TN805-800H

TS820-600B KERSEMI | Alldatasheet

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Technical content

TN8, TS8 and TYNx08 Series 8A SCRs MAIN FEATURES:

DESCRIPTION

Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the 8A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits... Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area. Symbol Value Unit I T(RMS) V DRM RRM 600 to 1000 V I GT 0.2 to 15 mA ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit I T(RMS) RMS on-state current (180° conduction angle) Tc = 110°C 8 A IT (AV) Average on-state current (180° conduction angle) Tc = 110°C 5 A TS8/TN8 TYN I TSM Non repetitive surge peak on-state current tp = 8.3 ms Tj = 25°C 73 100 A tp = 10 ms 70 95 I tI t Value for fusing tp = 10 ms Tj = 25°C 24.5 45 A S dI/dt Critical rate of rise of on-state current I G = 2 x I GT , tr ≤ 100 ns F = 60 Hz Tj = 125°C 50 A/µs I GM Peak gate current tp = 20 µs Tj = 125°C 4 A P G(AV) Average gate power dissipation Tj = 125°C 1 W T stg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C V RGM Maximum peak reverse gate voltage (for TN8 & TYN only) 5 V A K G A GAK DPAK (TS8-B) (TN8-B) A AK G IPAK (TS8-H) (TN8-H) A AK G G A A K TO-220AB (TS8-T) TO-220AB (TYNx) www.kersemi.com

TN8, TS8 and TYNx08 Series ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) n SENSITIVE n STANDARD THERMAL RESISTANCES S= copper surface under tab Symbol Test Conditions TS820 Unit I GT V D = 12 V R L = 140 Ω MAX. 200 µA V GT MAX. 0.8 V V GD V D = V DRM R L = 3.3 kΩ R GK = 220 Ω Tj = 125°C MIN. 0.1 V V RG I RG = 10 µA MIN. 8V I H I T = 50 mA R GK = 1 kΩ MAX. 5 mA I L I G = 1 mA R GK = 1 kΩ MAX. 6 mA dV/dt V D = 65 % V DRM R GK = 220 Ω Tj = 125°C MIN. 5 V/µs V TM I TM = 16 A tp = 380 µs Tj = 25°C MAX. 1.6 V V Threshold voltage Tj = 125°C MAX. 0.85 V R d Dynamic resistance Tj = 125°C MAX. 46 m Ω I DRM I RRM V DRM = V RRM R GK = 220 Ω Tj = 25°C MAX. 5 µA Tj = 125°C 1 mA Symbol Test Conditions TN805 TN815 TYNx08 Unit I GT V D = 12 V R L = 33 Ω MIN. 0.5 2 2 mA MAX. 5 15 15 V GT MAX. 1.3 V V GD V D = V DRM R L = 3.3 kΩ Tj = 125°C MIN. 0.2 V I H I T = 100 mA Gate open MAX. 25 40 30 mA I L I G = 1.2 I GT MAX. 30 50 70 mA dV/dt V D = 67 % V DRM Gate open Tj = 125°C MIN. 50 150 150 V/µs V TM I TM = 16 A tp = 380 µs Tj = 25°C MAX. 1.6 V V Threshold voltage Tj = 125°C MAX. 0.85 V R d Dynamic resistance Tj = 125°C MAX. 46 m Ω I DRM I RRM V DRM = V RRM Tj = 25°C MAX. 5 µA Tj = 125°C 2 mA Symbol Parameter Value Unit R th(j-c) Junction to case (DC) 20 °C/W R th(j-a) Junction to ambient (DC) TO-220AB 60 °C/W IPAK 100 S = 0.5 cm DPAK 70 www.kersemi.com

TN8, TS8 and TYNx08 Series PRODUCT SELECTOR

ORDERING INFORMATION

Voltage (xxx) Sensitivity Package

600 V 700 V 800 V 1000 V

TS820-xxxB X X 0.2 mA DPAK TS820-xxxH X X 0.2 mA IPAK TS820-xxxT X X 0.2 mA TO-220AB TYNx08 X X X 15 mA TO-220AB TN 8 05 - 600 B (-TR) STANDARD SCR SERIES CURRENT: 8A SENSITIVITY: 05: 5mA 15: 15mA VOLTAGE: 600: 600V 800: 800V PACKAGE: B: DPAK H: IPAK PACKING MODE: Blank: Tube -TR: DPAK Tape & Reel TS 8 20 - 600 B (-TR) SENSITIVE SCR SERIES CURRENT: 8A SENSITIVITY: 20: 200µA VOLTAGE: 600: 600V 700: 700V PACKAGE: B: DPAK H: IPAK T: TO-220AB PACKING MODE: Blank: Tube -TR: DPAK Tape & Reel VOLTAGE: 6: 600V 8: 800V 10: 1000V STANDARD SCR SERIES CURRENT: 8A TYN 6 08 (RG) PACKING MODE Blank: Bulk RG: Tube www.kersemi.com

TN8, TS8 and TYNx08 Series OTHER INFORMATION Note: x = voltage Part Number Marking Weight Base Quantity Packing mode TN805-x00B TN805x00 0.3 g 75 T ube TN805-x00B-TR TN805x00 0.3 g 2500 Tape & reel TN805-x00H TN805x00 0.4 g 75 T ube TN815-x00B TN815x00 0.3 g 75 T ube TN815-x00B-TR TN815x00 0.3 g 2500 Tape & reel TN815-x00H TN815x00 0.4 g 75 T ube TS820-x00B TS820x00 0.3 g 75 T ube TS820-x00B-TR TS820x00 0.3 g 2500 Tape & reel TS820-x00H TS820x00 0.4 g 75 T ube TS820-x00T TS820x00T 2.3 g 50 T ube TYNx08 TYNx08 2.3 g 250 Bulk TYNx08RG TYNx08 2.3 g 50 T ube Fig. 1: Maximum average power dissipation versus average on-state current. Fig. 2-1: Average and D.C. on-state current versus case temperature. Fig. 2-2: Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK). Fig. 3-1: Relative variation of thermal impedance junction to case versus pulse duration. 0123456 P(W) a = 180° IT(av)(A) 360° a 0 25 50 75 100 125 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 IT(av)(A) DC a = 180° Tcase(°C) 0 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IT(av)(A) a =180° DC Tamb( °C) 1E-3 1E-2 1E-1 1E+0 0.1 0.2 0.5 1.0 K = [Zth(j-c)/Rth(j-c)] tp(s) www.kersemi.com

TN8, TS8 and TYNx08 Series Fig. 3-2: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK). Fig. 4-1: Relative variation of gate trigger current and holding current versus junction temperature for TS8 series. Fig. 4-2: Relative variation of gate trigger current and holding current versus junction temperature for TN8 & TYN series. Fig. 5: Relative variation of holding current versus gate-cathode resistance (typical values) for TS8 series. Fig. 6: Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) for TS8 series. Fig. 7: Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values) for TS8 series. 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.01 0.10 1.00 K = [Zth(j-a)/Rth(j-a)] DPAK TO-220AB tp(s) -40 -20 0 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25 °C] IGT IH & IL Rgk = 1kW Tj(°C) -40 -20 0 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25 °C] IGT IH & IL Tj(°C) IH[Rgk] / IH[Rgk = 1k ]Ω Rgk(k )Ω Rgk(k )Ω dV/dt[Rgk] / dV/dt [Rgk = 220 ]Ω 0 20 40 60 80 100 120 140 160 180 200 220 0.0 2.5 5.0 7.5 10.0 12.5 15.0 VD = 0.67 x VDRM Tj = 125°C Rgk = 220W dV/dt[Cgk] / dV/dt [Rgk = 220W ] Cgk(nF) www.kersemi.com

TN8, TS8 and TYNx08 Series Fig. 8: Surge peak on-state current versus number of cycles. TS8/TN8/TYN. Fig. 9: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I²t. Fig. 10: On-state characteristics (maximum values). Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) (DPAK). 1 10 100 1000 100 ITSM(A) TYN TS8/TN8 Non repetitiv e Tj initial = 25 °C Repetitive Tcase = 110 °C Number of cycles One cycle tp = 10ms 0.01 0.10 1.00 10.0 100 1000 ITSM(A),I t(A Tj initial = 25°C ITSM I t dI/dt limitattion TYN TS8/TN8 TYN TS8/TN8 tp(ms) 0.1 1.0 10.0 50.0 ITM(A) Tj max.: Vto = 0.85V Rd = 46mW Tj = Tj max. Tj = 25°C VTM(V) 02468 1 0 1 2 1 4 1 6 1 8 2 0 100 Rth(j-a) ( °C/W) S(cm www.kersemi.com

TN8, TS8 and TYNx08 Series PACKAGE MECHANICAL DATA DPAK (Plastic) REF . DIMENSIONS Millimeters Inches Min. Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 R 0.2 typ. 0.007 typ. V2 0° 8° 0° 8° R R FOOTPRINT DIMENSIONS (in millimeters) DPAK (Plastic) 6.7 6.7 1.61.6 2.32.3 www.kersemi.com

TN8, TS8 and TYNx08 Series PACKAGE MECHANICAL DATA IPAK (Plastic) TO-220AB (Plastic - with notches) REF . DIMENSIONS Millimeters Inches A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.035 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.035 B6 0.95 0.037 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 E 6.4 6.6 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 V1 10° 10° H L L1 G B D C A B3B6 E REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 L2 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. A C D Dia F G E M www.kersemi.com

TN8, TS8 and TYNx08 Series PACKAGE MECHANICAL DATA TO-220AB (Without notches) REF . DIMENSIONS Millimeters Inches A 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 I 3.75 3.85 0.147 0.151 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 M 2.60 0.102 M B C A F L I e www.kersemi.com