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 Loop Detect  Ringing Detect  Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  I/O Subsystems  Industrial Control  100mA Continuous Load Rating  1500Vrms Input/Output Isolation  Small 4-Pin SOP Package  Machine Insertable, Wave Solderable  Surface Mount and Tape & Reel Version Available CPC1001N is a unidirectional input optocoupler with a single transistor output. Current transfer ratios range from 100% to 800%. 2 3 + Control – Control Load Load Approvals  UL Recognized Component: File # E76270  CSA Certified Component: Certificate # 1175739  EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 CPC1001N Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Input Power Dissipation 1 150 mW Input Control Current Peak (10ms) 5m A Reverse Input Voltage 5 V Phototransistor 2 150 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 2.00 mW / ºC Electrical Characteristics @ 25ºC Characteristic Symbol Test Condition Typ Units T urn-On Time t on IF=2mA, VCC=5V , RL=1K 1 sT urn-Off Time t off 30 Switching Characteristics @ 25ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Blocking Voltage I CEO=10µA BV CEO 30 90 - V P Phototransistor Output (Dark) Current I F=0mA, VCEO=5V I CEO - 9 500 nA Saturation Voltage I F=1mA, IC=1mA V CE(sat) - - 0.3 V Current T ransfer Ratio I F=0.2mA, VCE=0.5V CTR 100 330 800 % Output Capacitance V CEO=25V , f=1MHz C OUT -6 - p F Input Characteristics Input Control Current I C=0.2mA, VCE=0.5V I F - 0.1 0.2 mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Input Reverse Current V R=5V I R - - 10 µA Common Characteristics Input to Output Capacitance - C I/O -3 - p F Switching Time Test Circuit VCC VCE RL IF Pulse Width=5ms Duty Cycle=1% IF 10% 90% t ON t OFF VCE

INTEGRATED CIRCUITS DIVISION CPC1001N www.ixysic.com 3R05 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Refer to the Test Circuit on the previous page for these two graphs. LED Forward Voltage (V) LED Forward Current (mA)0 LED Voltage vs. LED Current (TA=25ºC) LED Forward Voltage (V) LED Forward Current (mA) 0.1 100 LED Voltage vs. LED Current (TA=25ºC) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage vs. Temperature IF=50mA IF=5mA IF=10mA IF=20mA IF=0.2mA IF=1mA IF=2mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Typical ICE (mA) 0.1 100 Typical ICE Current vs. Temperature (VCE=0.5V) IF=10mA IF=5mA IF=2mA IF=1mA IF=0.5mA IF=0.2mA IF=0.1mA Typical Voltage vs. Current (TA=25ºC) Collector Voltage (V) Collector Current (mA) IF=0.2mA IF=0.5mA IF=1mA IF=2mA IF=5mA IF=10mA LED Forward Current (mA) 0.1 1 10 CTR (%) 100 150 200 250 300 350 Typical CTR vs. LED Forward Current (VCE=0.5V) 55ºC 85ºC 25ºC -40ºC Temperature (ºC) -40 -20 0 20 40 60 80 100 Saturation Voltage (V) 0.08 0.10 0.12 0.14 0.16 0.18 0.20 Typical Saturation Voltage vs. Temperature (IF=2mA, IC=1mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Blocking Voltage vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) 100 200 300 400 500 Collector Leakage Current vs. Temperature VCC=10V VCC=5V VCC=3V Load Resistance (k:) 0.1 1 10 100 Turn-On Time (Ps) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Turn-On Time vs. Load Resistance (TA=25ºC, VCC=5V) IF=5mA IF=2mA IF=1mA Load Resistance (k:) 0.1 1 10 100 Turn-Off Time (Ps) 100 1000 Turn-Off Time vs. Load Resistance (TA=25ºC, VCC=5V) IF=5mA IF=1mA IF=2mA

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 CPC1001N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1001N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1001N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. For additional information please visit our website at: www.ixysic.com CPC1001N Specification: DS-CPC1001N-R05 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/13/2012 MECHANICAL DIMENSIONS Recommended PCB Land Pattern 2.54 (0.10) 5.60 (0.2205) 1.30 (0.0512) 0.60 (0.0217) Dimensions mm (inches) Pin 1 4.089 ± 0.203 (0.161 ± 0.008)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.076 (0.017 ± 0.005) 0.200 ± 0.025 (0.008 ± 0.001) 1.02 ± 0.025 (0.040 ± 0.001)

2.184 Max

(0.086 Max) 0.381 TYP . (0.015 TYP .) Lead to package standoff: 0.0637 ± 0.0383 (0.0025 ± 0.0015) 0.762 ± 0.102 (0.030 ± 0.004) Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P=8.00 (0.315)A0=6.50 (0.256) CPC1001N CPC1001NTR Tape & Reel