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50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 1 of 11 www.qorvo.com Key Features

  • Low Cost
  • Broadband Gain
  • Internally Matched
  • Internal Active Bias
  • No Dropping Resistor Required
  • Single Supply 5V Operation
  • HBM ESD Level >1000V Product Overview The RFGA2044 is a high performance InGaP HBT MMIC amplifier. The RFGA2044’s internal active bias circuitry allows the amplifier to operate directly from a 5V supply and provides stable current over temperature and process variations of the Beta. This Darlington amplifier is internally matched to 50Ω making it ideal for applications requiring small footprints and minimal external components.

Ordering Information

Part No. Description RFGA2044TR13 2,500 pieces on a 13” reel RFGA2044 PCK-410 500 – 3000 MHz Evaluation Board with a 5-piece sample bag Functional Block Diagram Top View

Applications

  • PA Driver Amplifier
  • LO Buffer Amplifier
  • Cellular, PCS, GSM, UMTS, LTE, TD_SCDMA
  • Wideband Instrumentation
  • Wireless Data, Satellite Terminals

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 2 of 11 www.qorvo.com Recommended Operating Conditions Parameter Min Typ Max Units Device Voltage (VCC) +5 +5.25 V TCASE −40 +85 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Absolute Maximum Ratings Parameter Rating Storage Temperature −55 to +150 °C Device Voltage (VCC) +6.0 V Device Current (ICC) 130 mA RF Input Power, CW, 2:1 Output VSWR +20 dBm RF Input Power, CW, 10:1 Output VSWR +15 dBm Junction Temperature (TJ) +150 °C Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Electrical Specifications Parameter Conditions (1) Min Typ Max Units Linear Operation Standard EVB circuit without R2 Input Power VCC < 5.0V, Load VSWR< 2:1, R2 Open 6.0 dBm Gain, Small Signal 850 MHz 15.3 dB 2140 MHz 13.5 15.1 16.5 dB 2650 MHz 15.1 dB Input Return Loss 2140 MHz 15.0 dB Output Return Loss 140 dB Output P1dB 850 MHz 19.0 dBm 2140 MHz 17.3 18.8 dBm 2650 MHz 18.2 dBm Output IP3 (2) 850 MHz 35.5 dBm 2140 MHz 28.0 30.5 dBm 2650 MHz 29.0 dBm Bandwidth Minimum 10 dB typical return loss 3000 MHz Reverse Isolation 2140 MHz 19.0 dB Noise Figure 4.3 dB Device Quiescent Current, ICQ Pin 3 68 78 mA Thermal Resistance, θjc Junction to case at quiescent state no RF 135 °C/W Saturated Operation With R2 5.1KΩ Pin 1 and GND lowering ICQ Input Power VCC < 5.0V, Load VSWR< 2:1, R2=5.1 KΩ 14 dBm Saturated Output Power 850 MHz 19.4 dBm 2140 MHz 19.8 dBm 2650 MHz 19.8 dBm Operating Current, ICC 90 mA Notes: 1. Test conditions unless otherwise noted: VCC = +5.0 V, Temp = +25 °C, 50 Ω test system 2. POUT = 0 dBm/tone, ∆f = 1 MHz

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 3 of 11 www.qorvo.com 500MHz to 3500 MHz Evaluation Board – RFGA2044PCK-410 Bill of Material – RFGA2044PCK-410 Reference Des. Value Description Manuf. Part Number PCB - Printed Circuit Board Qorvo - U1 - AMP, InGaP Darlington HBT, SOT-89 Qorvo RFGA2044 C1 1 μF CAP, 1 μF, 20%, 25V, TANT-A AVX TAJA105M025 C4, C6, C7 1000 pF CAP, 1000 pF, 10%, 50V, X7R, 0402 Taiyo Yuden RM UMK105BJ102KV-F C5 100 pF CAP, 100 pF, 5%, 50V. C0G, 0402 Taiyo Yuden RM UMK105CG101JV-F L1 82 nH IND, 82 nH, 10%, W/W, 0805 Coilcraft 0805CS-820XKBC J1, J2 - CONN, SMA, END LNCH, FLT, 0.062” Johnson 142-0701-821 P1 - CONN, HDR, ST, PLRZD, 2-Pin, 0.100” ITW Pancon MPSS100-2-C

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 4 of 11 www.qorvo.com Linear Operation Performance Plots – RFGA2044PCK-410 Test conditions unless otherwise noted: VCC = +5V, 50 Ω test system, Temp.=+25 °C

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 5 of 11 www.qorvo.com Linear Operation Performance Plots – RFGA2044PCK-410 (continued) Test conditions unless otherwise noted: VCC = +5V, 50 Ω test system, Temp.=+25 °C

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 6 of 11 www.qorvo.com Saturated Application Board and Schematic Additional resistor R2, 5.1KΩ, shunted to ground in between C6 and Pin 1 Saturated Performance Plots – with R2, 5.1KΩ Test conditions unless otherwise noted: VCC = +5V, 50 Ω test system, Temp.=+25 °C

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 7 of 11 www.qorvo.com Pad Configuration and Description Top View Pad No. Label Description 1 RFIN RF input. External DC Block capacitor required. 3 RFOUT / VCC RF output and DC Supply input. Device Collector, External DC Block capacitor required. 2, 4 Backside Paddle GND RF and DC ground. Use recommended via hole pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern for suggested footprint.

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 8 of 11 www.qorvo.com Package Marking and Dimensions Marking: Part Number – GA2044 Trace Code – Assigned by sub-contractor Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Via holes are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.01”). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 9 of 11 www.qorvo.com Tape and Reel Information – Carrier and Cover Tape Dimensions Feature Measure Symbol Size (in) Size (mm) Cavity Length A0 0.181 4.60 Width B0 0.193 4.90 Depth K0 0.075 1.90 Pitch P1 0.315 8.00 Centerline Distance Cavity to Perforation - Length Direction P2 0.079 2.00 Cavity to Perforation - Width Direction F 0.217 5.50 Cover Tape Width C 0.362 9.20 Carrier Tape Width W 0.472 12.0

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 10 of 11 www.qorvo.com Tape and Reel Information – Tape Length and Label Placement Notes: 1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A. 2. Labels are placed on the flange opposite the sprockets in the carrier tape. Tape and Reel Information – Reel Dimensions Standard T/R size = 2,500 pieces on a 13” reel. Feature Measure Symbol Size (in) Size (mm) Flange Diameter A 12.992 330.0 Thickness W2 0.717 18.2 Space Between Flange W1 0.504 12.8 Hub Outer Diameter N 4.016 102.0 Arbor Hole Diameter C 0.512 13.0 Key Slit Width B 0.079 2.0 Key Slit Diameter D 0.787 20.0

50MHz-3000MHz, InGap HBT MMIC Amplifier Datasheet, May 21, 2021 | Subject to change without notice 11 of 11 www.qorvo.com Handling Precautions Parameter Rating Standard Caution! ESD-Sensitive Device ESD – Human Body Model (HBM) Class 1C ESDA / JEDEC JS-001-2012 ESD – Charged Device Model (CDM) Class C3 ESDA / JEDEC JS-002-2012 MSL – Moisture Sensitivity Level Level 3 IPC/JEDEC J-STD-020 Solderability Solder profiles available upon request. Contact plating: NiPdAu RoHS Compliance This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electr ical and Electronic Equipment) as amended by Directive 2015/863/EU. This product also has the following attributes:

  • Lead Free
  • Halogen Free (Chlorine, Bromine)
  • Antimony Free
  • TBBP-A (C15H12Br402) Free
  • PFOS Free
  • SVHC Free Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information con tained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All informatio n contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anythin g described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2021 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-890-8163 Email: customer.support@qorvo.com Pb