332059-004US

750 INTEL | Alldatasheet

Document overview

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Technical content

Datasheet sections

• 1 Overview
• 1.1 References
• 1.2 Terms and Acronyms
• 2 Product Specifications
• 2.1 Capacity
• 2.2 Performance
• 2.3 Electrical Characteristics
• 2.4 Environmental Conditions
• 2.5 Product Regulatory Compliance
• 2.6 Reliability Specifications
• 3 Mechanical Information
• 4 Pin and Signal Descriptions
• 4.2 Pin Signal Definitions
• 5 Supported Command Sets
• 5.1 NVMe Admin Command Set
• 5.2 NVMe I/O Command Set
• 5.3 Log Page Support
• 5.4 SMART Attributes
• 5.5 Temperature Statistics
• 5.6 SET Feature Identifiers
• 6 NVMe Driver Support
• 7 Certifications and Declarations

Order Number: 332059-004US Intel® Solid State Drive 750 Series Product Specification  Capacities  400GB, 800GB, 1.2TB PCIe® Gen3 x4 Form Factor  2.5-inch Form Factor  15mm Z-height  U.2-compatible connector  Add-in Card (AIC) Form Factor  Half-height, Half-length  Single slot x4 connector Performance1,2  Seq R/W: Up to 2500/1200 MB/s3  4K Random Read: Up to 460K  4K Random Write: Up to 290K Latency (average sequential)  Read: 20 µs (TYP)  Write: 20 µs (TYP) Components  Intel® 20nm MLC NAND Flash Memory Operating System Support:  Windows 7* 64 bit  Windows 8* 64 bit  Windows 8.1* 64 bit  Windows 10* 64 bit  Ubuntu 14.05 and 15.05  UEFI* 2.3.1 or later Reliability  Uncorrectable Bit Error Rate (UBER): 1 sector per 1016 bits read  Mean Time Before Failure (MTBF): 1.2 million hours Power  2.5-inch: 12V Supply Rail  AIC: 3.3V and 12V Supply Rail  Enhanced power-loss data protection  Active/Idle (TYP): 22W/4W (TYP) Compliance  NVM ExpressTM 1.0  PCI Express® Base Specification Rev 3.0  SFF 8639 Enterprise SSD Form Factor Version 1.0a  PCI Express Card Electro-Mechanical* (CEM) Specification Rev 2.0 Certifications and Declarations  UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft WHQL*, VCCI* Endurance Rating  70 GB Writes Per Day  Up to 127 TBW (Terabytes Written)5 Temperature Specification  Operating:  AIC: 0 to 55° C  2.5-inch: 0 to 70° C  Non-Operating6: -55 to 95° C  Temperature monitoring Weight  AIC: up to 195 gm  2.5-inch: up to 125 gm Shock  2.5-inch: 1,000 G/0.5msec  AIC: 50 G Trapezoidal, 170 in/s Vibration  Operating: 2.17 GRMS (5-700Hz)  Non-Operating: 3.13 GRMS (5-800Hz) Altitude (Simulated)  Operating: -1,000 to 10,000 ft  Non-Operating: -1,000 to 40,000 ft Product Ecological Compliance  RoHS 1. Performance values vary by capacity and form factor 2. Performance specifications apply to both compressible and incompressible data 3. MB/s = 1,000,000 bytes/second 4. 4KB = 4,096 bytes; 8 KB = 8,192 bytes 5. 1PB = 1015 Bytes 6. Please contact your Intel representative for details on the non -operating temperature range

Intel® Solid State Drive 750 Series Product Specification October 2015 2 332059-004US

Revision History

Number Description Revision Date 001  Initial release April 2015 002  TBW Endurance Value Correction  Minor Documentation edit in SMART Attributes Table 14 June 2015 003  Amended with 800GB SKU information  Updated Performance numbers  Included Ubuntu OS support August 2015 004  Removed 3.3v from 2.5 FF  Added Windows 10 support October 2015

Ordering Information

Contact your local Intel sales representative for ordering information. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. Test and System Configuration: Processor: Intel® Core™ i7-4790K, Speed: 4.0 GHz, Chipset: Intel® Z97, Motherboard: ASUS* z97-Deluxe, DRAM capacity: 4GB, DRAM Speed: DDR3 2133 MHz, OS: Windows* 8.1. For more complete information about performance and benchmark results, visit http://www.intel.com/performance. All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2015 Intel Corporation. All rights reserved.

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 5

1 Overview

This document describes the specifications and capabilities of the Intel® Solid State Drive 750 Series (Intel® SSD 750 Series). The Intel SSD 750 Series is Intel’s first PCIe® Gen3 x4 SSD developed for the client enthusiast and workstation markets. The Intel SSD 750 Series is architected with the new high performance controller interface - Non-Volatile Memory Express™ (NVMe™) - delivering outstanding performance, low latency and Quality of Service. NVMe is a standardized interface that enables higher performance and lower latency than previous generations. The Intel SSD 750 Series offers capacities of 400GB, 800GB, and 1.2TB in Add-In card and 2.5-inch U.2 (formerly known as SFF-8639) form factors. The Intel SSD 750 Series is Intel’s highest performing client drive specifically designed for the PC enthusiast and workstation systems with demanding storage workstation requirements. With PCIe Gen3 x4 support and NVMe queuing interface, the Intel SSD 750 Series delivers excellent sequential read performance of up to 2.5GB/s and sequential write speeds of up to 1.2 GB/s. The Intel SSD 750 Series delivers random read IOPS of up to 460K and random write IOPS of up to 290K for 4KB operations. Also, by taking advantage of the direct path from the storage to the CPU by means of NVMe, the Intel SSD 750 Series exhibits low latency of less than 20 μs for sequential access to the SSD. Intel SSD 750 Series includes these key features:  PCIe Gen3 x4 with NVMe interface  Consistently Higher IOPS and throughput  Sustained low latency  Enhanced power-loss data protection

Intel® Solid State Drive 750 Series Product Specification October 2015 6 332059-004US

1.1 References

Table 1: Standard Information Referenced in this Document Date Title Location Jan 2013 SFF 8639 Enterprise SSD Form Factor Version 1.0a http://www.ssdformfactor.org Feb 2012 NVMe Revision 1.0c http://www.nvmexpress.org Nov 2010 PCIe Base Specification Revision 3.0 http://pcisig.com July 2012 Solid State Drive (SSD) Requirements and Endurance Test Method (JESD219) http://www.jedec.org/standards- documents/results/jesd219 Sept 2010 Solid State Drive (SSD) Requirements and Endurance Test Method (JESD218) http://www.jedec.org/standards- documents/docs/jesd218/ Dec 2008 VCCI http://www.vcci.jp/vcci_e/ June 2009 RoHS http://qdms.intel.com/ Click Search MDDS Database and search for material description datasheet International Electrotechnical Commission EN 61000 http://www.iec.ch/ 1995 4-2 (Electrostatic discharge immunity test) 1996 4-3 (Radiated, radio-frequency, electromagnetic field immunity test) 1995 4-4 (Electrical fast transient/burst immunity test) 1995 4-5 (Surge immunity test) 1997 4-6 (Immunity to conducted disturbances, induced by radio- frequency fields) 1994 4-11 (Voltage Variations, voltage dips, short interruptions and voltage variations immunity tests)

1995 ENV 50204

(Radiated electromagnetic field from digital radio telephones) http://www.dbicorporation.com/ radimmun.htm/

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 7

1.2 Terms and Acronyms

Table 2: Glossary of Terms and Acronyms Term Definition ATA Advanced Technology Attachment CRC Cyclic Redundancy Check DAS Device Activity Signal DMA Direct Memory Access ECC Error Correction Code EEPROM Electrically Erasable Programmable Read Only Memory EXT Extended FPDMA First Party Direct Memory Access GB Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes. Gb Gigabit HDD Hard Disk Drive HET High Endurance Technology KB Kilobyte I/O Input/Output IOPS Input/Output Operations Per Second ISO International Standards Organization LBA Logical Block Address MB Megabyte (1,000,000 bytes) MLC Multi-level Cell MTBF Mean Time Between Failures NOP No Operation NVMe Non-Volatile Memory Express PB Petabyte PCB Printed Circuit Board RDT Reliability Demonstration Test RMS Root Mean Square SSD Solid State Drive TB Terabyte TYP Typical UBER Uncorrectable Bit Error Rate VPD Vital Product Data

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2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors Intel SSD 750 Series Unformatted Capacity (Total User Addressable Sectors in LBA Mode) 400GB 781,422,768 800GB 1,562,824,368 1.2TB 2,344,225,968 NOTES:

1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.

2.2 Performance

Table 4: Performance1 Specification1 Unit Intel SSD 750 Series 400GB 800GB5 1.2TB Random 4KB2 Read (up to) IOPS 430,000 420,000 460,000 Random 4KB Write (up to) IOPS 230,000 210,000 290,000 Sequential 128KB Read3 MB/s4 2,200 2,100 2,500 Sequential 128KB Write MB/s 900 800 1,200 NOTES: 1. Performance measured by Intel using IOMeter* on Intel provided NVMe driver with Queue Depth 128 (QD=32, workers=4). Measurements are performed on a contiguous 8GB span of the drive on a full SSD. Power mode set at 25W. Drive is unpartitioned. 2. 4KB = 4,096 bytes 3. Performance measured by Intel using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue Depth 128. Power mode set at 25W. 4. MB/s = 1,000,000 bytes/second 5. Performance due to non- optimal NAND layout

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 9 Table 5: Latency Specification Intel SSD 750 Series Sequential Random Read1 20 µs (TYP) 120 µs (TYP) Write1 20 µs (TYP) 45 µs (TYP) Typical Power On to First I/O Completion2 Up to 10 seconds Typical Reset to First I/O Completion3 Up to 15 seconds NOTES: 1. Device measured by Intel using IOMeter*. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 using Windows 8.1 driver. Power mode set at 25W. 2. Assumes clean shutdown. Time to complete first I/O from complete power off state. 3. Time to complete first I/O after start of NVMe Controller Reset.

2.3 Electrical Characteristics

Table 6: Operating Voltage Electrical Characteristics Intel SSD 750 Series 3.3V Operating Characteristics: (Add-in Card only) Operating Voltage range Rise time (Max/Min) Fall time (Max/Min)1 Noise level Min Off time2 Max Average Current

3.3 V (±10%)

300 mV pp 10Hz – 100 KHz 50 mV pp 100KHz – 20 MHz 500 ms 3.0 A 12V Operating Characteristics: Operating Voltage range Rise time (Max/Min) Fall time (Max/Min)1 Noise level Min Off time2 Max Average Current

12 V (+10%/-20%)

1000 mV pp 10Hz – 100 KHz 100 mV pp 100KHz – 20 MHz 500 ms 2.1 A NOTES: 1. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management. Intel makes no claims on the success rate of its power loss protection feature. The power loss feature does not provide 100 percent protection on all power loss scenarios. 2. The drive must be powered off for at least 500msec before powering on.

Intel® Solid State Drive 750 Series Product Specification October 2015 10 332059-004US Table 7: Power Consumption Specification Unit Intel SSD 750 Series 400GB 800GB 1.2TB Active Write – Average1 W 12 15 22 Active Read – Average2 W 9 9 10 Idle W 4 4 4 NOTES: 1. The workload equates 64KB (65,536 bytes) Queue Depth equal to 128 sequential writes. Average power is measured by Intel using scope trigger over a 100 ms sample period. 2. The workload equates 64KB (65,536 bytes) Queue Depth equal to 128 sequential reads.

2.4 Environmental Conditions

Table 8: Temperature, Shock, Vibration Temperature Add-In card form factor 2.5-inch form factor Temperature Operating1 Non-operating2 0 – 55o C -55–95o C 0–35o C 0-70 o C Temperature Gradient3 Operating Non-operating 30o C/hr (Typical) 30o C/hr (Typical) 30o C/hr (Typical) 30o C/hr (Typical) Humidity Operating Non-operating 5–95% 5–95% 5–95% 5–95% Shock and Vibration Range Shock4 Operating Non-operating

50 G Trapezoidal, 170 in/s

1,000 G (Max) at 0.5 msec 1,000 G (Max) at 0.5 msec Vibration5 Operating Non-operating

2.17 GRMS (5-700 Hz) Max

3.13 GRMS (5-800 Hz) Max

NOTES: 1. Operating temperature implies ambient air temperature with any airflow conditions. 2. Please contact your Intel representative for details on the non-operating temperature range. 3. Temperature gradient measured without condensation. 4. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value. 5. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 11

2.5 Product Regulatory Compliance

Intel SSD 750 Series meets or exceeds the regulatory or certification requirements in the following table. Table 9: Product Regulatory Compliance Specifications Title Description Region For Which Conformity Declared ICES-003, Issue 4 Interference-Causing Equipment Standard Digital Apparatus CA/CSA-CEI/IEC CISPR 22-10 (Ref. CISPR 22:2008) Canada IEC 55024 Information Technology Equipment – Immunity characteristics – Limits and methods of measurement CISPR24:2010 EN-55024: 2010 and its amendments European Union IEC 55022 Information Technology Equipment – Radio disturbance Characteristics – Limits and methods of measurement CISPR24:2008 (Modified) EN-55022: 2010 and its amendments European Union EN-60950-1 2nd Edition Information Technology Equipment – Safety – Part 1: General Requirements USA/Canada UL/CSA EN-60950-1 2nd Edition Information Technology Equipment – Safety – Part 1: General Requirements USA/Canada

2.6 Reliability Specifications

Intel SSD 750 Series meets or exceeds SSD endurance and data retention requirements as specified in the JESD218 standard. Reliability specifications are listed in the following table. Table 10: Reliability Specifications Parameter Value Uncorrectable Bit Error Rate (UBER) Uncorrectable bit error rate will not exceed one sector in the specified number of bits read. In the unlikely event of a non-recoverable read error, the SSD will report it as a read failure to the host; the sector in er ror is considered corrupt and is not returned to the host. < 1 sector per 1016 bits read Mean Time Between Failures (MTBF) Mean Time Between Failures is estimated based on Telcordia* methodology and demonstrated through Reliability Demonstration Test (RDT). 1.2 million hours Data Retention The time period for retaining data in the NAND at maximum rated endurance. 3 months power-off retention once SSD reaches rated write endurance at 40 °C Endurance Rating The SSD will have a minimum useful life based on a typical client workload assuming up to 70GB of host writes per day. 5 years

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3 Mechanical Information

Figures 3-1 and 3-2 show the physical package information for the Intel SSD 750 Series in the 2.5-inch form factors. All dimensions are in millimeters. Figure 3-1 Intel SSD 750 Series 2.5 inch U.2 Dimensions Note: Drawing may not reflect final product. Length does not include 0.3 connector protrusion.

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 13 Figure 3-2 Intel SSD 750 Series PCIe® Add-In Card Dimensions Note: Drawing may not reflect final product.

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4 Pin and Signal Descriptions

4.1 2.5-inch Form Factor Pin Locations Figure 4-1 2.5-inch Form Factor Pin Locations Note: 2.5-inch connector (U.2) supports built in latching capability.

4.2 Pin Signal Definitions

Table 11: Pin Definition for 2.5-inch Form Factor (U.2 connector specification) Pin Name Description Pin Name Description S1 GND Ground E7 REFCLK0+ Reference clock port 0 S2 Not used (SATA/SAS) E8 REFCLK0- Reference clock port 0 S3 Not used (SATA/SAS) E9 GND Ground S4 GND Ground E10 PETp0 Transmitter differential pair, Lane 0 S5 Not used (SATA/SAS) E11 PETn0 Transmitter differential pair, Lane 0 S6 Not used (SATA/SAS) E12 GND Ground S7 GND Ground E13 PERn0 Receiver differential pair, Lane 0 E1 REFCLK1+ Reference clock port 1 (not used) E14 PERp0 Receiver differential pair, Lane 0 E2 REFCLK1- Reference clock port 1 (not used) E15 GND Ground E3 3.3Vaux 3.3V auxiliary power (Optional) E16 RSVD Reserved E4 PERST1# Fundamental reset port 1 (not used) S8 GND Ground E5 PERST0# Fundamental reset port 0 S9 Not used (SATAe/SAS) E6 RSVD Reserved S10 Not used (SATAe/SAS) P1 Not used (SATAe/SAS) S11 GND Ground P2 Not used (SATAe/SAS) S12 Not used (SATAe/SAS)

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 15 Pin Name Description Pin Name Description P3 Not used (SATAe) S13 Not used (SATAe/SAS) P4 IfDet_N Interface detect (drive type) S14 GND Ground P5 GND Ground S15 RSVD Reserved P6 GND Ground S16 GND Ground P7 Not used (SATA/SAS) S17 PETp1 Transmitter differential pair, Lane 1 P8 Not used (SATA/SAS) S18 PETn1 Transmitter differential pair, Lane 1 P9 Not used (SATA/SAS) S19 GND Ground P10 PRSNT_N Presence detect (also used for drive type) S20 PERn1 Receiver differential pair, Lane 1 P11 Activity Activity signal from the drive S21 PERp1 Receiver differential pair, Lane 1 P12 Hot-Plug Ground S22 GND Ground P13 +12V_pre 12V power S23 PETp2 Transmitter differential pair, Lane 2 P14 +12V 12V power S24 PETn2 Transmitter differential pair, Lane 2 P15 +12V 12V power S25 GND Ground S26 PERn2 Receiver differential pair, Lane 2 S27 PERp2 Receiver differential pair, Lane 2 S28 GND Ground E17 PETp3 Transmitter differential pair, Lane 3 E18 PETn3 Transmitter differential pair, Lane 3 E19 GND Ground E20 PERn3 Receiver differential pair, Lane 3 E21 PERp3 Receiver differential pair, Lane 3 E22 GND Ground E23 Not used/NC (SMBus clock) E24 Not used/NC (SMBus data) E25 DualPortEn_N Dual port enable NOTES:  PRSNT_N is kept open by the Intel SSD 750 Series.  IfDet_N is grounded by Intel SSD 750 Series.  DualPortEn_N pin shall be left un-connected or un-driven by the system to enable single port operation with all 4 lanes. If un-connected, Intel SSD 750 will pull it high.P11 can be used for activity signal from Intel SSD 750 Series.  Intel SSD 750 Series only uses REFCLK0+ and REFCLK0- as reference clock pair.  Intel SSD 750 Series only uses PERST0# as a fundamental reset.

Intel® Solid State Drive 750 Series Product Specification October 2015 16 332059-004US Table 12: Pin Definition for Add-In Card (Half Height Half Length) Form Factor Side B Side A Pin Name Description Name Description 1 +12V 12V power PRSNT1# Hot-Plug presence detect 2 +12V 12V power +12V 12V power 3 +12V 12V power +12V 12V power

4 GND Ground GND Ground

5 SMCLK Not used/NC (SMBus (System Management Bus) clock) JTAG2 TCK (Test Clock), clock input for JTAG interface

6 SMDAT Not used/NC (SMBus (System Management Bus) data) JTAG3 TDI (Test Data Input)

7 GND Ground / UART_HOST JTAG4 TDO (Test Data Output)

8 +3.3V 3.3V power JTAG5 TMS (Test Mode Select) 9 JTAG1 TRST# (Test Reset) resets the JTAG interface +3.3V 3.3V power 10 3.3Vaux 3.3V auxiliary power (Optional) +3.3V 3.3V power

11 WAKE# Signal for Link reactivation PERST# Fundamental reset

12 RSVD Reserved GND Ground

13 GND Ground REFCLK+ Reference clock (differential pair)

14 PETp0 Transmitter differential pair, Lane 0 REFCLK- Reference clock (differential pair)

15 PETn0 Transmitter differential pair, Lane 0 GND Ground

16 GND Ground PERp0 Receiver differential pair, Lane 0

17 PRSNT2# Hot-Plug presence detect PERn0 Receiver differential pair, Lane 0

18 GND Ground GND Ground

19 PETp1 Transmitter differential pair, Lane 1 RSVD Reserved

20 PETn1 Transmitter differential pair, Lane 1 GND Ground

21 GND Ground PERp1 Receiver differential pair, Lane 1

22 GND Ground PERn1 Receiver differential pair, Lane 1

23 PETp2 Transmitter differential pair, Lane 2 GND Ground

24 PETn2 Transmitter differential pair, Lane 2 GND Ground

25 GND Ground PERp2 Receiver differential pair, Lane 2

26 GND Ground PERn2 Receiver differential pair, Lane 2

27 PETp3 Transmitter differential pair, Lane 3 GND Ground

28 PETn3 Transmitter differential pair, Lane 3 GND Ground

29 GND Ground PERp3 Receiver differential pair, Lane 3

30 RSVD Reserved PERn3 Receiver differential pair, Lane 3

31 PRSNT2# Hot-Plug presence detect GND Ground

32 GND Ground RSVD Reserved

NOTES:  All pins are numbered in ascending order from the left to the right, with side A on the top of the centerline and side B on the bottom of the centerline, use the reference drawing in Fig2, with the logo visible.  The PCI Express® interface pins PETpx, PETnx, PERpx, and PERnx are named with the following convention: “PE” stands for PCI Express high speed, “T” for Transmitter, “R” for Receiver, “p” for positive (+) and “n” for negative (-).  The sequential mating for Hot-Plug is accomplished by staggering the edge fingers on the add-in card.

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 17

5 Supported Command Sets

Intel SSD 750 Series supports all mandatory Admin and I/O commands defined in NVMe (Non-Volatile Memory ExpressTM) revision 1.0.

5.1 NVMe Admin Command Set

Intel SSD 750 Series supports all mandatory NVMe commands, which are:  Delete I/O Submission Queue  Delete I/O Completion Queue  Create I/O Submission Queue  Create I/O Completion Queue  Get Log Page  Identify  Abort  SET Features  GET Features  Asynchronous Event Notification Intel SSD 750 Series also supports the following optional I/O commands defined in NVMe revision 1.0:  Firmware Activate  Firmware Image Download  Format NVM Note: See Appendix A, “Identify Controller Data Structure” for details on commands and capabilities.

5.2 NVMe I/O Command Set

Intel SSD 750 Series supports all the mandatory NVMe I/O command set defined in NVMe 1.0 specification, which are:  Flush  Write  Read Additionally, the following optional commands are supported:  Write Uncorrectable  Dataset Management (De-allocate only)

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5.3 Log Page Support

Intel SSD 750 Series supports the following mandatory log pages defined in NVMe 1.0 specification:  Error Information (Log Identifier 01h)  SMART/ Health Information (Log Identifier 02h)  Firmware Slot Information (Log Identifier 03h) Note: See NVMe 1.0 version of the specification for the log page content. Additionally, Intel SSD 750 Series will support the following vendor unique log pages:  Log Page Directory (Log Identifier C0h)  Temperature Statistics (Log Identifier C5h)  Vendor Unique SMART Log (Log Identifier CAh)

5.4 SMART Attributes

The following table lists the SMART attributes supported by the Intel SSD 750 Series in accordance with NVMe 1.0 specification. Table 13: SMART Attributes (Log Identifier 02h) Byte # of Bytes Attribute Description 0 1 Critical Warning: These bits if set, flag various warning sources. Bit 0: Available Spare is below Threshold Bit 1: Temperature has exceeded Threshold Bit 2: Reliability is degraded due to excessive media or internal errors Bit 3: Media is placed in Read- Only Mode Bit 4: Volatile Memory Backup System has failed (e.g., enhanced power loss capacitor test failure) Bits 5-7: Reserved Any of the critical warning can be tied to asynchronous event notification. 1 2 Temperature: Overall Device current temperature in Kelvin. For AIC, it reports the NAND temperature, for 2.5-inch FF, it is the case temperature. 3 1 Available Spare: Contains a normalized percentage (0 to 100%) of the remaining spare capacity available Starts from 100 and decrements. 4 1 Available Spare Threshold Threshold is set to 10%. 5 1 Percentage Used Estimate (Value allowed to exceed 100%) A value of 100 indicates that the estimated endurance of the device has been consumed, but may not indicate a device failure. The value is allowed to exceed 100. Percentages greater than 254 shall be represented as 255. This value shall be updated once per power-on hour (when the controller is not in a sleep state).

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 19 Byte # of Bytes Attribute Description 32 16 Data Units Read (in LBAs) Contains the number of 512 byte data units the host has read from the controller; this value does not include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes read) and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount of data read to 512 byte units. 48 16 Data Units Write (in LBAs) Contains the number of 512 byte data units the host has written to the controller; this value does not include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes written) and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount of data written to 512 byte units. For the NVM command set, logical blocks written as part of Write operations shall be included in this value. Write Uncorrectable commands shall not impact this value. 64 16 Host Read Commands Contains the number of read commands issued to the controller. 80 16 Host Write Commands Contains the number of write commands issued to the controller. 96 16 Controller Busy Time (in minutes) Contains the amount of time the controller is busy with I/O commands. The controller is busy when there is a command outstanding to an I/O Queue (specifically, a command was issued by way of an I/O Submission Queue Tail doorbell write and the corresponding completion queue entry has not been posted yet to the associated I/O Completion Queue). This value is reported in minutes. 112 16 Power Cycles Contains the number of power cycles. 128 16 Power On Hours Contains the number of power-on hours. This does not include time that the controller was powered and in a low power state condition. 144 16 Unsafe shutdowns Contains the number of unsafe shutdowns. This count is incremented when a shutdown notification (CC.SHN) is not received prior to loss of power. 160 16 Media Errors Contains the number of occurrences where the controller detected an unrecovered data integrity error. Errors such as uncorrectable ECC, CRC checksum failure, or LBA tag mismatch are included in this field. 176 16 Number of Error Information Log Entries Contains the number of Error Information log entries over the life of the controller.

Intel® Solid State Drive 750 Series Product Specification October 2015 20 332059-004US Table 14: Additional SMART Attributes (Log Identifier CAh) Byte # of Bytes Attribute Description 0 1 AB (Program Fail Count) Raw value: shows total count of program fails. Normalized value: beginning at 100, shows the percent remaining of allowable program fails. 3 1 Normalized Value 5 6 Current Raw Value 12 1 AC (Erase Fail Count) Raw value: shows total count of erase fails. Normalized value: beginning at 100, shows the percent remaining of allowable erase fails. 15 1 Normalized Value 17 6 Current Raw Value 24 1 AD (Wear Leveling Count) Raw value: Bytes 1-0: Min. erase cycle Bytes 3-2: Max. erase cycle Bytes 5-4: Avg. erase cycles Normalized value: decrements from 100 to 0. 27 1 Normalized Value 29 6 Current Raw Value 36 1 B8 (End to End Error Detection Count) Raw value: reports number of End-to- End detected and corrected errors by hardware. Normalized value: always 100. 39 1 Normalized Value 41 6 Current Raw Value 48 1 C7 (CRC Error Count) Raw value: shows total number of PCIe Interface CRC errors encountered, as specified in PCIe Link Performance Counter Parameter for “Bad TLP”. Normalized value: always 100. 51 1 Normalized Value 53 6 Current Raw Value 60 1 E2 (Timed Workload, Media Wear) Raw value: measures the wear seen by the SSD (since reset of the workload timer, attribute E4h), as a percentage of the maximum rated cycles. Divide the raw value by 1024 to derive the percentage with 3 decimal points. Normalized value: always 100. 63 1 Normalized Value 65 6 Current Raw Value 72 1 E3 (Timed Workload, Host Reads %) Raw value: shows the percentage of I/O operations that are read operations (since reset of the workload timer, attribute E4h). Reported as integer percentage from 0 to 100. Normalized value: always 100. 75 1 Normalized Value 77 6 Current Raw Value 84 1 E4 (Timed Workload, Timer) Raw value: measures the elapsed time (number of minutes since starting this workload timer). Normalized value: always 100. 87 1 Normalized Value 89 6 Current Raw Value 96 1 EA (Thermal Throttle Status) Raw value: reports Percent Throttle Status and Count of events Byte 0: Throttle status reported as integer percentage. Bytes 1-4: Throttling event count. Number of times thermal throttle has activated. Preserved over power cycles. Byte 5: Reserved. Normalized value: always 100. 99 1 Normalized Value 101 6 Current Raw Value

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 21

5.5 Temperature Statistics

Table 15: Temperature Statistics (Log Identifier C5h) Note: All temperature values indicate internal temperature sensor values. Add-in Card reports NAND temperature, 2.5-inch form factor reports case temperature.

5.6 SET Feature Identifiers

In addition to the SMART attribute structure, features pertaining to the operation and health of the Intel SSD 750 Series can be reported to the host on request through the Get Features command. Intel SSD 750 Series can change settings using SET Features on the following items as defined in NVMe 1.0 specification.  Arbitration (Feature Identifier 01h)  Power Management (Feature Identifier 02h)  Temperature Threshold (Feature Identifier 04h)  Error Recovery (Feature Identifier 05h)  Volatile Write Cache (Feature Identifier 06h)  Number of Queues (Feature Identifier 07h)  Interrupt Coalescing (Feature Identifier 08h)  Interrupt Vector Configuration (Feature Identifier 09h)  Write Atomicity (Feature Identifier 0Ah)  Asynchronous Event Configuration (Feature Identifier 0Bh) Intel SSD 750 Series will also support the following vendor unique SET Features.  Set/Get Max LBA (Feature Identifier C1h)  Set/Get Native Max LBA (Feature Identifier C2h)  Power Governor Setting (Feature Identifier C6h)  Reset Timed Workload Counters (Feature Identifier D5h) Byte # of Bytes Description 0 1 Current Temperature 24 8 Highest temperature 32 8 Lowest temperature 80 8 Specified Maximum Operating Temperature 96 8 Specified Minimum Operating Temperature

Intel® Solid State Drive 750 Series Product Specification October 2015 22 332059-004US Table 16: Set Max LBA Setting - Command Dword 11 and Command Dword 12 Bit Description 63:00 Maximum User LBA: Write Usage: This field sets the 64-bit maximum LBA addressable by the Drive. Read Usage: This field contains the 64-bit maximum LBA addressable by the Drive. Command Dword 11 contains bits 31:00; Command Dword 12 contains bits 63: 32. Table 17: Status Code - Set Max LBA Command Specific Status Values Value Description C0h Requested MAX LBA exceeds Available capacity C1h Requested MAX LBA smaller than minimum allowable limit. C2h Requested MAX LBA is smaller than allocated Namespace requirements Table 18: D5h - Reset Timed Workload Counters - Command Dword 11 Bit Description 31:01 Reserved

00 Timed Workload Reset Settings: Write Usage: 00 = NOP, 1 = Reset E2, E3,E4 counters; Read

Usage: Not Supported Note: Get Features will not work for “Reset Timed Workload Counters” and status code is same as Table 21.

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 23

6 NVMe Driver Support

The following table describes the NVMe Driver Support for Intel SSD 750 Series. The support includes releasing and validating NVMe drivers for certain operating systems and validating functionality for open source drive, inbox or native drivers for select operating systems. Table 19: NVMe Driver Support Support Level Operating System Description Intel Provided1 Windows 7* 64 bit, Windows 8* 64 bit, Windows 8.1* 64 bit, Windows 10* 64 bit Other Driver2 Window 7* 64 bit, Windows 8* 64 bit, Windows 8.1* 64 bit, Windows 10* 64 bit, Ubuntu 14.05, Ubuntu 15.05, Linux Kernel 3.10 or later NOTES: 1. With Intel provided driver, full product specification is provided and recommended. 2. With open source non-Intel driver, compatibility and functionality are validated.

Intel® Solid State Drive 750 Series Product Specification October 2015 24 332059-004US

7 Certifications and Declarations

Table 20: Device Certifications and Declarations Certification Description CE Compliant European Economic Area (EEA): Compliance with the essential requirements of EC Council Directives Low Voltage Directive (LVD) 2006/95/EC, EMC Directive 2004/108/EC and Directive 2011/65/EU. UL Recognized Certified Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements) CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety - Part 1: General Requirements) C-Tick Compliant Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA). BSMI Compliant Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is harmonized with CISPR 22: 2005.04. KCC Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea. VCCI Voluntary Control Council for Interface to cope with disturbance problems caused by personal computers or facsimile. Microsoft WHCK Microsoft Windows Hardware Certification Kit RoHS Compliant Restriction of Hazardous Substance Directive WEEE Directive on Waste Electrical and Electronic Equipment

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 25 Appendix A IDENTIFY Data Structure Table 21: Identify Controller Bytes F = Fixed V = Variable X = Both Default Value Interpretation Description 1-0 F 8086h Contains the company vendor identifier that is assigned by the PCI SIG PCI Vendor ID (VID) 3-2 F 8086h Contains the company vendor identifier that is assigned by the PCI SIG for subsystem PCI Subsystem Vendor ID (SSVID) 23-4 V varies Contains the serial number for the NVM subsystem Serial Number (SN) 63-24 V varies Contains the serial number for the NVM subsystem that is assigned by the vendor as an ASCII string Model Number (MN) 71-64 V varies Contains the currently active firmware revision for the NVM subsystem Firmware Revision (FR)

72 F 0h Recommended Arbitration Burst size equals 1 Recommended Arbitration Burst (RAB)

75-73 F 5CD2E4h Contains the Organization Unique Identifier (OUI) for the controller vendor IEEE OUI Identifier (IEEE)

76 X 0h No of multiple PCI Express interfaces connected to

the host, bit 0 determines multiple interface Multi-Interface Capabilities (MIC)

77 F 05h Supports MDTS of 128K Maximum Data Transfer Size (MDTS)

255:78 Reserved 257-256 F 07h Supports Security Send/Receive, Format NVM and Firmware Activate/Download Optional Admin Command Support (OACS)

258 F 03h Supports up to 3 concurrently outstanding abort

commands Abort Command Limit (ACL)

259 F 03h Supports up to 3 concurrently outstanding

asynchronous event requests Asynchronous Event Request Limit (AERL)

260 X 03h Single slot

Read/write capable Firmware Updates (FRMW)

261 X 0h SMART/Health Log Support per drive not per

namespace Log Page Attributes (LPA)

262 F 3Fh Number of Error Information log entries equals

64 Error Log Page Entries (ELPE)

263 F 0h Number of NVM Express power states equal 1 Number of Power States Support (NPSS)

264 F 0h Configuration settings for Admin Vendor

Admin Vendor Specific Command Configuration (AVSCC) 511-265 Reserved

512 F 66h Required and max submission queue entry size

is 64 Byte Submission Queue Entry Size (SQES)

513 F 44h Required and max submission queue entry size

is 16 Byte Completion Queue Entry Size (CQES)

Intel® Solid State Drive 750 Series Product Specification October 2015 26 332059-004US Bytes F = Fixed V = Variable X = Both Default Value Interpretation Description 515-514 Reserved 519-516 F 01h Supports single namespace Number of Namespaces (NN) 521-520 F 06h Supports Dataset Management and Write Uncorrectable optional NVMe commands. Optional NVMe Command Support (ONCS) 523-522 F 0h Fused commands not supported Fused Operation Support (FUSES)

524 F 07h Supports Crypto Erase and format of entire

drive, not per namespace Format NVM Attributes (FNA):

525 F 0h Volatile write cache is not present Volatile Write Cache (VWC)

527-526 F 0h Atomic write size for controller during normal equals to 512B Atomic Write Unit Normal (AWUN) 529-528 F 0h Indicates the atomic write size for the controller during a power fail condition equals 512B Atomic Write Unit Power Fail (AWUPF)

530 X 0h Not Supported NVM Vendor Specific Command

Configuration (NVSCC) 703-531 Reserved 2047-704 Reserved 2079-2048 V Indicates the characteristics of power state 0 Power State 0 Descriptor (PSD0) 2111-2080 V Indicates the characteristics of power state 1 Power State 1 Descriptor (PSD1) 2143-2112 V Indicates the characteristics of power state 2 Power State 2 Descriptor (PSD2) 2175-2144 V Indicates the characteristics of power state 3 Power State 3 Descriptor (PSD3) 2207-2176 V Indicates the characteristics of power state 4 Power State 4 Descriptor (PSD4) 2239-2208 V Indicates the characteristics of power state 5 Power State 5 Descriptor (PSD5) 2271-2240 V Indicates the characteristics of power state 6 Power State 6 Descriptor (PSD6) 2303-2272 V Indicates the characteristics of power state 7 Power State 7 Descriptor (PSD7) 2335-2304 V Indicates the characteristics of power state 8 Power State 8 Descriptor (PSD8) 2367-2336 V Indicates the characteristics of power state 9 Power State 9 Descriptor (PSD9) 2399-2368 V Indicates the characteristics of power state 10 Power State 10 Descriptor (PSD10) 2431-2400 V Indicates the characteristics of power state 11 Power State 11 Descriptor (PSD11) 2463-2432 V Indicates the characteristics of power state 12 Power State 12 Descriptor (PSD12) 2495-2464 V Indicates the characteristics of power state 13 Power State 13 Descriptor (PSD13) 2527-2496 V Indicates the characteristics of power state 14 Power State 14 Descriptor (PSD14) 2559-2528 V Indicates the characteristics of power state 15 Power State 15 Descriptor (PSD15) 2591-2560 V Indicates the characteristics of power state 16 Power State 16 Descriptor (PSD16)

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 27 Bytes F = Fixed V = Variable X = Both Default Value Interpretation Description 2623-2592 V Indicates the characteristics of power state 17 Power State 17 Descriptor (PSD17) 2655-2624 V Indicates the characteristics of power state 18 Power State 18 Descriptor (PSD18) 2687-2656 V Indicates the characteristics of power state 19 Power State 19 Descriptor (PSD19) 2719-2688 V Indicates the characteristics of power state 20 Power State 20 Descriptor (PSD20) 2751-2720 V Indicates the characteristics of power state 21 Power State 21 Descriptor (PSD21) 2783-2752 V Indicates the characteristics of power state 22 Power State 22 Descriptor (PSD22) 2815-2784 V Indicates the characteristics of power state 23 Power State 23 Descriptor (PSD23) 2847-2816 V Indicates the characteristics of power state 24 Power State 24 Descriptor (PSD24) 2879-2848 V Indicates the characteristics of power state 25 Power State 25 Descriptor (PSD25) 2911-2880 V Indicates the characteristics of power state 26 Power State 26 Descriptor (PSD26) 2943-2912 V Indicates the characteristics of power state 27 Power State 27 Descriptor (PSD27) 2975-2944 V Indicates the characteristics of power state 28 Power State 28 Descriptor (PSD28) 3007-2976 V Indicates the characteristics of power state 29 Power State 29 Descriptor (PSD29) 3039-3008 V Indicates the characteristics of power state 30 Power State 30 Descriptor (PSD30) 3071-3040 V Indicates the characteristics of power state 31 Power State 31 Descriptor (PSD31)

3075 F 05h Data striped at 128 KB, value shown is reported

as 2^ (CAP.MPSMIN) Internal stripe size 3095-3076 V Varies Shows healthy status or error code Health indicator 3096 V Varies Reads current negotiated PCIe link speed, as reported by PXLS register (PXCAP + 12h), bits[3:0] Current PCIe Link Speed field (CLS) 3097 V Varies Reads current negotiated PCIe Link Width as reported by PXLS register (PXCAP + 12h), bits[9:4] Negotiated Link Width (NLW) 4095-3098 V NA Range of bytes is allocated for vendor specific usage Vendor Specific (VS) NOTES: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.

Intel® Solid State Drive 750 Series Product Specification October 2015 28 332059-004US Table 22: Power State Descriptor Bytes F = Fixed V = Variable X = Both Default Value Interpretation Description 255-125 Reserved 124-120 F 0h Indicates the relative write latency associated with this power state Relative Write Latency (RWL) 119-117 Reserved 116-112 F 0h Indicates the relative write throughput associated with this power state Relative Write Throughput (RWT) 111-109 Reserved 108-104 F 0h Indicates the relative read latency associated with this power state Relative Read Latency (RRL) 103-101 Reserved 100-96 F 0h Indicates the relative read throughput associated with this power state. Relative Read Throughput (RRT) 95-64 F 0h Indicates the maximum exit latency in microseconds associated with exiting this power state. Exit Latency (EXLAT) 63-32 F 0h Indicates the maximum entry latency in microseconds associated with entering this power state Entry Latency (ENLAT) 31-16 Reserved 15-00 F 09C4h Indicates the maximum power consumed by the NVM subsystem in this power state. The power in Watts is equal to the value in this field multiplied by 0.01 Maximum Power (MP)

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 29 Table 23: Identify Namespace Bytes F = Fixed V = Variable X = Both Default Value Interpretation Description 7-0 V varies Indicates the total size of the namespace in logical blocks. Namespace Size (NSZE) 15-8 V varies Indicates the maximum number of logical blocks that may be allocated in the namespace at any point in time Namespace Capacity (NCAP) 23-16 V varies Indicates the current number of logical blocks allocated in the namespace Namespace Utilization (NUSE)

24 F 00h Indicates thin provisioning is not

supported Namespace Features (NSFEAT)

25 F 06h

Defines the number of supported LBA size and metadata size combinations supported by the namespace Number of LBA Formats (NLBAF)

26 V 00h

Indicates metadata transferred with the extended data LBA or in separate buffer Formatted LBA Size (FLBAS)

27 F 03h

Indicates support for metadata transferred with the extended data LBA and in separate buffer – both are supported Metadata Capabilities (MC)

28 V 11h Indicates PI supports Type 1,2,3 with PI

transferred as the first 8 bytes End-to-end Data Protection Capabilities (DPC)

29 X 00h Indicates type settings for the

namespace End-to-end Data Protection Type Settings (DPS) 127-30 Reserved 131-128 V MS:0, LBADS:9, RP:2 Indicates the LBA format 0 that is supported by the controller LBA Format 0 Support (LBAF0) 135-132 V MS:8, LBADS:9, RP:2 Indicates the LBA format 1 that is supported by the controller LBA Format 1 Support (LBAF1) 139-136 V MS:16, LBADS:9, RP:2 Indicates the LBA format 2 that is supported by the controller LBA Format 2 Support (LBAF2) 143-140 V MS:0, LBADS:12, RP:0 Indicates the LBA format 3 that is supported by the controller LBA Format 3 Support (LBAF3) 147-144 V MS:8, LBADS:12, RP:0 Indicates the LBA format 4 that is supported by the controller LBA Format 4 Support (LBAF4) 151-148 V MS:64, LBADS:12, RP:0 Indicates the LBA format 5 that is supported by the controller LBA Format 5 Support (LBAF5) 155-152 V MS:128, LBADS:12, RP:0 Indicates the LBA format 6 that is supported by the controller LBA Format 6 Support (LBAF6) 159-156 Not supported Indicates the LBA format 7 that is supported by the controller LBA Format 7 Support (LBAF7) 163-160 Not supported Indicates the LBA format 8 that is supported by the controller LBA Format 8 Support (LBAF8) 167-164 Not supported Indicates the LBA format 9 that is supported by the controller LBA Format 9 Support (LBAF9) 171-168 Not supported Indicates the LBA format 10 that is supported by the controller LBA Format 10 Support (LBAF10)

Intel® Solid State Drive 750 Series Product Specification October 2015 30 332059-004US Bytes F = Fixed V = Variable X = Both Default Value Interpretation Description 175-172 Not supported Indicates the LBA format 11 that is supported by the controller LBA Format 11 Support (LBAF11) 179-176 Not supported Indicates the LBA format 12 that is supported by the controller LBA Format 12 Support (LBAF12) 183-180 Not supported Indicates the LBA format 13 that is supported by the controller LBA Format 13 Support (LBAF13) 187-184 Not supported Indicates the LBA format 14 that is supported by the controller LBA Format 14 Support (LBAF14) 191-188 Not supported Indicates the LBA format 15 that is supported by the controller LBA Format 15 Support (LBAF15) 383-192 Not supported Reserved 4095-384 Not supported Range of bytes is allocated for vendor specific usage Vendor Specific (VS) NOTES: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable. Table 24: LBA Format Data Structure Bytes F = Fixed V = Variable X = Both Default Value Interpretation Description 31-26 Reserved 25-24 V Varies (2,0) Relative Performance ranging from “best” to “degraded” Relative Performance (RP) 23-16 V Varies (9 and 12) Indicates the LBA data size supported. The value is reported in terms of a power of two (2^n) LBA Data Size (LBADS) 15-00 V Varies (0, 8, 16,64, 128) Indicates the number of metadata bytes provided per LBA based on the LBA Data Size indicated. Metadata Size (MS) NOTES: F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 31 Appendix B PCIe ID Table 25: PCIe ID ID name Description Add-in Card 2.5-inc FF PCIe Register Location Identify Controller Location Vital Product Data Location Vendor ID (VID) Vendor ID assigned by PCI- SIG 0x8086 0x8086 PCI Header Offset 00h (bits 15:00) Bytes 01:00h Address 3, (size 2B) Device ID (DID) Device ID assigned by vendor 0x0953 0x0953 PCI Header Offset 00h (bits 31:16) NA NA Subsystem Vendor ID Indicates Sub- system vendor ID 0x8086 0x8086 PCI Header Offset 2Ch (bits 15:00) Bytes 03:02h NA Subsystem ID Sub-system identifier 0x3704 0x3705 PCI Header Offset 2Ch (bits 31:16) NA NA

Intel® Solid State Drive 750 Series Product Specification October 2015 32 332059-004US Appendix C SCSI Command Translation Following SCSI commands are supported:  Read 6,10,12,16  Inquiry  Mode Sense 6,10  Mode Select 6.10  Log Sense  Read Capacity 10,16  Report LUNs  Request Sense  Start Stop Unit  Test Unit Ready  Write Buffer  Unmap NOTES: Refer to NVM Express: SCSI Translation Reference doc under nvmexpress.org

Intel® Solid State Drive 750 Series October 2015 Product Specification 332059-004US 33 Appendix D Add-in Card LED Decoder Table 26: LED Functionality LED Description Blink Behavior LED 1 ( Amber) Shows IO activity Blinks at the rate of 250msec high, 250msec low with IO activity LED 2 (Red) Drive fail indicator Solid red if drive is in disabled logical mode LED 3 (Yellow) Drive pre-fail indicator Solid yellow if any of the critical warnings in log page 0x02 is triggered LED 4 (Green) Drive health indicator Solid green when drive is healthy Figure A-1 LED Location Note: 2.5-inch Form Factor does not contain LEDs.