P02221B2P EUDYNA | Alldatasheet

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T Specifications and information are subject to change without notice. 2005-07 Eudyna Devices Inc. 1,K anai-cho, Sakae-ku, Yokohama, 244-0845 Japan echnical Note P02221B2P 500mW InGaP HBT Amplifier ♦Features

  • 1.8 to 2.5GHz Frequency Band
  • +26.5dBm Output Power
  • +43dBm Output IP3
  • +5V Single Supply Voltage
  • 14dB Gain at 2.14GHz
  • Highly Reliable InGaP HBT
  • Pb-free SOT-89 SMT Package
  • AuSn Die Attach for Low and S table Thermal Resistance ♦Applications
  • Wireless communication system
  • Cellular, PCS, PHS, W-CDMA, WLAN ♦Description P02221B2P is a high perfo rmance InGaP/GaAs HBT amplifier housed i n a low-cost SOT-89 package. T he hetero-junction epi taxial str ucture has be en desi gned to achieve low distortion, which leads to high IP3. The device needs only a +5V single power supply voltage in operation. Utilization of AuSn die attach has realized a low and stable thermal resistance. ♦Functional Diagram Pin No. Function

1 RF Input

2, 4 Ground

3 RF Output

♦Ordering Information Part No Description Number of devices Container P02221B2P HBT Amplifier 1000 7” Reel KP035J 2.14GHz Application Circuit 1 Anti-static Bag ♦Absolute Maximum Ratings (@Tc=25°C) Parameter Symbol Value Units Device Voltage Vd 6 V Device Current Id 500 mA RF Input Power (continuous) Pin 15 dBm Power Dissipation Pt 2 W Junction Temperature Tj +150 °C Storage Temperature Tstg - 40 to +150 °C Tc: Case Temperature. Operating the device beyond any of these values may cause permanent damage. ♦Electrical Specifications (@Tc=+25°C, Vs=+5V) Measured at 2140MHz using application circuit. Values Parameter Symbol Test Conditions Min. Typ. Max. Units Consumption Current Is RF=off 247 294 341 mA IP3_12 Pout=12dBm S.C.L. --- 43 --- dBm Output IP3 IP3_15 Pout=15dBm S.C.L. 38.5 41 --- dBm Output Power @ 1dB Gain Compression P1dB --- 24.5 26.5 --- dBm Small Signal Gain Ga 12.5 14 --- dB Input Return Loss S11 --- -10 --- dB Output Return Loss S22 Pin=-10dBm --- -8 --- dB Thermal Resistance Rth Junction-Case --- 37 --- °C/W 31 2 Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com W eb Site : www.eudyna.com -1-

Specifications and information are subject to change without notice. 2005-07 Eudyna Devices Inc. 1,K anai-cho, Sakae-ku, Yokohama, 244-0845 Japan ♦Application Circuit : 2140MHz Vs RF in RF out L2 L1 C6 C7 C5C4 3.3Ω 360Ω 360Ω 15nH 16nH 82pF 82pF 0.75pF 2.7nH 50Ω EL1 2.4pF 18pF 1uF 1000pF DUT 4.5deg Vd -40 -30 -20 -10 Frequency (GHz) S-parameters (dB) S21 S12 S11 S22 RF in RF out C6 C7 L1L2L3 VsGnd Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com W eb Site : www.eudyna.com -2-

Specifications and information are subject to change without notice. 2005-07 Eudyna Devices Inc. 1,K anai-cho, Sakae-ku, Yokohama, 244-0845 Japan [Typical Performance] (Vs=5V, Tc=25°C, f=2140MHz) Pout (dBm) Pout, Gain, IP3, Id vs Pin -10 -5 0 5 10 Pin (dBm) Gain (dB) IP3 (dBm) 250 260 270 280 290 300 310 320 330 340 350 Is (mA) IP3 Pout Gain Is Gain vs Frequency 13.0 13.2 13.4 13.6 13.8 14.0 14.2 14.4 14.6 14.8 15.0 Frequency (GHz) Gain (dB) Pin=-10dBm f1=2139.5MHz f2=2140.5MHz IM3, IM5 vs Pout -90 -80 -70 -60 -50 -40 -30 -20 -10 0 5 10 15 20 25 Pout (dBm) IM3 (dBc) IM5 (dBc) IM3 IM5 ACLR vs Pout -90 -80 -70 -60 -50 -40 -30 -20 -10 0 5 10 15 20 25 Pout (dBm) ACLR 5MHz (dBc) 3GPP Test Model 1 with 64DPCHs ABS(I+Q)=100% f1=2139.5MHz f2=2140.5MHz Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com W eb Site : www.eudyna.com -3-

Specifications and information are subject to change without notice. 2005-07 Eudyna Devices Inc. 1,K anai-cho, Sakae-ku, Yokohama, 244-0845 Japan ♦Attention to Heat Radiation In the layout design of the printed circuit board (PCB) on which the InGaP HBT Am plifier are attached, the heat radiation to minimize the device junction temperature should be taken into account, since it significantly affects the MTTF and RF performance. In any environment, the j unction temperature should be lower than the absolute maximum rating during the device operation and it is recommended that the thermal design has enough margin. The junction temperature can be calculated by the following formula. Tjmax=(Vd*Id-Pout)(Rth+Rboard+Rhs)+Ta Vd: Device voltage Id: Device current Pout: Output power Rth: Thermal resistance between junction and case Rboard: Thermal resistance of PCB Rhs: Thermal resistance of heat sink Ta: Ambient temperature Tjmax: Maximum junction temperature Generally, there are two ways of heat radiation. One is the plated thru hole and the other is the heat sink. Key points will be il lustrated i n each case below. No te t hat no m easure against oscillation is adopted in the figures. In the design of circuit and layout, you should take stabilizing into account if necessary. [Using Thru Hole] □Multiple plated thru holes are required directly below the device. □Place more than 2 machine screws as close to the ground pin (p in 4) as p ossible. T he PCB is screwed on t he mounting p late or the h eat s ink t o lower the thermal resistance of the PCB. □Lay out a large ground pad area with multiple plated thru holes around pin 4 of the device. □The required matching and feedback circuit described in the application circuit examples should be connected to the device, although it is not shown in the figure below. [Using Heat Sink] φ0.4 Plated Thru Holes φ3 Plated Thru Hole for 2.5 Machine Screws Package Outline 4-R0.3 Heatsink 2.95 0.6 1.9×2.85 (4-R0.3) φ5 Soldermask Keepout φ3 Plated Thru Hole for 2.5 Machine Screws φ5 Soldermask Keepout Grand Plane Grand Plane φ0.4 Plated Thru Holes φ3 Plated Thru Hole for 2.5 Machine Screws Package Outline 4-R0.3 Heatsink 2.95 0.6 1.9×2.85 (4-R0.3) φ5 Soldermask Keepout φ3 Plated Thru Hole for 2.5 Machine Screws φ5 Soldermask Keepout Grand Plane Grand Plane If you cannot get the junction temperature lower than the absolute maximum rating only with the plated thru holes, then you need to employ the heat sink. Attaching the heat sink directly under pin 4 of the device improves the thermal resistance between junction and ambient. φ0.4 Plated Thru Holes φ0.3 Plated Thru Holes φ3 Plated Thru Hole for 2.5 Machine Screws φ5 Soldermask Keepout Package Outline Keepout φ3 Plated Thru Holefor 2.5 Machine Screws Grand Plane φ5 Soldermask φ0.4 Plated Thru Holes φ0.3 Plated Thru Holes φ3 Plated Thru Hole for 2.5 Machine Screws φ5 Soldermask Keepout Package Outline Keepout φ3 Plated Thru Holefor 2.5 Machine Screws Grand Plane φ5 Soldermask [Note] □Ground/thermal vias are cri tical for t he proper device performance. Drills of the recommended diameters should be used in the fabrication of vias. □Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. □Mounting screws can be added near the part to fasten the board to heat sink. Ensure that the ground/thermal via region contacts the heat sink. □Do not put solder mask on the backside of the PCB in the region where the board contacts the heat sink. □RF trace wi dth depends upon the PCB material and construction. □Use 1 oz. Copper minimum. Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com W eb Site : www.eudyna.com -4-

Specifications and information are subject to change without notice. 2005-07 Eudyna Devices Inc. 1,K anai-cho, Sakae-ku, Yokohama, 244-0845 Japan ♦Package Drawing ♦Laser Marking ♦Convection Reflow Profile (Recommended) [Note] The reflow profile is different from the o ne for Sn-Pb plating 1 2 3 4.5 ± 0.1 1.6+0.15 φ1.0 ± 0.3 2.5 ± 0.1 4.0 ± 0.25 1.1 ± 0.3 0.42+0.03 -0.02 0.1 ± 0.05 -0.2 (1.7) (0.25) (45º) 1 2 3 4.5 ± 0.1 1.6+0.15 φ1.0 ± 0.3 2.5 ± 0.1 4.0 ± 0.25 1.1 ± 0.3 0.42+0.03 -0.02 0.1 ± 0.05 -0.2 (1.7) (0.25) (45º) If you use a s oldering iron t o a ttach the devices, please beware of the followings. (1) The tip of the iron should be grounded. Or you should use an iron that is electrostatic discharge proof. (2) The temperature of the iron tip should be l ower than 240°C and t he soldering should be c ompleted within 10 seconds. ♦Attention to ESD Generally, GaAs devices are very sensitive to electrostatic discharge (ESD). To reduce the ESD damage, please pay attention to the followings. The devices should be stored with the electrodes short-circuited by conductive materials. The workstation and tools sh ould be grounded for safe dissipation of the static c harges in the environment. The workpeople are to wear anti-static clothing and wrist straps. For safety reasons, resistance of 10MΩ or so should exist between workpeople and ground. 1.3+0.1 1.65MAX B A (0.65) A: 0.67+0 -0.1 B: 0.45 1,2,3: Lot No. * * P: Product Type ♦Moisture Sensitivity Level The moisture sensitivity level (MSL) of P02221B2P is 1, which means that the “floor life” is unlimited below 30°C with relative humidity (Rh) of 85%. ♦Reliability and Environmental Issues Eudyna’s Y okohama W orks, where the devices are manufactured, has been accredited ISO-14001 since 1999. We control the toxic materials in our products in accordance with PRTR regulation. ♦ Lead and Fluoride To realize Pb-free products, Sn-Bi is used for the lead frame plating. Any fluoride t hat h as bee n determined by th e Montreal agreement is not used in the products. 60 120 180 240 100 200 300 Temperature (°C) Time (sec) Preheat:160°C 90 sec < 45 sec 260 ± 5°C 5sec max Time above 230°C 60 120 180 240 100 200 300 Temperature (°C) Time (sec) Preheat:160°C 90 sec < 45 sec 260 ± 5°C 5sec max Time above 230°C 60 120 180 240 100 200 300 Temperature (°C) Time (sec) Preheat:160°C 90 sec < 45 sec 260 ± 5°C 5sec max Time above 230°C ♦ Compliance with RoHS This product is in compliance with Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 f or t he restric tion of use of certain hazardous substances in e lectrical and electronics equipment (RoHS Directives). Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com W eb Site : www.eudyna.com -5-

Specifications and information are subject to change without notice. 2005-07 Eudyna Devices Inc. 1,K anai-cho, Sakae-ku, Yokohama, 244-0845 Japan ♦Caution InGaP/GaAs HBT chips are used in P02221B2P. For safety reasons, you should attend to the following matters: (1) Do not put the products in your mouse. (2) Do not make the products into gases or powders, by burning, breaking or chemical treatments. (3) In case you abandon the products, you should obey the related laws and regulations. ¾ The i nformation in this document is su bject t o c hange wit hout notice. Pl ease refer for the most up-to-date information before you start design using Eudyna’s devices. ¾ Any part of this document may not be reproduced or copied. ¾ Eudyna does not ass ume any lia bility for infrin gement of pat ents, copy rights or oth er in tellectual property rig hts of th ird p arties by or arising fro m the use of E udyna’s pr oducts d escribed i n t his documents. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Eudyna or others. ¾ Descriptions of circuits and other related information in this document are for illustrative purpose in the examples of the device operation and app lication. Eudyna does not assume any responsibility for any losses incurred by cus tomers or t hird p arties arising f rom the use of t he circuits an d other r elated information in this document. ¾ Eudyna’s s emi-conductor de vice pro ducts are d esigned and m anufactured f or use i n the standard communication equipment. Customers that wish to use these products in applications not intended by Eudyna must contact Eudyna’ sales representatives in advance. ¾ Generally, it is im possible to e liminate com pletely t he defects in sem i-conductor products, w hile Eudyna has been c ontinually i mproving the q uality a nd reli ability o f the pr oducts. Eudy na d oes not assume any responsibility for any losses incurred by customers or t hird parties by or arisi ng from the use of Eudyna’s semi-conductor products. Customers are to incorporate sufficient safety measures in the design such as redundancy, fire-containment and anti-failure features. Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com W eb Site : www.eudyna.com -6-