TN4035-600G KERSEMI | Alldatasheet

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The TN4035-600G is designed for applications where in-rush current conditions are critical, such as overvoltage crowbar protection circuits in power supplies. Using clip assembly technology, provides higher fusing threshold than wires. Mounting precautions detailled in application note AN533 on www.st.com. Symbol Value Unit I T(RMS) 40 A V DRM RRM 600 V I GT 35 mA G A K A A G K D PAK ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit I T(RMS) RMS on-state current (180° conduction angle) Tc = 95°C 40 A IT (AV) Average on-state current (180° conduction angle) Tc = 95°C 25 A I TSM Non repetitive surge peak on-state current tp = 8.3 ms Tj = 25°C 480 A tp = 10 ms 460 I tI t Value for fusing Tj = 25°C 1060 A S dI/dt Critical rate of rise of on-state current I G = 2 x I GT , tr ≤ 100 ns F = 60 Hz Tj = 125°C 50 A/µs I GM Peak gate current tp = 20 µs Tj = 125°C 4 A P G(AV) Average gate power dissipation Tj = 125°C 1 W T stg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C V RGM Maximum peak reverse gate voltage 5 V www.kersemi.com

ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) THERMAL RESISTANCES * Surface under tab/Epoxy printed circuit board FR4, copper thickness 85µm

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Epoxy meets UL94, V0 Symbol Test Conditions Value Unit I GT V D = 12 V R L = 33 Ω MIN. 3.5 mA MAX. 35 V GT MAX. 1.3 V V GD V D = V DRM R L = 3.3 kΩ Tj = 125°C MIN. 0.2 V I H I T = 500 mA Gate open MAX. 75 mA I L I G = 1.2 I GT MAX. 150 mA dV/dt V D = 67 % V DRM Gate open Tj = 125°C MIN. 1000 V/µs V TM I TM = 80 A tp = 380 µs Tj = 25°C MAX. 1.6 V V Threshold voltage Tj = 125°C MAX. 0.85 V R d Dynamic resistance Tj = 125°C MAX. 10 m Ω I DRM I RRM V DRM = V RRM Tj = 25°C MAX. 5 µA Tj = 125°C 4 mA Symbol Parameter Value Unit R th(j-c) Junction to case (DC) 0.8 °C/W R th(j-a) Junction to ambient (DC) S = 1cm (*) 45 °C/W Part Number Marking Weight Base Quantity Packing mode TN4035-600G TN4035-600G 1.5 g 50 T ube TN4035-600G-TR TN4035-600G 1.5 g 1000 Tape & Reel TN 40 35 - 600 G (-TR) CURRENT: 40A VOLTAGE: 600: 600V STANDARD SCR SERIES SENSITIVITY: 35: 35mA PACKAGE: G: D PAK PACKING MODE: Blank: Tube -TR: Tape & Reel www.kersemi.com

Fig. 1: Maximum average power dissipation versus average on-state current. Fig. 2: Average and DC on-state current versus case temperature. Fig. 3: Relative variation of thermal impedance versus pulse duration. Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature. Fig. 5: Surge peak on-state current versus number of cycles. Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding value of I²t. 0 5 10 15 20 25 30 P(W) α = 180° IT(av)(A) 360° α 0 25 50 75 100 125 IT(av)(A) D.C. α = 180° Tcase(°C) 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.01 0.10 1.00 K = [Zth/Rth] Zth(j-c) Zth(j-a) tp(s) -40 -20 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25°C] IGT IH & IL Tj(°C) 1 10 100 1000 100 150 200 250 300 350 400 450 500 ITSM(A) Non repetitive Tj initial = 25 °C Repetitive Tcase = 95 °C Number of cycles One cycle tp = 10ms 0.01 0.10 1.00 10.00 100 1000 5000 ITSM(A),I t(A Tj initial = 25 °C ITSM I t dI/dt limitattion tp(ms) www.kersemi.com

Fig. 7: On-state characteristics (maximum values). Fig. 8: Thermal resistance junction to ambient versus surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) 100 500 ITM(A) Tj = 25°C Tj = Tj max. Tj max.: Vto = 0.85V Rd = 10mΩ VTM(V) 0 1 02 03 04 05 0 Rth(j-a) (°C/W) S(cm²) www.kersemi.com

D P AK JEDEC REFERENCE: TO-263 REF. DIMENSIONS Millimeters Inches A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 1.40 0.048 0.055 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 R 0.40 0.016 V2 0° 8° 0° 8° A D R 2.0 MIN. FLAT ZONE C G L B E FOOTPRINT DIMENSIONS (in millimeters) D PAK (Plastic) 8.90 3.70 1.30 5.08 16.90 10.30 www.kersemi.com