC1006N MECHANICAL DIMENSIONS Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) CPC1006N CPC1006NTR Tape & Reel Recommended PCB Land Pattern 2.54 (0.10) 5.50 (0.217) 1.45 (0.057) 0.55 (0.022) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 TYP . (0.015 TYP .) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019)

0.203 Typ

(0.008 Typ)