CPC1002N IXYS | Alldatasheet

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 Security  Passive Infrared Detectors (PIR)  Data Signalling  Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment—Patient/Equipment Isolation  Aerospace  Industrial Controls  Designed for use in Security Systems Complying with EN50130-4  Only 2mA of LED Current Required to Operate  Small 4-Pin SOP Package  100% Solid State  High Reliability  Arc-Free With No Snubbing Circuits  1500V rms Input/Output Isolation  No EMI/RFI Generation  Immune to Radiated EM Fields  Tape & Reel Version Available  Flammability Rating UL 94 V-0 The CPC1002N is a miniature, normally-open (1-Form-A) DC solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500V rms of input to output isolation. The super-efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture. The optically coupled output is controlled by the input's highly efficient infrared LED. The CPC1002N uses IXYS Integrated Circuits' state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays. The CPC1002N offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. 2 3 + Control – Control DC + DC - Switching Characteristics of Normally-Open Devices Form-A IF ILOAD 10% 90% ton toff Approvals  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: Certificate available on our website

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R07 CPC1002N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 70 mW T otal Power Dissipation 2 400 mW Isolation Voltage Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current, Continuous 1 IF=2mA I L - - 700 mA DC Peak Load Current t=10ms I LPK --1 A P On-Resistance 2 IL=100mA R ON - 0.35 0.55  Off-State Leakage Current V L=60VP ILEAK --1 A Switching Speeds T urn-On I F=3mA, VL=10V ton - 1.3 5 ms T urn-Off t off - 0.41 2 Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate 3 IL=100mA I F - 0.55 2 mA Input Control Current to Deactivate - I F 0.3 - - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1 - p F 1 Load current derates linearly from 700mA @ 25oC to 420mA @80oC. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1002N www.ixysic.com 3R07 PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 68 70 72 7469 71 73 Blocking Voltage (VP) Device Count (N) Typical Blocking Voltage Distribution (N=50) Device Count (N) Typical On-Resistance Distribution (N=50, IL=100mA) On-Resistance (:) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=3mA, IL=100mA) Turn-Off Time (ms Device Count (N) Typical Turn-Off Time (N=50, IF=3mA, IL=100mA) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=100mA) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=100mA) LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=1mA IF=2mA IF=5mA IF=10mA IF=20mA IF=50mA LED Current (mA) -40 1.50 1.25 1.00 0.75 0.50 0.25 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=100mA) Temperature (ºC) LED Current (mA) -40 1.50 1.25 1.00 0.75 0.50 0.25 -20 0 20 40 60 80 100 Temperature (ºC) Typical IF for Switch Dropout vs. Temperature (IL=100mA)

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R07 CPC1002N PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. Turn-On Time (ms) -40 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 -20 0 20 40 60 80 100 Typical Turn-On Time vs. Temperature (IF=3mA, IL=100mA) Temperature (ºC) Turn-Off Time (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 Typical Turn-Off Time vs. Temperature (IF=3mA, IL=100mA) Temperature (ºC) -40 1.2 1.0 0.8 0.6 0.4 0.2 -20 0 20 40 60 80 100 Typical On-Resistance vs. Temperature (IL=100mA) Temperature (ºC) On-Resistance (:) IF=2mA IF=5mA Load Current (mA) 900 800 700 600 500 400 300 200 100 Typical Maximum Load Current vs. Temperature -40 -20 0 20 40 60 80 120 100 Temperature (ºC) IF=5mA IF=2mA Blocking Voltage (VP) -40 -20 0 20 40 60 80 100 Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Leakage (PA) Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=60V) Time Load Current (A) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 10Ps 100 Ps 1ms 100ms 1s10ms 10s 100s Energy Rating Curve Load Voltage (V) Load Current (mA) 600 500 400 300 200 100 Typical Load Current vs. Load Voltage (IF=2mA) LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Typical Turn-Off Time vs. LED Forward Current (IL=100mA)

INTEGRATED CIRCUITS DIVISION CPC1002N www.ixysic.com 5R07 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1002N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1002N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1002N-R07 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/1/2018 For additional information please visit our website at: www.ixysic.com CPC1002N MECHANICAL DIMENSIONS Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) CPC1002N CPC1002NTR Tape & Reel Recommended PCB Land Pattern 2.54 (0.10) 3.85 (0.152) 1.54 (0.061) 0.60 (0.024) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 ± 0.025 (0.015 ± 0.001) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019) 0.203 ± 0.025 (0.008 ± 0.001) Note: 1. Lead dimensions do not include plating: 1000 microinches max.