MSS40-800 KERSEMI | Alldatasheet

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MSS50 Series is based on two back-to-back SCR configurations, providing high noise immunity. They are suitable for high power applications such as solid state relays, heating control systems, welding equipment, motor control circuits... The compactness of the ISOTOP package allows high power density and optimized power bus connections. Thanks to their internal ceramic pad, they provide high voltage insulation (2500V RMS), complying with UL standards (File ref: E81734). Symbol Value Unit I T(RMS) 55 and 70 A V DRM RRM 800 and 1200 V I GT 50 mA ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit MSS40 MSS50 I T(RMS) RMS on-state current Tc = 80 °C 55 ATc = 85 °C 70 I TSM Non repetitive surge peak on-state current tp = 16.7 ms Tj = 25°C 420 630 A tp = 20 ms 400 600 I tI t Value for fusing tp = 10 ms Tj = 25°C 800 1800 A S dI/dt Critical rate of rise of on-state current I G = 2 x I GT , tr ≤ 100 ns F = 120 Hz Tj = 125°C 50 A/µs I GM Peak gate current tp = 20 µs Tj = 125°C 4 A P G(AV) Average gate power dissipation Tj = 125°C 1 W T stg T j Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C V RGM Maximum peak reverse gate voltage 5 V G2 G1 ISOTOP® PIN CONNECTIONS A1 A2 1: Thyristor 2 Anode (A2) 2: Thyristor 2 Gate (G2) 3: Thyristor 1 Anode (A1) 4: Thyristor 1 Gate (G1) www.kersemi.com

ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) THERMAL RESISTANCES PRODUCT SELECTOR

ORDERING INFORMATION

I GT V D = 12 V R L = 33 Ω MIN. 5 mA MAX. 50 V GT MAX. 1.3 V V GD V D = V DRM R L = 3.3 kΩ Tj = 125°C MIN. 0.2 V I H I T = 500 mA Gate open MAX. 80 mA I L I G = 1.2 I GT MAX. 120 mA dV/dt V D = 67 % V DRM Gate open Tj = 125°C MIN. 1000 V/µs V TM I TM = 80 A tp = 380 µs Tj = 25°C MAX. 1.7 - V I TM = 100 A tp = 380 µs - 1.7 V Threshold voltage Tj = 125°C MAX. 0.85 V R d Dynamic resistance Tj = 125°C MAX. 11 7 m Ω I DRM I RRM V DRM / V RRM RATED Tj = 25°C MAX. 20 µA Tj = 125°C 10 mA Symbol Parameter Value Unit R th(j-c) Junction to case (AC) MSS40 0.6 °C/W MSS50 0.45 Part Number Voltage (xxx) Sensitivity Package

800 V 1200 V

MSS40-xxx X X 50 mA ISOTOP TM MSS50-xxx X X 50 mA ISOTOP TM MSS 40 - 800 SCR MODULE SERIES CURRENT: 40: 55A 50: 70A VOLTAGE: 800: 800V 1200: 1200V www.kersemi.com

Note: xxx = voltage Part Number Marking Weight Base Quantity Packing mode MSS40-xxx MSS40-xxx 27.0 g 10 T ube MSS50-xxx MSS50-xxx 27.0 g 10 T ube Fig. 1: Maximum power dissipation versus RMS on-state current. Fig. 2: RMS on-state current versus case temperature. Fig. 3: Relative variation of thermal impedance junction to case versus pulse duration. Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values). 0 1 02 03 04 05 06 07 08 0 100 P(W) a = 180° MSS40 MSS50 180° a a IT(RMS)(A) 0 25 50 75 100 125 150 IT(RMS)(A) a =180° MSS40 MSS50 Tcase(°C) 1E-3 1E-2 1E-1 1E+0 1E+1 0.1 0.2 0.5 1.0 K = [Zth(j-c)/Rth(j-c)] tp(s) -40 -20 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25 °C] IGT IH & IL Tj(°C) www.kersemi.com

Fig. 5: Surge peak on-state current versus number of cycles. Fig. 6:Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding value of I²t. Fig. 7-1: On-state characteristics (maximum values) (MSS40). Fig. 7-2: On state characteristics (maximum values) (MSS50). 1 10 100 100 200 300 400 500 600 700 ITSM(A) Non repetitiv e Tj initial = 25 °C MSS40 MSS50 MSS40 Repetitive Tcase = 80 °C MSS50 Repetitive Tcase = 85 °C Number of cycles One cycle t = 20ms ITSM(A), I t(A S) 5000 1000 100 0.01 0.10 1.00 10.00 100 500 ITM(A) Tj = 25°C Tj max.: Vto = 0.85V Rd = 11mW Tj = Tjmax. VTM(V) 100 1000 ITM(A) Tj = 25°C Tj max.: Vto = 0.85V Rd = 7mW Tj = Tjmax. VTM(V) www.kersemi.com

ISOTOP™ n Recommended torque value: 1.3 Nm (max. 1.5 Nm) for the 6 x M4 screws (2 x M4 screws recom- mended for mounting the package on the heatsink and the 4 provided screws. n The screws supplied with the package are adapted for mounting on a board (or other types of termi- nals) with a thickness of 0.6 mm min. and 2.2 mm max. REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 11.80 12.20 0.465 0.480 A1 8.90 9.10 0.350 0.358 B 7.8 8.20 0.307 0.323 C 0.75 0.85 0.030 0.033 C2 1.95 2.05 0.077 0.081 D 37.80 38.20 1.488 1.504 D1 31.50 31.70 1.240 1.248 E 25.15 25.50 0.990 1.004 E1 23.85 24.15 0.939 0.951 E2 24.80 typ. 0.976 typ. G 14.90 15.10 0.587 0.594 G1 12.60 12.80 0.496 0.504 G2 3.50 4.30 0.138 0.169 F 4.10 4.30 0.161 0.169 F1 4.60 5.00 0.181 0.197 P 4.00 4.30 0.157 0.69 P1 4.00 4.40 0.157 0.173 S 30.10 30.30 1.185 1.193 www.kersemi.com