TN1625-600G KERSEMI | Alldatasheet

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The TYN / TN16 SCR Series is suitable for general purpose applications. Using clip assembly technology, they provide a superior performance in surge current capabilities. Symbol Value Unit I T(RMS) 16 A V DRM RRM 600 to 1000 V I GT 25 mA ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit I T(RMS) RMS on-state current (180° conduction angle) Tc = 110°C 16 A T (AV) Average on-state current (180° conduction angle) Tc = 110°C 10 A I TSM Non repetitive surge peak on-state current tp = 8.3 ms Tj = 25°C 200 A tp = 10 ms 190 I tI t Value for fusing tp = 10 ms Tj = 25°C 180 A S dI/dt Critical rate of rise of on-state current I G = 2 x I GT , tr ≤ 100 ns F = 60 Hz Tj = 125°C 50 A/µs I GM Peak gate current tp = 20 µs Tj = 125°C 4 A P G(AV) Average gate power dissipation Tj = 125°C 1 W T stg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C V RGM Maximum peak reverse gate voltage 5 V A K G A A G K G A A K D PAK (TN16-G) TO-220AB (TYN) www.kersemi.com

ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) THERMAL RESISTANCES S = Copper surface under tab PRODUCT SELECTOR Symbol Test Conditions Value Unit I GT V D = 12 V R L = 33 Ω MIN. 2 mA MAX. 25 V GT MAX. 1.3 V V GD V D = V DRM R L = 3.3 kΩ Tj = 125°C MIN. 0.2 V I H I T = 500 mA Gate open MAX. 40 mA I L I G = 1.2 x I GT MAX. 60 mA dV/dt V D = 67 % V DRM Gate open Tj = 125°C MIN. 500 V/µs V TM I TM = 32 A tp = 380 µs Tj = 25°C MAX. 1.6 V V Threshold voltage Tj = 125°C MAX. 0.77 V R d Dynamic resistance Tj = 125°C MAX. 23 m Ω I DRM I RRM V DRM = V RRM Tj = 25°C MAX. 5 µA Tj = 125°C 2 mA Symbol Parameter Value Unit R th(j-c) Junction to case (DC) 1.1 °C/W R th(j-a) Junction to ambient (DC) TO-220AB 60 °C/W S = 1 cm D PAK 45 Part Number Voltage (xxx) Sensitivity Package

600 V 800 V 1000 V

TYNx16 X X X 25 mA TO-220AB www.kersemi.com

ORDERING INFORMATION

TN 16 25 - 600 G (-TR) STANDARD SCR SERIES CURRENT: 16A SENSITIVITY: 25: 25mA VOLTAGE: 600: 600V 800: 800V 1000: 1000V PACKAGE: G: D PAK PACKING MODE: Blank: Tube -TR: Tape & Reel TYN 6 16 (RG) STANDARD SCR SERIES CURRENT: 16A VOLTAGE: 6: 600V 8: 800V 10: 1000V PACKING MODE Blank: Bulk RG: Tube OTHER INFORMATION Note: x = voltage Part Number Marking Weight Base Quantity Packing mode TN1625-x00G TN1625x00G 1.5 g 50 Tube TN1625-x00G-TR TN1625x00G 1.5 g 1000 Tape & reel TYNx16 TYNx16 2.3 g 250 Bulk TYNx16RG TYNx16 2.3 g 50 Tube www.kersemi.com

Fig. 1: Maximum average power dissipation versus average on-state current. Fig. 2-1: Average and D.C. on-state current versus case temperature. Fig. 2-2: Average and D.C. on-state current versus ambient temperature (copper surface under tab: S = 1 cm² (for D²P AK). Fig. 3: Relative variation of thermal impedance versus pulse duration. Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature. Fig. 5: Surge peak on-state current versus number of cycles. 02468 1 0 1 2 P(W) a = 180° IT(av)(A) 360° a 0 25 50 75 100 125 IT(av)(A) D.C. a =180° Tcase(°C) 0 25 50 75 100 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 IT(av)(A) D.C. a = 180° Tamb( °C) 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.01 0.10 1.00 K = [Zth/Rth] Zth(j-c) Zth(j-a) tp(s) -40 -20 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 IGT,IH,IL [Tj] / IGR,IH,IL [Tj = 25 °C] IGT IH & IL Tj(°C) 1 10 100 100 100 120 140 160 180 200 ITSM(A) Non repetitiv e Tj initial = 25 °C Repetitive Tcase = 110 °C Number of cycles One cycle tp = 10ms www.kersemi.com

Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding value of I²t. Fig. 7: On-state characteristics (maximum values). Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) (for D²PAK). 0.01 0.10 1.00 10.00 100 1000 2000 ITSM(A),I t(A Tj initial = 25 °C ITSM I t dI/dt limitattion tp(ms) 100 200 ITM(A) Tj = 25°C Tj = Tjmax. Tj max.: Vto = 0.77V Rd = 23mW VTM(V) 0 4 8 1 21 62 02 42 83 23 64 0 Rth(j-a) ( °C/W) S (cm www.kersemi.com

D²PAK (Plastic) REF . DIMENSIONS Millimeters Inches A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 1.40 0.048 0.055 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 R 0.40 0.016 V2 0° 8° 0° 8° A D R 2.0 MIN. FLAT ZONE C G L B E FOOTPRINT DIMENSIONS (in millimeters) D²PAK (Plastic) 8.90 3.70 1.30 5.08 16.90 10.30 www.kersemi.com

TO-220AB (Plastic) REF . DIMENSIONS Millimeters Inches A 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 I 3.75 3.85 0.147 0.151 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 M 2.60 0.102 M B C A F L I e www.kersemi.com