LF2250QC20

LF2250 LODEV | Alldatasheet

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12 x 10-bit Matrix Multiplier Video Imaging Products 1 08/16/2000–LDS.2250-L LF2250 12 x 10-bit Matrix MultiplierDEVICES INCORPORATED ❑❑❑❑❑ 50 MHz Data and Computation Rate ❑❑❑❑❑ Nine Multiplier Array with 12-bit Data and 10-bit Coefficient Inputs ❑❑❑❑❑ Separate 16-bit Cascade Input and Output Ports ❑❑❑❑❑ On-board Coefficient Storage ❑❑❑❑❑ Four User-Selectable Filtering and Transformation Functions:

• 3 x 3 Matrix Multiplier
• Cascadable 9-Tap FIR Filter
• Cascadable 3 x 3 Convolver
• Cascadable 4 x 2 Convolver ❑❑❑❑❑ Replaces TRW/Raytheon/ Fairchild TMC2250 FEATURES DESCRIPTION The LF2250 is a high-speed matrix multiplier consisting of an array of nine 12 x 10-bit multipliers. Internal summing adders are also included to provide the configurations needed to implement matrix multiplications, cascadable FIR filters, and pixel convolvers. The 3 x 3 matrix multiplier (triple dot product) configuration of the LF2250 allows users to easily perform three- dimensional perspective translations or video format conversions at real-time video rates. By using the LF2250 in this configuration, conversions can be made from the RGB (color component) format to the YIQ (quadrature encoded chrominance) or YUV (color differ- ence) formats and vice versa (YIQ or YUV to RGB). In addition to color space conversions, the LF2250 offers a range of selectable configurations designed for filtering applications. When configured as a 9-tap FIR filter, the LF2250 automatically selects the necessary internal bus structure and inserts the appropriate data path delay elements. In addition, a 16-bit cascade input port allows for the creation of larger filters without a reduction in throughput. Real-time video image filtering using the convolver modes of the LF2250 can provide edge detection, texture enhancement, and detail smoothing. Both pixel convolver configurations, 3 x 3 and 4 x 2, deliver high-speed data manipulation in a single chip solution. By using the 16-bit cascade input port to cascade two devices, cubic convolu- tions (4 x 4-pixel) can be easily accom- modated with no decrease in through- put rates. All inputs and outputs, as well as all control lines, are registered on the rising edge of clock. The LF2250 operates at clock rates up to 50 MHz over the full commercial temperature and supply voltage ranges. 9-MULTIPLIER ARRAY CLK MODE 1-0 CWE 1-0 A11-0 B11-0 C 11-0 KA 9-0 KB 9-0 KC 9-0 DATA INPUTS COEFFICIENT INPUTS X11-0 CASIN15-4 XC11-0 Y11-8 CASIN3-0 YC11-8 Y7-4 Y7-4 Y3-0 CASOUT3-0 YC3-0 Z11-0 CASOUT15-4 ZC11-0 DATA OUTPUTS CASCADE PORTS PIN NAME LF2250 BLOCK DIAGRAM

new data to the next filter tap. each coefficient input port. TABLE 1. M ODE SELECTION (12 integer bits and 4 fractional bits). (CASOUT4 would then be the LSB). weightings for all four modes. details the modes of operation. each of the four operating modes. TABLE 2. DATA PORT FORMATTING

00 A 11-0 B11-0 C 11-0 KA 9-0 KB 9-0 KC 9-0 X11-0 Y11-8 Y7-4 Y3-0 Z11-0

01 A 11-0 A11-0 NC KA 9-0 KB 9-0 KC 9-0 CASIN 15-4 CASIN 3-0 NC CASOUT 3-0 CASOUT 15-4

10 A 11-0 B11-0 C 11-0 KA 9-0 KB 9-0 KC 9-0 CASIN 15-4 CASIN 3-0 NC CASOUT 3-0 CASOUT 15-4

11 A 11-0 B11-0 NC KA 9-0 KB 9-0 KC 9-0 CASIN 15-4 CASIN 3-0 NC CASOUT 3-0 CASOUT 15-4

00 Hold All Registers

01 KA1, KB1, KC1

10 KA2, KB2, KC2

11 KA3, KB3, KC3

TABLE 4. COEFF . REG . UPDATE for this mode is five clock cycles. every clock cycle thereafter. is available every clock cycle. moving to the next pixel column. TABLE 5. LATENCY EQUATIONS

FIGURE 2. 3 X 3 MATRIX MULTIPLIER — M ODE 00

FIGURE 3. 9-TAP FIR FILTER — M ODE 01

FIGURE 4. 3 X 3-PIXEL CONVOLVER — M ODE 10

FIGURE 5. 4 X 2-PIXEL CONVOLVER — M ODE 11

12 x 10-bit Matrix Multiplier Video Imaging Products 9 08/16/2000–LDS.2250-L Symbol Parameter Test Condition Min Typ Max Unit VOH Output High Voltage Vcc = Min., IOH = –2.0 mA 2.4 V VOL Output Low Voltage Vcc = Min., IOL = 4.0 mA 0.4 V VIH Input High Voltage 2.0 VCC V VIL Input Low Voltage (Note 3) 0.0 0.8 V IIX Input Current Ground ≤ VIN ≤ VCC (Note 12) ±10 µA IOZ Output Leakage Current (Note 12) ±40 µA ICC1 VCC Current, Dynamic (Notes 5, 6) 160 mA ICC2 VCC Current, Quiescent (Note 7) 12 mA C IN Input Capacitance TA = 25°C, f = 1 MHz 10 pF C OUT Output Capacitance TA = 25°C, f = 1 MHz 10 pF Mode Temperature Range (Ambient) Supply Voltage Active Operation, Commercial 0°C to +70°C 4.75 V ≤ VCC ≤ 5.25 V Active Operation, Military –55°C to +125°C 4.50 V ≤ VCC ≤ 5.50 V M AXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8) O PERATING CONDITIONS To meet specified electrical and switching characteristics ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4)

12 x 10-bit Matrix Multiplier Video Imaging Products 08/16/2000–LDS.2250-L10 12345678901234567890123456789012123 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 1 234567890123456789012345678901212 3 12345678901234567890123456789012123 123456789012345678 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 1 2345678901234567 8 123456789012345678 SWITCHING CHARACTERISTICS LF2250– 33* 25* Symbol Parameter Min Max Min Max tCYC Cycle Time 33 25 tPWL Clock Pulse Width Low 15 10 tPWH Clock Pulse Width High 10 10 tS Input Setup Time 12 9 tH Input Hold Time 2 2 tD Output Delay 25 20 M ILITARY OPERATING RANGE (–55°C to +125°C) Notes 9, 10 (ns) LF2250– 33* 25 20 Symbol Parameter Min Max Min Max Min Max tCYC Cycle Time 33 25 20 tPWL Clock Pulse Width Low 15 10 6 tPWH Clock Pulse Width High 10 10 8 tS Input Setup Time 8 6 6 tH Input Hold Time 0 0 0 tD Output Delay 18 16 15 C OMMERCIAL OPERATING RANGE (0°C to +70°C) Notes 9, 10 (ns) 123456789012345678901234 1 2345678901234567890123 4 1 2345678901234567890123 4 123456789012345678901234 *DISCONTINUED SPEED GRADE

12 x 10-bit Matrix Multiplier Video Imaging Products 11 08/16/2000–LDS.2250-L SWITCHING WAVEFORMS : 9-TAP FIR FILTER — M ODE 01 CLK CWE 1-0 KA, KB, KC MODE 1-0 A, B 1 2 3 13 14 15 CASIN 15-0 01 10 11 Kx1 Kx2 Kx3 0 0 1.0 0 tPWH tPWLtS tH tD CASOUT 15-0 12 16 17 Q13 0 0 0 0 Q13KC1KC2KC3KB1 SWITCHING WAVEFORMS :3 X 3 MATRIX MULTIPLIER — M ODE 00 CLK CWE 1-0 KA, KB, KC MODE 1-0 A, B, C 1234 678 X11-0 Y11-0 Z11-0 01 10 11 00 Kx1 Kx2 Kx3 00 1 . 0 000 KA2 + KB2 + KC2 KA1 + KB1 + KC1 KA3 + KB3 + KC3 tPWH tPWLtS tH tD

12 x 10-bit Matrix Multiplier Video Imaging Products 08/16/2000–LDS.2250-L12 SWITCHING WAVEFORMS :3 X 3-PIXEL CONVOLVER — M ODE 10 CLK CWE 1-0 KA, KB, KC MODE 1-0 A, B, C 123 789 CASIN 15-0 01 10 11 Kx1 Kx2 Kx3 0 0 1.0 0 tPWH tPWLtS tH tD CASOUT 15-0 61 0 1 1 0 0 0 0 KA1 + KB1 + KC1KA2 + KB2 + KC2KA3 + KB3 + KC3 SWITCHING WAVEFORMS :4 X 2-PIXEL CONVOLVER — M ODE 11 CLK CWE 1-0 KA, KB, KC MODE 1-0 A, B 123 789 CASIN 15-0 01 10 11 Kx1 Kx2 Kx3 0 0 1.0 0 tPWH tPWLtS tH tD CASOUT 15-0 61 0 1 1 0 0 0 0 KC1 + KC3KA1 + KB1KA2 + KB3KA3 + KB3

12 x 10-bit Matrix Multiplier Video Imaging Products 13 08/16/2000–LDS.2250-L 1. Maximum Ratings indicate stress specifications only. Functional oper- ation of these products at values be- yond those indicated in the Operating Conditions table is not implied. Expo- sure to maximum rating conditions for extended periods may affect reliability. 2. The products described by this spec- ification include internal circuitry de- signed to protect the chip from damag- ing substrate injection currents and ac- cumulations of static charge. Never- theless, conventional precautions should be observed during storage, handling, and use of these circuits in order to avoid exposure to excessive electrical stress values. 3. This device provides hard clamping of transient undershoot and overshoot. Input levels below ground or above V CC will be clamped beginning at –0.6 V and VCC + 0.6 V. The device can withstand indefinite operation with inputs in the range of –0.5 V to +7.0 V. Device opera- tion will not be adversely affected, how- ever, input current levels will be well in excess of 100 mA. 4. Actual test conditions may vary from those designated but operation is guaranteed as specified. 5. Supply current for a given applica- tion can be accurately approximated by: where N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency 6. Tested with all outputs changing ev- ery cycle and no load, at a 20 MHz clock rate. 7. Tested with all inputs within 0.1 V of V CC or Ground, no load. 8. These parameters are guaranteed but not 100% tested. NCV F NOTES 9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except t DIS test), and input levels of nominally 0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max respectively. Alternatively, a diode bridge with upper and lower current sources of IOH and IOL respectively, and a balancing voltage of 1.5 V may be used. Parasitic capacitance is 30 pF minimum, and may be distributed. This device has high-speed outputs ca- pable of large instantaneous current pulses and fast turn-on/turn-off times. As a result, care must be exercised in the testing of this device. The following measures are recommended: a. A 0.1 µF ceramic capacitor should be installed between V CC and Ground leads as close to the Device Under Test (DUT) as possible. Similar capacitors should be installed between device VCC and the tester common, and device ground and tester common. b. Ground and VCC supply planes must be brought directly to the DUT socket or contactor fingers. c. Input voltages should be adjusted to compensate for inductive ground and VCC noise to maintain required DUT input levels relative to the DUT ground pin. 10. Each parameter is shown as a min- imum or maximum value. Input re- quirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter- nal system must supply at least that much time to meet the worst-case re- quirements of all parts. Responses from the internal circuitry are specified from the point of view of the device. Output delay, for example, is specified as a maximum since worst-case opera- tion of any device always provides data within that time. 11. For the t ENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the ±200mV level from the measured steady-state output voltage with ±10mA loads. The balancing volt- age, V TH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Z- to-1 and 1-to-Z tests. 12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current. OE 0.2 V tDIStENA 0.2 V 1.5 V 1.5 V 3.0V Vth 1 Z 0 Z Z 1 Z 0 1.5 V 1.5 V 0V Vth VOL * VOH * VOL * VOH * Measured VOL with IOH = –10mA and IOL = 10mA Measured VOH with IOH = –10mA and IOL = 10mA IOH IOL VTHC L DUT FIGURE B. THRESHOLD LEVELS FIGURE A. OUTPUT LOADING CIRCUIT

12 x 10-bit Matrix Multiplier Video Imaging Products 08/16/2000–LDS.2250-L14 120-pin

ORDERING INFORMATION

C C 5 C 4 VCC C 3 C 2 C 1 C 0 B11 B10 CLK B A11 A10 GND CWE CWE 1 KA 9 KA 8 KA 7 KA 6 KA 5 KA 4 KA 3 KA 2 KA 1 ZC 6 ZC 7 ZC 8 GND ZC 9 ZC 10 ZC 11 KC 0 KC 1 KC 2 KC 3 GND KC 4 KC 5 KC 6 VCC KC 7 KC 8 KC 9 KB 0 KB 1 KB 2 KB 3 KB 4 KB 5 KB 6 KB 7 KB 8 KB 9 KA 0 Top View 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 (Q1) LF2250QC25 LF2250QC20 0°C to +70°C — COMMERCIAL SCREENING –55°C to +125°C — MIL-STD-883 COMPLIANT –55°C to +125°C — COMMERCIAL SCREENING Speed 25 ns 20 ns –55°C to +125°C — MIL-STD-883 COMPLIANT –40°C to +85°C — COMMERCIAL SCREENING 0°C to +70°C — COMMERCIAL SCREENING

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C D E F G H J K L M N Top View Through Package (i.e., Component Side Pinout) 12345 6 7 8 9 10 11 XC 9 XC 5 XC 2 XC 0 YC 10 YC 8 YC 0 YC 2 ZC 0 ZC 4 ZC 7 ZC 8 XC 10 XC 8 XC 6 XC 3 GND VCC GND VCC GND ZC 3 ZC 6 ZC 9 ZC 10 MODE 0 XC 11 VCC GND ZC KC 1 C 11 MODE 1 GND KC 0 KC 2 KC 3 C 8 C 9 C 10 GND KC 4 KC 5 C 7 C 6 GND VCC KC 6 KC 7 C 5 C 4 VCC KB 0 KC 9 KC 8 C 3 C 2 C 0 KB 4 KB 2 KB 1 C 1 B11 KB 8 KB 5 KB 3 KEY 12 13 XC 7 XC 4 XC 1 YC 11 YC 9 YC 1 YC 3 ZC 1 ZC 2 ZC 5 B10 CLK A11 GND KA 8 KA 4 KA 1 KB 9 KB 6 CWE 1 KA 7 KA 5 KA 2 KB 7 A10 CWE 0 KA 9 KA 6 KA 3 KA 0 (G4) 120-pin 0°C to +70°C — COMMERCIAL SCREENING –55°C to +125°C — COMMERCIAL SCREENING –55°C to +125°C — MIL-STD-883 COMPLIANT Discontinued Package