GPLB13A GENERALPLUS | Alldatasheet
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GENERALPLUS TECHNOLOGY INC. reserves the right to change this documentation without prior notice. Information provided by GENERALPLUS TECHNOLOGY INC. is believed to be accurate and reliable. However, GENERALPLUS TECHNOLOGY INC. makes no warranty for any errors which may appear in this document. Contact GENERALPLUS TECHNOLOGY INC. to obtain the latest version of devi ce specifications before plac ing your order. No responsibility is assumed by GENERALPLUS TECHNOLOGY INC. for any infringement of patent or other rights of third parties which may result from its use. GG FEB. 01, 2007 Version 1.2 PPLLBB1133AA
66600 DDOOTTSS DDAATTAA BBAANNKK
In addition, GENERALPLUS products are not authorized for use as critical components in life s upport devices/systems or aviation devices/systems, where a malfunction or failure of the product may reasonably be expected to result in significant injury to the user, without the express written approval of Generalplus.
© Generalplus Technology Inc. Proprietary & Confidential 2 FEB. 01, 2007 Version: 1.2 Table of Contents PAGE
© Generalplus Technology Inc. Proprietary & Confidential 3 FEB. 01, 2007 Version: 1.2
660 DOTS DATA BANK
- GENERAL DESCRIPTION GPLB13A, a low power 8-bit CMOS microcontroller with advanced processing technology and mechanism by Generalplus, contains tons of functionality in a compact package such as SRAM, ROM, I/Os, an interrupt controller, a timer and a LCD controller/driver. The amount of 60K bytes of ROM is capable to provide sufficient space for LCD graphical data. The 2432 bytes of SRAM are totally free to users. In addition, 18 I/Os, timer, LCD driver, NMI controller, Watch Dog Timer and other features increase the capability of driving sophisticated functions and displaying fantastic LCD graphics. The GPLB13A is a high-end microcontroller that filled with modern technology and strong backup from Generalplus. Obvious ly, it is the most suitable product to accomplish the demanded functions for you. 2. BLOCK DIAGRAM 32.768KHz Oscillator pre-scaler One 8-bit Auto reload Timers 8-bit RISC Processor Interrupt/wakeup Control 60K bytes ROM 2K +384 bytes RAM LCD dual port RAM
60 SEGMENTS x 11 COMMONS LCD DRIVER
18 I/O ports
PA7-1(I/O) PD5-0(I/O) PC3-0(I/O) COM11 - 1 SEG60 - 1 X32O X32I PA0 RC-Oscillator CPU clock Battery detector Battery 3. FEATURES Built-in 8-bit CPU ─ 60K bytes ROM ─ 2432 bytes SRAM ─ Max. operating speed: 1.5MHz @ 1.2V NMI controller ─ 2Hz for Real Time Clock (RTC) ─ 128Hz ─ Key(PA6 - 0) ─ Counter overflow ─ Low Battery Voltage Detect (PA7 is an IRQ source) Programmable LCD driver ─ Up to 60 segments, up to 11 commons, maximum 660 dots In 1/4 duty, COM[5:11] are optioned to SEG[60:54] 53*11, 54*10, 56*8, 60*4 LCD configurations (by soft) In 1/11duty, PortC[3:0] and PortD[5:3] can be optioned to SEG[54:60] (by mask option) ─ 1/3, 1/4 bias, 1/4, 1/8, 1/10 or 1/11 duty ─ Adjustable LCD voltage (16 level) 1/4 bias: 2.65V - 3.4V 1/3 bias: 2.4V - 3.3V ─ 88 bytes dedicated LCD RAM Operating voltage: ─ 1.1V - 1.7V Adjustable CPU clock speed ─ 5 speed : 1, 1/2, 1/4, 1/8, 1/16 of RC-oscillator frequency are available Low-power consumption: ─ 30μ A operating current @1.5V, FCPU = 260KHz ─ 9 μA halt mode current @ 1.5V, FCPU = 260KHz ─ <1.0μ A typical standby current @ 1.5V 0.9V low voltage reset Power saving SLEEP mode 1.2V battery low voltage detector Peripherals ─ 18 I/O ports (PA7 - 0, PD5 - 0, PC3 - 0) ─ Built-in RC-oscillator ─ Built-in 32.768KHz crystal oscillator for real time clock Function ─ 8-bit reloadable timer/counter with prescaler ─ Watchdog Timer for reliable operation 4 options for RC-oscillator ─ 260KHz, 470KHz, 850KHz and 1800KHz @ 1.5V
© Generalplus Technology Inc. Proprietary & Confidential 4 FEB. 01, 2007 Version: 1.2 4. SIGNAL DESCRIPTIONS Mnemonic Type Description VDD P Power supply input VSS P Ground reference RESET I System reset input (internal pull-high), low active TEST I Test input (internal pull-low), high active X32I I 32.768KHz crystal input X32O O 32.768KHz crystal output PA7 - 0 I/O Bi-directional I/O port PD2 – 0 PD3/SEG60 PD4/SEG59 PD5/SEG58 I/O Bi-directional I/O port Bi-directional I/O port / LCD Segment 60 (Decided by Mask Option) Bi-directional I/O port / LCD Segment 59 (Decided by Mask Option) Bi-directional I/O port / LCD Segment 58 (Decided by Mask Option) PC0/SEG57 PC1/SEG56 PC2/SEG55 PC3/SEG54 I/O Bi-directional I/O port / LCD Segment 57 (Decided by Mask Option) Bi-directional I/O port / LCD Segment 56 (Decided by Mask Option) Bi-directional I/O port / LCD Segment 55 (Decided by Mask Option) Bi-directional I/O port / LCD Segment 54 (Decided by Mask Option) BATTERY I Battery voltage detect pin VLCD O LCD drive voltage output pin O LCD drive voltage output pins CUP1 CUP2 I Capacitor connection pins for LCD bias circuit CUP3 CUP4 I Capacitor connection pins for generate analog VDD (AVDD) AVDD O Analog power output COM4 - 1 O LCD common outputs COM5/SEG60 O LCD Common 5/Segment 60 (Decided by software programming) COM6/SEG59 O LCD Common 6/Segment 59 (Decided by software programming) COM7/SEG58 O LCD Common 7/Segment 58 (Decided by software programming) COM8/SEG57 O LCD Common 8/Segment 57 (Decided by software programming) COM9/SEG56 O LCD Common 9/Segment 56 (Decided by software programming) COM10/SEG55 O LCD Common 10/Segment 55 (Decided by software programming) COM11/SEG54 O LCD Common 11/Segment 54 (Decided by software programming) SEG16 - 1 O LCD segment outputs SEG53 - 17 O LCD segment outputs Legend: I = Input, O = Output, P = Power Total 98 pins Note: When ROSC mode is selected, pin X32I should be floating or connected to VSS and X32O should be floating.
© Generalplus Technology Inc. Proprietary & Confidential 5 FEB. 01, 2007 Version: 1.2 5. FUNCTIONAL DESCRIPTIONS 5.1. Map of Memory and I/Os LCD RAM I/O ports, Register CPU working RAM, STACK
384 Bytes
Test Program ROM 1.5K Data RAM 2K Bytes User Program ROM 58K Bytes $0000 $007F $0080 $01FF $0200 $0FFF $1000 $17FF $1800 $0057 $0058 $FFFF *MEMORY MAP*I/O PORT: - PORT A_DATA $0073 PORT A_DIR $0071 PORT A_Buzzer output $0072 - PORT B_DATA $006F PORT B_DIR $006E PORT B_CFG $006D - PORT C_DATA $005F PORT C_DIR $005E PORT C_CFG $005D *NMI SOURCE: - 2Hz - 128Hz - Power key (PA0) - Normal key (PA6-1) - Counter overflow - Low Battery User Program ROM 2K $07FF $0800 5.2. Operating States The GPLB13A supports three operating states: standby, halt, and operating. Following table shows the differences between the three operating states. Operating Halt Standby CPU ON OFF OFF 32768 oscillator ON ON OFF LCD driver ON ON/OFF OFF In operating state, all modules (CPU, 32768 oscillator, timer/counter, LCD driver…) are activated. The halt/standby state is entered by writing to SL EEP register ($7A). There are four wake-up sources in GPLB13A: port A wake-up, counter overflow wake-up, 128Hz wake-up and 2Hz wake-up. If any wake-up event occurs, CPU will go to the RESET state. When in standby, all modules will be shut down, and RAM and I/Os remain in their previous stat es. The current consumption is minimized in standby. By writing to SLEEP register but keeps 32768 oscillator running, the system is in halt state. In halt state, CPU clock is halted while it waits for an event (key press, timer overflow) to generate a wake-up. The 32768 related modules (timer/counter, LCD driver…) may remain active in the halt state. Following figure is a state diagram for the GPLB13A. State Diagram of GPLB13A 5.3. CPU Clock GPLB13A provides programmable CPU clock speed 1, 1/2, 1/4, 1/8, or 1/16 of RC-oscillator frequency for power saving mode. When the system is under heavy load or the voltage of battery is low, user can reduce power cons umption by slowing down the speed of CPU clock. 5.4. Low Battery Voltage Detector The GPLB13A provides a 1.2V battery voltage detector to detect the voltage of the BATTERY pin. User can read the state of battery from port $6B. If the battery is higher than 1.2V, $6B.bit5 will be '0', else will be '1'. 5.5. Buzzer Driver Port A can be used as buzzer output. When $72.b6 = b7 = ’1’, PortA.6 and PortA.7 are set for buzzer output. Or else when b6 = b7 = ’0’, PortA.6 and PortA.7 are set to normal I/O. When down counter overflows, it will toggle PA.6 and PA.7 for driving buzzer. 5.6. LCD Controller/Driver GPLB13A contains total of 660 dots LCD controller and driver. Once the LCD configuration is in itialized, the desired pattern can be displayed by filling the LCD buffer with appropriate data. The LCD driver can also operate during sleep by keeping 32768 oscillator running. The LCD driver in GPLB13A is designed to fit most LCD specifications. The duty is programmable as 1/4, 1/8, 1/10 or 1/11. The following table shows the mapping between LCD and display buffer. HALT OPERATING STANDBY Write to SLEEP register, 32768 oscillator OFF Wake-up or user reset Write to SLEEP register, 32768 oscillator ON Wake-up or use r reset
© Generalplus Technology Inc. Proprietary & Confidential 6 FEB. 01, 2007 Version: 1.2 5.6.1. LCD RAM mapping SEG8 - 1 (b7 - 0) SEG16 - 9 (b7 - 0) SEG24 - 17 (b7 - 0) SEG32 - 25 (b7 - 0) SEG40 - 33 (b7 - 0) SEG48 - 41 (b7 - 0) SEG56 - 49 (b7 - 0) SEG60 - 57 (b3 - 0) COM1 07H 06H 05H 04H 03H 02H 01H 00H COM2 0FH 0EH 0DH 0CH 0BH 0AH 09H 08H COM3 17H 16H 15H 14H 13H 12H 11H 10H COM4 1FH 1EH 1DH 1CH 1BH 1AH 19H 18H COM5 27H 26H 25H 24H 23H 22H 21H 20H COM6 2FH 2EH 2DH 2CH 2BH 2AH 29H 28H COM7 37H 36H 35H 34H 33H 32H 31H 30H COM8 3FH 3EH 3DH 3CH 3BH 3AH 39H 38H COM9 47H 46H 45H 44H 43H 42H 41H 40H COM10 4FH 4EH 4DH 4CH 4BH 4AH 49H 48H COM11 57H 56H 55H 54H 53H 52H 51H 50H Note: Bit 7-4 of $00H, $08H, $10H, $18H, $20H, $28H, $30H, $38H, $40H, $48H, $50H, Users can not access these ram contents, and do not use these rams as data storage. 5.7. LCD Voltage Doubler/Regulator To get the best LCD quality, the LCD supply voltage should not change with the system power. The GPLB13A provides a robust and adjustable (16-level) LCD supply voltage. Users can get desired VLCD to fit specific L CD panels by changing the output reference voltage (program $5A). The available VLCD voltage range is summarized as the following table. The default value of LCD voltage is 2.82V(1/3 Bias), 3.0V(1/4 Bias). $5A 07 06 05 04 03 02 01 00 LCD Voltage $5A 0F 0E 0D 0C 0B 0A 09 08 LCD Voltage Note: In 1/3 Bias Mode, LCD voltage ($5A is 0F) is not 3.3V, when VDD is smaller than 1.1V. LCD Voltage will decease with VDD (VLCD is about 3*VDD). 5.8. Reset Function GPLB13A can be reset by setting the RESET pin to ground voltage and its operation starts when this pin is set to power voltage. The RESET pin is internally pulled high. Beside, an automatic reset function (internal reset function) operates when power is turned on. Low voltage reset function is a mask option. When the low voltage reset option is set to enable. The chip will generate a reset signal to reset the system when the system voltage is below 0.9V. Watchdog timer is available on GPLB13A. The WDT is designed for the system to recover from abnormal operation. When the system is hanged, WDT will generate a system reset to restart the system after 1 second. The WDT should be cleared every 0.5 seconds to avoid accidental reset. Writing to port $7F can clear the WDT. Note that the WDT works only when 32768 Hz clock or pre-scalar clock is active. 5.9. Mask Options 5.9.1. 32768 oscillator 1). X’TAL 2). R-oscillator 5.9.2. Watchdog timer 1). Enable 2). Disable 5.9.3. PA3, PA4, PA5 input mode selection mode 1). Pull-high 2). Floating
© Generalplus Technology Inc. Proprietary & Confidential 7 MAR. 30, 2006 Version: 1.0 5.9.4. System low voltage reset detector 1). Enable 2). Disable 5.9.5. Battery low voltage detector 1). Enable 2). Disable 5.9.6. SEGMENT/IO Note1: When P_70H_LCD_Configuration is set to 1/4 duty, pin COM[5:11] is always optioned as SEG[60:54] which means the display is 4 (COM) x 60 (SEG). Those pins shared with SEG[54:60] can also be used as their original functions, not necessary to the SEG function only. For example, in 1/4 duty mode, the PortC[3:0] can also be used as ordinary I/O and similarity applies for other pins as well. This identity also applies to the 1/8 duty and 1/10 duty modes. Note2: In 1/8 duty mode, pin COM[9:11] is always optioned as SEG[56:54]. A display of 8(COM) x 56 (SEG) is formed, see note #1 for more information. To achieve a 8 (COM ) x 60 (SEG) in 1/8 duty mode, the PortC[0] and PortD[5:3] must be configured as SEGs via mask option and cannot be used as I/O any more. Note3: In 1/10 duty setup, pin COM11 is used as the SEG54, which forms 10 (COM) In 1/10 duty setup, 10 (COM) x 54 (SEG) dots, see note #1 for more information. To achieve higher number of LCD dot, see note #2 for details.
© Generalplus Technology Inc. Proprietary & Confidential 8 FEB. 01, 2007 Version: 1.2 6. ELECTRICAL SPECIFICATIONS 6.1. Absolute Maximum Ratings Characteristics Symbol Ratings DC Supply Voltage VDD < 3.0V Input Voltage Range VIN -0.5V to VDD + 0.5V Operating Temperature TA 0℃ to +60℃ Storage Temperature TSTO -50℃ to +150℃ Note: Stresses beyond those given in the Absolute Maximum Rating tabl e may cause operational errors or damage to the device. For normal operational conditions see AC/DC Electrical Characteristics. 6.2. DC Characteristics (VDD = 1.5V, TA = 25℃) Limit Characteristics Symbol Min. Typ. Max. Unit Test Condition Operating Voltage VDD 1.1 1.5 1.7 V - Operating Current1 IOP1 - 130 - μA FCPU = 1800KHz @ VDD = 1.5V, no load Operating Current2 IOP2 - 25 - μA FCPU = 260KHz @ VDD = 1.5V, no load Halt Mode Current Ihalt - 9.0 - μA FCPU = 260KHz @ VDD = 1.5V, no load CPU Clock FCPU - - 1500K Hz VDD = 1.2V Standby Current ISTBY - - 1.0 μA VDD = 1.5V, 32768 Hz OFF Input High Level VIH 1.0 - - V VDD = 1.5V Input Low Level VIL - - 0.5 V VDD = 1.5V Input Current IIL - - 5.0 μA VDD = 1.5V, VIN = 0V (input internal pull high) Output High Current (BZ) IOH - -2.5 - mA VDD = 1.5V, VOH = 1.0V Output Sink Current (BZ) IOL - 2.5 - mA VDD = 1.5V, VOL = 0.5V Output High Current (I/O) IOH - -250 - μA VDD = 1.5V, VOH = 1.0V Output Sink Current (I/O) IOL - 450 - μA VDD = 1.5V, VOL = 0.5V 6.3. The Relationships between the VDD and the Fcpu 400 800 1200 1600 2000 2400 2800 VDD(Volt) Fcpu(KHz)
© Generalplus Technology Inc. Proprietary & Confidential 9 FEB. 01, 2007 Version: 1.2 7. APPLICATION CIRCUITS 7.1. Application Circuit - (1) Note*: These capacitor values are for design guidance only. Different capacitor values may be required for different crystal/resonator used. GPLB13A PA5 PA6 PA7 PA4 PA3 PA2 PA1 PA0 PD0 PD1 PD2 TEST SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 I/O DEVICE LCD COM [ 11:1 ] SEG [ 60:1 ] GPLB13A application circuit COM1 COM2 COM10 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 I /O CUP2 RESET X32I X32O VDD VDD2 CUP1 VDD1 VDD 0.22µF RESET 12-20pF* 12-20pF* 32768Hz AVDD Note: To avoid the noise interference on PCB, all the wires of crystal oscillator should be as short as possible. SEG59 SEG60 VDD3 VLCD CUP3 CUP4 COM11 BATTERY VDD 0.1µF 0.1µF 0.22µF 0.1µF 0.1µF 0.1µF 0.1µF 0.1µF
© Generalplus Technology Inc. Proprietary & Confidential 10 FEB. 01, 2007 Version: 1.2 7.2. Application Circuit - (2) Note1: In CRYSTAL mode, an accurate time base is generated from the 32768Hz crystal oscillator. The 32768Hz crystal should be install ed. Note2: In ROSC mode, a suitable time base is generated from the RC-Oscillator. The 32768Hz crystal is not necessary to be installed. Note3: To avoid the noise interference on PCB around crystal circuit, following rules are recommended: Capacitors between the crystals should be placed as close as possible to X32I and X32O. A shielding by ground is suggested. Note4: These capacitor values are for design guidance only. Different capacitor values may be required for different crystal/resonator used. Note5: This schottky diode may be omitted if the leakage current of solar cell is small. GPLB13A PA5 PA6 PA7 PA4 PA3 PA2 PA1 PA0 PD0 PD1 PD2 TEST SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 I/O DEVICE LCD COM [ 11:1 ] SEG [ 60:1 ] GPLB13A application circuit on solar cell COM1 COM2 COM10 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 I /O CUP2 RESET X32I X32O VDD VDD2 CUP1 VDD1 22 µF RESET 0.1µF 12-20pF* 32768Hz AVDD SEG59 SEG60 VDD3 VLCD CUP3 CUP4 COM11 BATTERY Solar cell 1.5v Battery schottky Note: To avoid the noise interference on PCB, all the wires of crystal oscillator s hould be as short as possible. 0.1µF 0.1µF 0.1µF 0.1µF 0.22µF 0.1µF 0.1µF 12-20pF* Schottky
© Generalplus Technology Inc. Proprietary & Confidential 11 FEB. 01, 2007 Version: 1.2 8. DISCLAIMER The information appearing in this publication is believed to be accurate. Integrated circuits sold by Generalplus Technology are covered by the warranty and patent indem nification provisions stipulated in the terms of sale only. GENERALPLUS makes no warranty, express, statutory implied or by description regarding the information in t his publication or regarding the freedom of the described chip(s) from patent infringem ent. FURTHERMORE, GENERALPLUS MAKES NO WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. GENERALPLUS reserves the right to halt production or alter the specifications and prices at any time without notice. Acco rdingly, the reader is cautioned to verify that the data sheets and other information in this publication are current before placing orders. Products described herein are intended for use in normal co mmercial applications. Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical lif e support equipment, are specifically not recommended without additional proc essing by GENERALPLUS for such applications. Please note th at application circuits illustrated in this document are for reference purposes only.
© Generalplus Technology Inc. Proprietary & Confidential 12 FEB. 01, 2007 Version: 1.2 9. REVISION HISTORY Date Revision # Description Page FEB. 01, 2007 1.2 Delete ‘’Low voltage power down’ in 1.GENERAL DESCRIPTION. 3 JUL. 18, 2006 1.1 1. Add the Rosc diagram to section 6.3. 2. Modify the 7. APPLICATION CIRCUITS. 9,10 MAR. 30, 2006 1.0 Release. 12 AUG. 30, 2005 0.3 Change the sharing of IO and LCD segments. 1, 2, 5, 7, 8 AUG. 17, 2005 0.2 Add the information about 5. FUNCTIONAL DESCRIPTIONS, 6.ELECTRICAL SPECIFICATIONS and 7. APPLICATION CIRCUITS. 3~8 JUL. 28, 2005 0.1 Original 4