MSP0315W MORESEMI | Alldatasheet

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Technical content

  • V DS = -30V,I D = -15A R DS(ON) < 12mΩ @ V GS =-10V
  • High power and current handing capability
  • Lead free product is acquired
  • Surface mount package Application
  • PWM applications
  • Load switch
  • Uninterruptible power supply Schematic diagram Marking and pin assignment SOP-8 top view Package Marking and Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity MSP0315W SOP-8 Ø330mm 12mm 2500 units Absolute Maximum Ratings (T A =25℃unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage V DS -30 V Gate-Source Voltage V GS ±20 V Drain Current-Continuous I D -15 A Drain Current-Pulsed (Note 1) I DM -80 A Maximum Power Dissipation P D 3.1 W Operating Junction and Storage Temperature Range T J STG -55 To 150 ℃ Thermal Characteristic Thermal Resistance,Junction-to-Ambient (Note 2) R θJA 40 /W℃ MSP0315W -30V(D-S) P-Channel Enhancement Mode Power MOS FET Lead Free PIN Configuration MORE Semiconductor Company Limited http://www.moresemi.com 1/6

Zero Gate Voltage Drain Current I DSS V DS =-30V,V GS =0V - - -1 μA Gate-Body Leakage Current I GSS V GS =±20V,V DS =0V - - ±100 nA On Characteristics (Note 3) Gate Threshold Voltage V GS(th) V DS GS D Drain-Source On-State Resistance R DS(ON) V GS =-10V, I D =-15A - 8.5 12 mΩ Forward Transconductance g FS V DS =-5V,I D =-15A 30 - - S Dynamic Characteristics (Note4) Input Capacitance C lss - 2900 - PF Output Capacitance C oss - 410 - PF Reverse Transfer Capacitance C rss V DS =-15V,V GS =0V, F=1.0MHz - 280 - PF Switching Characteristics (Note 4) Turn-on Delay Time t d(on) - 15 - nS Turn-on Rise Time t r - 11 - nS Turn-Off Delay Time t d(off) - 44 - nS Turn-Off Fall Time t f V DD =-15V, ID=-10A, V GS =-10V,R GEN =3Ω - 21 - nS Total Gate Charge Q g - 48 - nC Gate-Source Charge Q gs - 12 - nC Gate-Drain Charge Q gd V DS =-15V,I D =-10A,V GS =-10V - 14 - nC Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) V SD V GS =0V,I S =-2A - - -1.2 V Notes 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production Electrical Characteristics (T A =25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BV DSS V GS =0V I D MORE Semiconductor Company Limited http://www.moresemi.com 2/6 MSP0315W

Square Wave Pluse Duration(sec) Figure 13 Normalized Maximum Transient Thermal Impedance r(t),Normalized Effective Transient Thermal Im p edance MORE Semiconductor Company Limited http://www.moresemi.com 5/6 MSP0315W

Dimensions In Millimeters Dimensions In Inches Symbol Min. Max. Min. Max. A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 D 4.700 5.100 0.185 0.200 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e 1.270(BSC) 0.050(BSC) L 0.400 1.270 0.016 0.050 θ 0Š 8Š 0Š 8Š MORE Semiconductor Company Limited http://www.moresemi.com 6/6 MSP0315W