LMA1010 LODEV | Alldatasheet

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16 x 16-bit Multiplier-Accumulator Multiplier-Accumulators 08/16/2000–LDS.10/2010-P1 ❑❑❑❑❑ 20 ns Multiply-Accumulate Time ❑❑❑❑❑ Replaces Fairchild TMC2210, Cypress CY7C510, IDT 7210L, and AMD Am29510 ❑❑❑❑❑ Two’s Complement or Unsigned Operands ❑❑❑❑❑ Accumulator Performs Preload, Accumulate, and Subtract ❑❑❑❑❑ Three-State Outputs ❑❑❑❑❑ 68-pin PLCC, J-Lead FEATURES DESCRIPTION LMA1010/2010 16 x 16-bit Multiplier-AccumulatorDEVICES INCORPORATED The LMA1010 and LMA2010 are high-speed, low power 16-bit multiplier-accumulators. The LMA1010 and LMA2010 are functionally identical; they differ only in packaging. Full mili- tary ambient temperature range opera- tion is achieved with advanced CMOS technology. The LMA1010 and LMA2010 produce the 32-bit product of two 16-bit numbers. The results of a series of multiplications may be accumulated to form the sum of products. Accumulation is performed to 35-bit precision with the multiplier prod- uct sign extended as appropriate. Data present at the A and B input regis- ters is latched on the rising edges of CLK A and CLK B respectively. RND, TC, ACC, and SUB controls are latched on the rising edge of the logical OR of CLK A and CLK B. TC specifies the input as two’s complement (TC HIGH) or unsigned magnitude (TC LOW). RND, when HIGH, adds ‘1’ to the most significant bit position of the least significant half of the product. Subsequent truncation of the 16 least significant bits produces a result correctly rounded to 16-bit preci- sion. ACC and SUB control accumulator operation. ACC HIGH results in addition of the multiplier product and the accumulator contents, with the result stored in the accumulator register on the rising edge of CLK R. ACC and SUB HIGH results in subtraction of the accumulator contents from the multiplier product, with the result stored in the accumulator register. With ACC LOW and SUB LOW, no accumulation occurs and the next product is loaded directly into the accumulator register. ACC LOW and SUB HIGH is undefined. The LMA1010/2010 output register (accumulator register) is divided into three independently controlled sec- tions. The least significant result (LSR) and most significant result (MSR) registers are 16 bits in length. The extended result register (XTR) is 3 bits long. The output signals R 15-0 and input signals B 15-0 share the same bidirectional pins. Each output register has an indepen- dent output enable control. In addition to providing three-state control of the output buffers, when OEX, OEM, or OEL are HIGH and PREL is HIGH, data can be preloaded via the bidirectional output pins into the respective output registers. Data present on the output pins is latched on the rising edge of CLK R. The interrelation of PREL and the enable controls is summarized in Table 1. LMA1010/2010 BLOCK DIAGRAM A REGISTER B REGISTER 16 16 A 15-0 B 15-0 R 15-0 ACC REGISTER REGISTER CLK A CLK B RND R 31-16 R + A R – A PASS R LEM LELLEX R 34-32 35PRELOAD CONTROL LOGIC CLK R ACCUMULATOR TC SUB R A OEL OEX OEM PREL LEL LEX LEM OEL OEX OEM OEX OEM OEL 35 3 16 16

16 x 16-bit Multiplier-Accumulator Multiplier-Accumulators 08/16/2000–LDS.10/2010-P3 Symbol Parameter Test Condition Min Typ Max Unit VOH Output High Voltage VCC = Min., IOH = –2.0 mA 2.4 V VOL Output Low Voltage VCC = Min., IOL = 8.0 mA 0.5 V VIH Input High Voltage 2.0 VCC V VIL Input Low Voltage (Note 3) 0.0 0.8 V IIX Input Current Ground ≤ VIN ≤ VCC (Note 12) ±20 µA IOZ Output Leakage Current Ground ≤ VOUT ≤ VCC (Note 12) ±20 µA ICC1 VCC Current, Dynamic (Notes 5, 6) 12 25 mA ICC2 VCC Current, Quiescent (Note 7) 1.0 mA M AXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8) O PERATING CONDITIONS To meet specified electrical and switching characteristics ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4) Mode Temperature Range (Ambient) Supply Voltage Active Operation, Commercial 0°C to +70°C 4.75 V ≤ VCC ≤ 5.25 V Active Operation, Military –55°C to +125°C 4.50 V ≤ VCC ≤ 5.50 V

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234567890 1 12345678901 C OMMERCIAL OPERATING RANGE (0°C to +70°C) Notes 9, 10 (ns) SWITCHING CHARACTERISTICS M ILITARY OPERATING RANGE (–55°C to +125°C) Notes 9, 10 (ns) 123456789012345678901234 1 2345678901234567890123 4 123456789012345678901234 *DISCONTINUED SPEED GRADE SWITCHING WAVEFORMS HIGH IMPEDANCE A15-0 B15-0 tENAtDIS tMC tHtS CLK A CLK B CLK R OE* tSP OUTPUTPRELOAD tHP R 34-0 PREL tPW tPW tPW tD *includes OEX, OEM, OEL LMA1010/2010– Symbol Parameter Min Max Min Max Min Max Min Max Min Max Min Max tMC Clocked Multiply Time 65 55 45 35 25 20 tPW Clock Pulse Width 15 15 15 10 10 9 tS Input Register Setup Time 15 15 12 12 12 10 tH Input Register Hold Time 2 2 2 2 2 2 tSP Preload Setup Time 15 15 12 12 12 10 tHP Preload Hold Time 2 2 2 2 2 2 tD Output Delay 30 25 25 25 20 18 tENA Three-State Output Enable Delay (Note 11) 30 30 25 25 20 18 tDIS Three-State Output Disable Delay (Note 11) 30 25 25 25 20 18 LMA1010/2010– Symbol Parameter Min Max Min Max Min Max Min Max Min Max Min Max tMC Clocked Multiply Time 75 65 55 40 30 25 tPW Clock Pulse Width 20 15 15 15 10 10 tS Input Register Setup Time 20 15 15 15 12 12 tH Input Register Hold Time 2 2 2 2 2 2 tSP Preload Setup Time 20 15 15 15 12 12 tHP Preload Hold Time 2 2 2 2 2 2 tD Output Delay 35 30 30 25 20 20 tENA Three-State Output Enable Delay (Note 11) 35 30 30 25 20 20 tDIS Three-State Output Disable Delay (Note 11) 35 25 25 25 20 20

16 x 16-bit Multiplier-Accumulator Multiplier-Accumulators 08/16/2000–LDS.10/2010-P5 1. Maximum Ratings indicate stress specifications only. Functional oper- ation of these products at values beyond those indicated in the Operating Condi- tions table is not implied. Exposure to maximum rating conditions for ex- tended periods may affect reliability. 2. The products described by this spec- ification include internal circuitry de- signed to protect the chip from damag- ing substrate injection currents and ac- cumulations of static charge. Neverthe- less, conventional precautions should be observed during storage, handling, and use of these circuits in order to avoid exposure to excessive electrical stress values. 3. This device provides hard clamping of transient undershoot and overshoot. In- put levels below ground or above V CC will be clamped beginning at –0.6 V and VCC + 0.6 V. The device can withstand indefinite operation with inputs in the range of –0.5 V to +7.0 V. Device opera- tion will not be adversely affected, how- ever, input current levels will be well in excess of 100 mA. 4. Actual test conditions may vary from those designated but operation is guar- anteed as specified. 5. Supply current for a given applica- tion can be accurately approximated by: where N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency 6. Tested with all outputs changing ev- ery cycle and no load, at a 5 MHz clock rate. 7. Tested with all inputs within 0.1 V of V CC or Ground, no load. 8. These parameters are guaranteed but not 100% tested. NCV F NOTES 9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except t DIS test), and input levels of nominally 0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max respectively. Alternatively, a diode bridge with upper and lower current sources of IOH and IOL respectively, and a balancing voltage of 1.5 V may be used. Parasitic capacitance is 30 pF minimum, and may be distributed. This device has high-speed outputs ca- pable of large instantaneous current pulses and fast turn-on/turn-off times. As a result, care must be exercised in the testing of this device. The following measures are recommended: a. A 0.1 µF ceramic capacitor should be installed between V CC and Ground leads as close to the Device Under Test (DUT) as possible. Similar capacitors should be installed between device VCC and the tester common, and device ground and tester common. b. Ground and VCC supply planes must be brought directly to the DUT socket or contactor fingers. c. Input voltages should be adjusted to compensate for inductive ground and VCC noise to maintain required DUT input levels relative to the DUT ground pin. 10. Each parameter is shown as a min- imum or maximum value. Input re- quirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter- nal system must supply at least that much time to meet the worst-case re- quirements of all parts. Responses from the internal circuitry are specified from the point of view of the device. Output delay, for example, is specified as a maximum since worst-case operation of any device always provides data within that time. 11. For the t ENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the ±200mV level from the measured steady-state output voltage with ±10mA loads. The balancing volt- age, V TH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Z- to-1 and 1-to-Z tests. 12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current. IOH IOL VTHC L DUT OE 0.2 V tDIStENA 0.2 V 1.5 V 1.5 V 3.5V Vth 1 Z 0 Z Z 1 Z 0 1.5 V 1.5 V 0V Vth VOL * VOH * VOL * VOH * Measured VOL with IOH = –10mA and IOL = 10mA Measured VOH with IOH = –10mA and IOL = 10mA FIGURE B. THRESHOLD LEVELS FIGURE A. OUTPUT LOADING CIRCUIT

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ORDERING INFORMATION 68-pin 0°C to +70°C — COMMERCIAL SCREENING Speed Ceramic Pin Grid Array (G2) Sidebraze Hermetic DIP (D6) –55°C to +125°C — MIL-STD-883 COMPLIANT –55°C to +125°C — COMMERCIAL SCREENING B0, R0 B1, R1 B2, R2 B3, R3 B4, R4 B5, R5 B6, R6 B7, R7 GND B8, R8 B9, R9 B10, R10 B11, R11 B12, R12 B13, R13 B14, R14 B15, R15 R 16 R 17 R 18 R 19 R 20 R 21 R 22 R 23 A10 A11 A12 A13 A14 A15 OEL RND SUB ACC CLK A CLK B V CC TC OEX PREL OEM CLK R R R 33 R 32 R 31 R 30 R 29 R 28 R 27 R 26 R 25 R 24 A B C D E F G H J K L Top View Through Package (i.e., Component Side Pinout) 12345 6 7 8 9 10 11 B/R2 B/R4 B/R6 GND B/R9 B/R11 B/R13 B/R15 NC NC B/R1 B/R3 B/R5 B/R7 B/R8 B/R10 B/R12 B/R14 R 16 R 17 B/R0 R 18 R 19 R 20 R 21 R 22 R 23 R 24 R 25 R 26 R 27 A10 R 28 R 29 A11 A12 R 30 R 31 A13 A14 OEL SUB CLK A VCC OEX OEM R 34 R 32 NC NC A15 RND ACC CLK B TC PREL CLK R R 33 Discontinued PackageDiscontinued Package

16 x 16-bit Multiplier-Accumulator Multiplier-Accumulators 08/16/2000–LDS.10/2010-P7 Plastic J-Lead Chip Carrier (J2) LMA2010JC35 LMA2010JC25 68-pin LMA2010 — ORDERING INFORMATION 0°C to +70°C — COMMERCIAL SCREENING Speed 35 ns 25 ns –55°C to +125°C — MIL-STD-883 COMPLIANT –55°C to +125°C — COMMERCIAL SCREENING 6768 64 65 Top View 46 6 63 6212 27 32 33 34 35 36 37 38 39 40 41 42 43 586 7 28 29 30 31 B2, R2 B3, R3 B4, R4 B5, R5 B6, R6 B7, R7 GND GND B 8, R8 B9, R9 B10, R10 B11, R11 B12, R12 B13, R13 B14, R14 B15, R15 R 16 A15 OEL RND SUB ACC CLK A CLK B V CC VCC VCC VCC TC OEX PREL OEM CLK R R 34 A14 A13 A12 A11 A10 B0, R0 B1, R1 R 33 R 32 R 31 R 30 R 29 R 28 R 27 R 26 R 25 R 24 R 23 R 22 R 21 R 20 R 19 R 18 R 17