CNA30E2200FB IXYS | Alldatasheet

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Technical content

Features

  • high voltage thyristor - chip technology for long term stability
  • ISOPLUS i4-PAC™ high voltage package - isolated back surface - enlarged creepage towards heatsink - enlarged creepage between high voltage pins - application friendly pinout - high reliability - industry standard outline Thyristor Symbol Conditions Maximum Ratings VDRM VDSM 2200 2300 V V VRRM / RSM 1650 V ITSM sine 180°; t = 10 ms; V R = 0 V; T VJ = 25°C 200 A (di/dt)cr f = 50 Hz; t p = 200 µs; V D = 2000 V di G /dt = 0.45 A/µs; I G = 0.45 A non repetitive; I T = 45 A

150 A/µs

(dv/dt) cr VD = 2200 V RGK = ∞; method 1 (linear voltage rise)

5000 V/µs

ISOPLUS i4-PAC™ Symbol Conditions Characteristic Values min. max. VT IT = 45 A T VJ = 25°C 3.0 V VGT IGT VD = 6 V T VJ = 25°C 2.5 250 V mA VGD IGD VD = 2/3 V DRM T VJ = 25°C 0.2 V mA IL tp = 10 µs; V D = 6 V T VJ = 0°C IG = 0.45 A; diG /dt = 0.45 A/µs 700 mA IH VD = 6 V; R GK = ∞ T VJ = 0°C T VJ = 70°C 55 300 mA mA tq IT = 20 A; t p = 300 µs; di/dt = -20 A/µs VR = 10 V; dv/dt = 20 V/µs VD = 800 V T VJ = 70°C 100 µs IRRM / DRM VR = VRRM; V D = VDRM T VJ = 25°C T VJ = 70°C 200 µA µA IDSM / RSM VR = VRSM; V D = VDSM T VJ = 70°C 2 mA

© 2016 IXYS All rights reserved 2 - 2 20160523b CNA30E2200FB IXYS reserves the right to change limits, test conditions and dimensions. Die konvexe Form des Substrates ist typ. < 0.05 mm über der Kunststoffoberflächeder Bauteilunterseite The convexbow of substrate is typ. < 0.05 mm over plastic surface level ofdevice bottom side min max min max A 4.83 5.21 0.190 0.205 A1 2.59 3.00 0.102 0.118 A2 1.17 2.16 0.046 0.085 b 1.14 1.40 0.045 0.055 b2 1.47 1.73 0.058 0.068 b4 2.54 2.79 0.100 0.110 c 0.51 0.74 0.020 0.029 D 20.80 21.34 0.819 0.840 D1 14.99 15.75 0.590 0.620 D2 1.65 2.03 0.065 0.080 D3 20.30 20.70 0.799 0.815 E 19.56 20.29 0.770 0.799 E1 16.76 17.53 0.660 0.690 e 3.81 BSC 0.150 BSC e1 11.43 BSC 0.450 BSC L 19.81 21.34 0.780 0.840 L1 2.11 2.59 0.083 0.102 Q 5.33 6.20 0.210 0.244 R 2.54 4.57 0.100 0.180 W - 0.10 - 0.004 Dim. Millimeter Inches e E W A c 3x b2 3x b L D R Q 1 2 5 Component Symbol Conditions Maximum Ratings TVJ Tstg -10 ... +70 -40 ... +70 VISOL IISOL < 1 mA; 50/60 Hz 2500 V~ FC Mounting force with clip 20...120 N Symbol Conditions Characteristic Values min. typ. max. dS, d A A pin - K pin pin - backside metal 5.5 mm mm RthCH with heatsink compound 0.15 K/W Weight 9 g