CPC1004N IXYS | Alldatasheet

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 Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment—Patient/Equipment Isolation  Security Systems  Aerospace  Industrial Controls  Reed Relay Replacement  Operating Temperature Range: -40ºC to +110ºC  1500Vrms Input/Output Isolation  Small 4-Pin SOP Package  Low Drive Power Requirements  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Tape & Reel Version Available  Flammability Rating UL 94 V-0 CPC1004N is a miniature, low-voltage, low on-resistance, normally-open (1-Form-A) DC solid state relay in a 4-pin SOP package. The relay uses optically coupled MOSFET technology to provide 1500V rms of input to output isolation. The efficient MOSFET switch and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. The CPC1004N uses IXYS Integrated Circuits' state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays. The CPC1004N is ideal for replacing larger, less-reliable reed and electromechanical relays. Switching Characteristics of Normally-Open Devices Form-A IF ILOAD 10% 90% ton toff Approvals 2 3 + Control – Control DC + DC -  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: Certificate available on our website

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R09 CPC1004N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 100 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 70 mW T otal Power Dissipation 2 400 mW Capacitance Input to Output 1 pF Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +110 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 - IL - - 300 mADC Continuous T=110 °C, IF=10mA - - 100 Peak t=10ms I LPK - - 500 On-Resistance 2 IL=300mA R ON --4  Off-State Leakage Current V L=100VP ILEAK --1 µ A Switching Speeds T urn-On I F=5mA, VL=10V ton --3 ms T urn-Off t off --1 Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -2 5- p F Input Characteristics Input Control Current to Activate I L=300mA I F - 0.9 2 mA Input Control Current to Deactivate - I F 0.3 0.8 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R - - 10 µA 1 Load current derates linearly from 300mA @ 25oC to 100mA @ 110oC. 2 Measurement taken within 1 second of on-time. Electrical Characteristics @ 25°C (Unless Otherwise Specifi ed) Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1004N www.ixysic.com 3R09 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA* 106 112 118 124109 115 121 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50) Device Count (N) Typical On-Resistance Distribution (N=50, IF=2mA, IL=300mA) On-Resistance (:) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=300mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=200mA) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=300mA) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=300mA) LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Forward Voltage Drop (V) Temperature (ºC) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=10mA IF=5mA Typical LED Forward Voltage Drop vs. Temperature LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=100mA) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Dropout vs. Temperature (IL=100mA) Temperature (ºC)

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R09 CPC1004N PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. IF=5mA IF=10mA Turn-On Time (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical Turn-On Time vs. Temperature (IL=200mA) Temperature (ºC) Turn-Off Time (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 IF=5mA IF=10mA Typical Turn-Off Time vs. Temperature (IL=300mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 110 Typical On-Resistance vs. Temperature (IL=300mA) IF = 10mA IF = 5mA Temperature (ºC) On-Resistance (:)Load Current (mA) 500 450 400 350 300 250 200 150 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 I =5mAF I =10mAF Typical Maximum Load Current vs. Temperature Blocking Voltage (VP) -40 122 121 120 119 118 117 116 115 -20 0 20 40 60 80 100 Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 3 & 4 (VL=100V) Leakage (PA) Temperature (ºC) Time Load Current (A) 10μs 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100μs 100ms 1s10ms 10s 100s Energy Rating Curve Load Voltage (V) Load Current (mA) 300 200 100 -100 -200 -300 Typical Load Current vs. Load Voltage (IF=5mA) LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Turn-Off Time vs. LED Forward Current (IL=100mA)

INTEGRATED CIRCUITS DIVISION CPC1004N www.ixysic.com 5R09 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1004N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1004N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1004N-R09 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/1/2018 For additional information please visit our website at: www.ixysic.com CPC1004N MECHANICAL DIMENSIONS Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) CPC1004N CPC1004NTR Tape & Reel Recommended PCB Land Pattern 2.54 (0.10) 3.85 (0.152) 1.54 (0.061) 0.60 (0.024) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 ± 0.025 (0.015 ± 0.001) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019) 0.203 ± 0.025 (0.008 ± 0.001) Note: 1. Lead dimensions do not include plating: 1000 microinches max.