MCR716T4 KERSEMI | Alldatasheet

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Passivated Die for Reliability and Uniformity Low Level Triggering and Holding Characteristics Surface Mount Lead Form − Case 369C Epoxy Meets UL 94, V−0 @ 0.125 in ESD Ratings: Human Body Model, 3B 8000 V Machine Model, C 400 V MAXIMUM RATINGS J = 25°C unless otherwise noted) Rating Symbol Value Unit Peak Repetitive Off−State Voltage (Note 1) (T J = −40 to 110°C, Sine Wave, 50 to 60 Hz, Gate Open) MCR716 MCR718 V DRM, V RRM 400 600 V On−State RMS Current (180° Conduction Angles; T C = 90°C) I T(RMS) 4.0 A Average On−State Current (180° Conduction Angles; T C = 90°C) T(AV) 2.6 A Peak Non-Repetitive Surge Current (1/2 Cycle, Sine Wave 60 Hz, T J = 110°C) I TSM A Circuit Fusing Consideration (t = 8.3 msec) I t 2.6 A sec Forward Peak Gate Power (Pulse Width ≤ 1.0 sec, T C = 90°C) P GM 0.5 W Forward Average Gate Power (t = 8.3 msec, T C = 90°C) P G(AV) 0.1 W Forward Peak Gate Current (Pulse Width ≤ 1.0 sec, T C = 90°C) I GM 0.2 A Operating Junction Temperature Range T J −40 to +110 Storage Temperature Range T stg −40 to +150 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. V DRM and V RRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. SCRs

4.0 AMPERES RMS

400 − 600 VOLTS K G A PIN ASSIGNMENT Anode Gate Cathode

4 Anode

Preferred devices are recommended choices for future use and best overall value. DPAK CASE 369C STYLE 4 MARKING DIAGRAM Y = Year WW = Work Week x = 6 or 8 1 2 YWW MC R71x See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

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MCR716, MCR718 www.kersemi.com THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Case R JC 3.0 °C/W Thermal Resistance, Junction−to−Ambient (Note 2) R JA °C/W Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds T L 260

ELECTRICAL CHARACTERISTICS

C = 25°C unless otherwise noted.) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current; R GK = 1 k (Note 3) AK = Rated V DRM or V RRM C = 25°C T C = 110°C I DRM I RRM 200 A ON CHARACTERISTICS Peak Reverse Gate Blocking Voltage GR = 10 A) V RGM 12.5 V Peak Reverse Gate Blocking Current GR = 10 V) I RGM 1.2 A Peak Forward On−State Voltage (Note 4) TM = 5.0 A Peak) TM = 8.2 A Peak) V TM 1.3 1.5 1.5 2.2 V Gate Trigger Current (Continuous dc) (Note 5) D = 12 Vdc, R L = 30 Ohms) T C = 25°C T C = −40°C I GT 1.0 300 A Gate Trigger Voltage (Continuous dc) (Note 5) D = 12 Vdc, R L = 30 Ohms) T C = 25°C T C = −40°C T C = 110°C V GT 0.3 0.2 0.55 0.8 1.0 V Holding Current (Note 3) D = 12 Vdc, Initiating Current = 200 mA, Gate Open) T C = 25°C T C = −40°C I H 0.4 1.0 5.0 mA Latching Current (Note 3) D = 12 Vdc, I G = 2.0 mA, T C = 25°C) D = 12 Vdc, I G = 2.0 mA, T C = −40°C) I L 5.0 mA Total Turn-On Time (Source Voltage = 12 V, R S = 6 k, I T = 8 A(pk), R GK = 1 k) D = Rated V DRM , Rise Time = 20 ns, Pulse Width = 10 s) t gt 2.0 5.0 s DYNAMIC CHARACTERISTICS Critical Rate of Rise of Off−State Voltage D = 0.67 x Rated V DRM , R GK = 1 k, Exponential Waveform, T J = 110°C) dv/dt 5.0 V/s Repetitive Critical Rate of Rise of On−State Current (f = 60 Hz, I PK = 30 A, PW = 100 s, dIG/dt = 1 A/s) di/dt 100 A/s 2. Case 369C, when surface mounted on minimum recommended pad size. 3. Ratings apply for negative gate voltage or R GK = 1 k. Devices shall not have a positive gate voltage concurrently with a negative voltage on the anode. Devices should not be tested with a constant current source for forward and reverse blocking capability such that the voltage applied exceeds the rated blocking voltage. 4. Pulse Test: Pulse Width ≤ 2 ms, Duty Cycle ≤ 2%. 5. R GK current not included in measurements. 16 mm Tape & Reel (2.5 k / Reel) MCR718T4 DPAK 16 mm Tape & Reel (2.5 k / Reel) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.kersemi.com

MCR716, MCR718 PACKAGE DIMENSIONS DPAK CASE 369C ISSUE O D A K B RV S F L G 2 PL M 0.13 (0.005) T E C U J H −T− SEATING PLANE Z DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.235 0.245 5.97 6.22 B 0.250 0.265 6.35 6.73 C 0.086 0.094 2.19 2.38 D 0.027 0.035 0.69 0.88 E 0.018 0.023 0.46 0.58 F 0.037 0.045 0.94 1.14 G 0.180 BSC 4.58 BSC H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.102 0.114 2.60 2.89 L 0.090 BSC 2.29 BSC R 0.180 0.215 4.57 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 123 5.80 0.228 2.58 0.101 1.6 0.063 6.20 0.244 3.0 0.118 6.172 0.243 mm inches SCALE 3:1 STYLE 4: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE SOLDERING FOOTPRINT www.kersemi.comwww.kersemi.com