RF5110GPCK-410

RF5110G QORVO | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 16

Technical content

3V General Purpose/GSM Power Amplifier Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 1 of 16 www.qorvo.com

16 Pad 3 x 3 mm QFN Package

General Purpose:

• Single 2.8 V to 3.6 V Supply
• +32 dBm Output Power
• 53% Efficiency
• 150 MHz to 960 MHz Operation GSM:
• Single 2.7 V to 4.8 V Supply
• +36 dBm Output Power at 3.6 V
• 32 dB Gain with Analog Gain Control
• 57% Efficiency
• 800 MHz to 950 MHz Operation
• Supports GSM and E-GSM Product Overview The RF5110G is a high -power, high -gain, high -efficiency power amplifier. The device is manufactured with an advanced GaAs HBT process. It is designed for use as the final RF amplifier in GSM hand-held equipment in 900 MHz band, and General-Purpose radio application in standard sub-bands from 150 MHz to 960 MHz. An analog on-board power controller provides over 70 dB range of adjustment. Which allows for power down w ith a voltage equals to the logic “Low” to set the device in standby mode. The RF5110G RF Input is internally matched to 50 Ω. On its RF Output, it can be easily matched externally to obtain optimum power and efficiency for certain applications.

Ordering Information

Part No. Description RF5110GTR7 2,500 pieces on a 7” reel (standard) RF5110GPCK-410 GSM900 Fully Tested Evaluation Board Functional Block Diagram Top View

Applications

• FM Radio Applications

150 MHz/220 MHz/450 MHz

865 MHz to 928 MHz

• 3 V GSM Cellular Handsets
• GPRS Compatible

3 V General Purpose/GSM Power Amplifier

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 2 of 16 www.qorvo.com Recommended Operating Conditions Parameter Min Typ Max Units Device Voltage (VCC, VCC1, VCC2) +3.5 +2.7 +4.8(1) V +5.5(1)(2) V TCASE −40 +85 °C TJ +150 °C Note: 1. POUT < +35 dBm 2. With maximum output load VSWR 6:1 Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Absolute Maximum Ratings Parameter Rating Storage Temperature −55 °C to +150 °C Device Voltage (VCC, VCC1, VCC2) -0.5 V to +6.0 V Control Voltage (VAPC1, VAPC2) -0.5 V to +3.0 V Device Current (ICC, ICC1, ICC2) 2400 mA RF Input Power +13 dBm Duty Cycle at Max Power 50% Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. This rating specified for GSM operation. Electrical Specifications Parameter Conditions (1) Min Typ Max Units Output Power

150 MHz

Gain 31.5 dB Efficiency 53 % Output Power

220 MHz

Efficiency 52 % Output Power 450 MHz; VCC, VCC1 and VCC2 = 3.0 V 32 dBm Gain 32.5 dB Efficiency 50.5 % Output Power Equals typical at respective frequency corner 32 dBm Gain 33.0 29.5 dB Efficiency 49 % Notes: 1. Test conditions unless otherwise noted: VAPC1 and VAPC2 = 2.8 V; VCC, VCC1 and VCC2 = 3.3 V; Duty Cycle = 100%; Temp = +25 °C; 50 Ω system; Refer to application circuits

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 3 of 16 www.qorvo.com Electrical Specifications (continue) Parameter Conditions (1) Min Typ Max Units Operational Frequency Range 880 915 MHz Usable Frequency Range Using different EVB tune 800 950 MHz Maximum Output Power 33.8 34.5 dBm Temp = +60 °C, VCC, VCC1 and VCC2 = 3.3 V 33.1 dBm Efficiency At Maximum Output Power 50 57 % POUT = +20 dBm 12 % POUT = +10 dBm 5 % Input Power for Max. Output 4.5 7.0 9.5 dBm Output Noise Power RBW = 100 KHz; 925-935 MHz; VCC, VCC1 and VCC2 = 3.3 to 5.0V -72 dBm RBW =100 KHz; 935-960 MHz; VCC, VCC1 and VCC2 = 3.3 to 5.0V -81 dBm Forward Isolation Standby Mode VAPC1 and VAPC2 = 0.3 V, PIN = +9.5 dBm -22 dBm Second Harmonic PIN = +9.5 dBm -20 -7 dBm Third Harmonic PIN = +9.5 dBm -25 -7 dBm Non-Harmonic Spurious -36 dBm Input Impedance 50 Ω Optimum Source Impedance For best noise performance 40 + j10 Ω Input VSWR (POUT, MAX - 5 dB) < Pout < POUT.MAX 2.5:1 POUT < (POUT.MAX - 5 dB) 4.0:1 Output Load VSWR, Stability Spurious < -36dBm, RBW=100KHz VAPC1 and VAPC2 from 0.3 V to 2.6 V 8:1 Output Load VSWR, Ruggedness No damage 10:1 Output Load Impedance Load Impedance presented at RF OUT pad 2.6 – j1.5 Ω Power Control “ON” Voltage VAPC1, VAPC2; Maximum POUT 2.6 V Power Control “OFF” Voltage VAPC1, VAPC2; Minimum POUT 0.2 0.5 V Gain Control Range VAPC1 and VAPC2 from 0.2 V to 2.6 V 75 dB Gain Control Slope POUT from -10 dBm to +35 dBm 5 100 150 dB/V APC Input Capacitance DC to 2 MHz 10 pF APC Input Current VAPC1 and VAPC2 = 2.8V 4.5 5 mA VAPC1 and VAPC2 = 0 V 25 µA Turn ON/OFF Time VAPC1 and VAPC2 from 0 V to 2.8V 100 ns Device Current (ICC, ICC1, and ICC2) At Maximum Output Power 2 A Quiescent, PIN < -30dBm 15 200 335 mA Standby Mode, PIN < -30dBm 1 10 µA Standby Mode, PIN < -30dBm, Temp = +85°C 1 10 µA Thermal Resistance CW Mode, Junction to Case 25.6 °C/W Notes: 1. Test conditions unless otherwise noted: VAPC1 and VAPC2 = 2.8 V; VCC, VCC1 and VCC2 = 3.6 V; PIN = +4.5 dBm; Pulse Width = 1731 µs; Duty Cycle = 37.5%; Temp = +25 °C; 50 Ω system; Refer to RF5110GPCK-410 GSM900 evaluation board circuit.

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 4 of 16 www.qorvo.com

150 MHz FM Band Application Circuit

220 MHz FM Band Application Circuit

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 5 of 16 www.qorvo.com

450 MHz FM Band Application Circuit

865 MHz and 902 MHz to 928 MHz ISM Band Application Circuit

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 6 of 16 www.qorvo.com

850 MHz GSM Band Application Circuit

GSM900 Evaluation Board Circuit, RF5110GPCK-410

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 7 of 16 www.qorvo.com Performance Plots – 150 MHz

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 8 of 16 www.qorvo.com Performance Plots – 220 MHz

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 9 of 16 www.qorvo.com Performance Plots – 450 MHz

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 10 of 16 www.qorvo.com Performance Plots – 865 MHz to 925 MHz

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 11 of 16 www.qorvo.com Pad Configuration and Description Top View Pad No. Label Description Interface Circuit

1 VCC1

Power supply for the pre-amplifier stage and interstage matching. This pin forms the shunt inductance needed for proper tuning of the interstage match. Refer to the application circuit for proper configuration. Note that position and value of the components are important.

2 GND1

Ground connection for the pre-amplifier stage. Keep traces physically short and connect immediately to the ground plane for best performance. For stability concert, this pin requires dedicated ground via holes to the ground plane to minimize any common inductance.

3 RF IN

RF Input. This is a 50Ω input, but the actual impedance could be affected by the interstage matching network connected on pin 1. An external DC blocking capacitor is required.

4 GND2

Ground connection for the driver stage. To minimize the noise power at the output, it is recommended to connect this pin with a trace of about 40mil long to the ground plane. This will slightly reduce the small signal gain. For stability concert, this pin requires dedicated ground via holes to the ground plane to minimize any common inductance. 5, 6 VCC2 Power supply for the driver stage and interstage matching. This pin requires a shunt inductance for proper interstage matching. Please refer to the application schematic for proper configuration. 7, 13 NC Not connected. 8 2F0 Connection for the second harmonic trap. This pin is internally connected to the RF OUT pins. With the bonding wire together with an external capacitor form a series resonator. It should provide a second harmonic short termination to improve amplifier efficiency and reduce spurious outputs. 9, 10, 11,

12 RF OUT

RF Output and power supply for the output stage. Bias voltage for the final stage is provided through this wide output pins. An external matching network is required to provide the optimum performance.

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 12 of 16 www.qorvo.com Pad Configuration and Description (continue) Pad No. Label Description Interface Circuit 14 VCC Power supply for the bias circuits. 15 APC2 Power Control for the output stage. See pin 16 for more details.

16 APC1

Power Control for the driver and pre-amplifier stages. When this pin is "low," all circuits shut off. A "low" is typically 0.5V or less at room temperature. A shunt bypass capacitor is required. For a typical power control operation, the VAPC1 is about 1.0V for -10dBm to 2.6V for +35dBm RF output power. The maximum power that can be achieved depends on the actual output matching; see the application circuit for more details. Backside Paddle GND RF/DC ground. Ground connection for the output stage. This pad should be connected to the ground plane by ground via holes directly under the device. A short path is required to obtain optimum performance, as well as to provide a good thermal path to the PCB for maximum heat dissipation. Evaluation Board PCB Information Evaluation Board: Size 2.0” x 2.0”; Material FR-4; Multi-Layer; Thickness 0.032”

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 13 of 16 www.qorvo.com Package Marking and Dimensions Marking: Part Number – RF5110 Trace Code – Assigned by sub-contractor Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 3. Contact plating: Matte Sn PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. ground via holes are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. 0.203 mm to 0.330 mm finished hole size and 0.5 mm to 1.2 mm grid pattern recommended. 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 14 of 16 www.qorvo.com Tape and Reel Information – Carrier and Cover Tape Dimensions Feature Measure Symbol Size (in) Size (mm) Cavity Length A0 0.125 3.20 Width B0 0.125 3.20 Depth K0 0.040 1.00 Pitch P1 0.157 4.00 Centerline Distance Cavity to Perforation - Length Direction P2 0.079 2.00 Cavity to Perforation - Width Direction F 0.217 5.50 Cover Tape Width C 0.362 9.20 Carrier Tape Width W 0.472 12.0

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 15 of 16 www.qorvo.com Tape and Reel Information – Reel Dimensions Standard T/R size = 2,500 pieces on a 7” reel. Feature Measure Symbol Size (in) Size (mm) Flange Diameter A 6.969 177 Thickness W2 0.717 18.2 Space Between Flange W1 0.504 12.8 Hub Outer Diameter N 2.283 58.0 Arbor Hole Diameter C 0.512 13.0 Key Slit Width B 0.079 2.0 Key Slit Diameter D 0.787 20.0 Tape and Reel Information – Tape Length and Label Placement Notes: 1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A. 2. Labels are placed on the flange opposite the sprockets in the carrier tape.

Datasheet, Rev. F, December 22, 2020 | Subject to change without notice 16 of 16 www.qorvo.com Handling Precautions Parameter Rating Standard Caution! ESD-Sensitive Device ESD – Human Body Model (HBM) Class 0 JESD22-A114 ESD – Machine Model Class A JESD22-A115 MSL – Moisture Sensitivity Level Level 2 IPC/JEDEC J-STD-020 Solderability Solder profiles available upon request. Contact plating: Matte Sn RoHS Compliance This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electr ical and Electronic Equipment) as amended by Directive 2015/863/EU. This product also has the following attributes:

• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C15H12Br402) Free
• PFOS Free
• SVHC Free Important Notice The information cont ained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All informatio n contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anythin g described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2020 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-890-8163 Email: customer.support@qorvo.com Pb