FMM5063X EUDYNA | Alldatasheet

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Technical content

Ku-Band Power Amplifier MMIC

FEATURES

  • High Output Power; P1dB = 32.0 dBm (Typ.)
  • High Linear Gain; GL = 30 dB(Typ)
  • Wide Frequency Band : 12.75 - 15.4 GHz
  • Impedance Matched Zin/Zout = 50Ω Edition 1.1 January 2006 FMM5063X

DESCRIPTION

The FMM5063X is a power amplifier MMIC that contains a three stage amplifier, internally matched, for standard communications band in 12.75 to 15.4GHz frequency range. This product is well suited for point-to-point radio and V-SAT. Eudyna’s stringent Quality Assurance Program assures the highest reliability and consistent performance. Device photo ABSOLUTE MAXMUM RATING (Ambient Temperature Ta=25 ℃℃℃℃) Item Stmbol Condition Unit Drain-Source Voltage VDD V Gate-Source Voltage VGG V Input Power Pin dBm Strage Temperature Tstg ℃ RECOMMENDED OPERATING CONDITION Item Symbol Condition Unit Drain-Source Voltage VDD V Input Power Pin dBm Operating Backside Temperature Top ℃ This product should be hermetically packaged. ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25 ℃℃℃℃) Min. Typ. Max. Frequency Range f VDD=6.0V 12.75 - 15.4 GHz Power Gain at 1dB G.C.P. G1dB Zs=Zl=50ohm 25 29 - dB Power Added Efficiency at 1dB G.C.P. Nadd - 22 - % Third Order Intermodulation IM3* -32 -37 - dBc Drain Current at 1dB G.C.P. Iddrf - 1000 1500 mA Input Return Loss at Pin=-20dBm RLin - -8 - dB Output Return Loss at Pin=-20dBm RLout - -12 - dB Note : RF parameter sample size 10ps. Criteria (accept/reject)=(0/1) G.C.P. : Gain Compression Point S.C.L. : Single Carrier Level ESD Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kW) Unit Class 0 ~ 199V Recommended *df=10MHz,Po=20dBm (S.C.L.) Rating -55 to +125 Test ConditionsItem Symbol Limits -40 to +85 http://www.eudyna.com/

Output Power vs. Frequency VDD=6V, IDD(DC)=900mA Ku-Band Power Amplifier MMIC FMM5063X Output Power, Drain Current vs. Input Power VDD=6V, IDD(DC)=900mA Frequency [GHz] Output Power [dBm] Pin=-8dBm Pin=-4dBm Pin=-0dBm P1dB Pin=+4dBm - 1 2 - 1 0 - 8 - 6 - 4 - 2 02468 Input Power [dBm] Output Power [dBm] 700 800 900 1000 1100 1200 1300 1400 1500 Drain Current [mA] 12.75GHz 14.0GHz 15.4GHz Power Added Efficiency vs. Frequency VDD=6V, IDD(DC)=900mA Frequency [GHz] Power Added Efficiency [%] Pin=-8dBm Pin=-4dBm Pin=-0dBm P1dB Pin=+4dBm

IMD vs. Output Power VDD=6V, IDD(DC)=900mA IMD vs. Frequency VDD=6V, IDD(DC)=900mA, Pout=20dBm S.C.L. Ku-Band Power Amplifier MMIC FMM5063X -60 -55 -50 -45 -40 -35 -30 Frequency [GHz] Intermodulation Distortion [dBc] IM3 IM5 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 17 19 21 23 25 27 29 31 33 2-tone Total Output Power [dBm] Intermodulation Distortion [dBc] 12.75GHz 14.0GHz 15.4GHz IM3 IM5

Output Power, Drain Current vs. Input Power by Drain Voltage IDD(DC)=900mA, f=12.75GHz Ku-Band Power Amplifier MMIC FMM5063X Output Power, Drain Current vs. Input Power by Drain Voltage IDD(DC)=900mA, f=14.0GHz -12 -10 -8 -6 -4 -2 0 2 4 6 8 Input Power [dBm] Output Power [dBm] 500 700 900 1100 1300 1500 1700 1900 2100 2300 Drain Current [mA] -12 -10 -8 -6 -4 -2 0 2 4 6 8 Input Power [dBm] Output Power [dBm] 500 700 900 1100 1300 1500 1700 1900 2100 2300 Drain Current [mA] Output Power, Drain Current vs. Input Power by Drain Voltage IDD(DC)=900mA, f=15.4GHz -12 -10 -8 -6 -4 -2 0 2 4 6 8 Input Power [dBm] Output Power [dBm] 500 700 900 1100 1300 1500 1700 1900 2100 2300 Drain Current [mA] Output Power, Gain vs. Drain Voltage IDD(DC)=900mA, f=15.4GHz 3456789 Drain Voltage [V] P1dB [dBm] G1dB [dB] 12.75GHz 14.0GHz 15.4GHz

Output Power, Drain Current vs. INPUT POWER by Drain Current VDD=6V, f=12.75GHz Ku-Band Power Amplifier MMIC FMM5063X -12 -10 -8 -6 -4 -2 0 2 4 6 8 Input Power [dBm] Output Power [dBm] 500 700 900 1100 1300 1500 1700 1900 2100 Drain Current [mA] 700mA 900mA 1100mA -12 -10 -8 -6 -4 -2 0 2 4 6 8 Input Power [dBm] Output Power [dBm] 500 700 900 1100 1300 1500 1700 1900 2100 Drain Current [mA] 700mA 900mA 1100mA Output Power, Drain Current vs. INPUT POWER by Drain Current VDD=6V, f=14.0GHz Output Power, Drain Current vs. INPUT POWER by Drain Current VDD=6V, f=15.4GHz -12 -10 -8 -6 -4 -2 0 2 4 6 8 Input Power [dBm] Output Power [dBm] 500 700 900 1100 1300 1500 1700 1900 2100 Drain Current [mA] 700mA 900mA 1100mA Output Power, Gain vs. Drain Current VDD=6V 600 700 800 900 1000 1100 1200 Drain Current [mA] P1dB [dBm] G1dB [dB] 12.75GHz 14.0GHz 15.4GHz

IMD vs. OUTPUT POWER by Drain Voltage IDD(DC)=900mA, f=12.75GHz Ku-Band Power Amplifier MMIC FMM5063X IMD vs. OUTPUT POWER by Drain Voltage IDD(DC)=900mA, f=14.0GHz IMD vs. OUTPUT POWER by Drain Voltage IDD(DC)=900mA, f=15.4GHz -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 17 19 21 23 25 27 29 31 33 Input Power [dBm] Intermodulation Distortion [dBc] IM3 IM5 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 17 19 21 23 25 27 29 31 33 Input Power [dBm] Intermodulation Distortion [dBc] IM3 IM5 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 17 19 21 23 25 27 29 31 33 Input Power [dBm] Intermodulation Distortion [dBc] IM3 IM5

IMD vs. OUTPUT POWER by Drain Current VDD=6V, f=12.75GHz Ku-Band Power Amplifier MMIC FMM5063X IMD vs. OUTPUT POWER by Drain Current VDD=6V, f=14.0GHz IMD vs. OUTPUT POWER by Drain Current VDD=6V, f=15.4GHz -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 17 19 21 23 25 27 29 31 33 2-tone Total Output Power [dBm] Intermodulation Distortion [dBc] 700mA 900mA 1100mA IM3 IM5 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 17 19 21 23 25 27 29 31 33 2-tone Total Output Power [dBm] Intermodulation Distortion [dBc] 700mA 900mA 1100mA IM3 IM5 -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 17 19 21 23 25 27 29 31 33 2-tone Total Output Power [dBm] Intermodulation Distortion [dBc] 700mA 900mA 1100mA IM3 IM5

Ku-Band Power Amplifier MMIC FMM5063X ■■■■S-PARAMETER S11 S22 14GHz 14GHz 16GHz 12GHz 16GHz 12GHz 0 ∞ +10j +25j +50j +100j +250j -10j -25j -50j -100j -250j 10Ω S12 S21 0.1 40±180° 0° -90° +90° Scale for |S21| Scale for |S12| 12GHz 14Hz 16Hz

Ku-Band Power Amplifier MMIC FMM5063X ■■■■S-PARAMETER Frequency [GHz] MAG ANG MAG ANG MAG ANG MAG ANG S11 S21 S12 S22 VDD=6V, IDD=900mA

ΔΔΔΔTch vs. Drain Voltage (Reference) IDD(DC)=900mA Ku-Band Power Amplifier MMIC FMM5063X MTTF vs. Tch 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 50 100 150 200 250 Tch (deg-C) MTTF (hrs) Ea=1.56eV 456789 VDD [V] ΔΔΔΔTch [℃℃℃℃]

Ku-Band Power Amplifier MMIC FMM5063X ■■■■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) 0 3435335 905 1350 2845 1385 0 0 150 125 2550 2770 1385 2575 2770 120 3315 0 3435335 905 1350 2845120 3315 RF-IN RF-OUT VGG1 (VGG2) VDD1 VDD2 VDD3 VDD5 VDD4 VDD6 Chip Thickness : 60±±±±20um Bonding Pad Size : 160um x 80um ＮｏｔｅＮｏｔｅＮｏｔｅＮｏｔｅ : Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2).

Ku-Band Power Amplifier MMIC FMM5063X ■■■■ Assembly Diagrams Recommended assembly 50ohm Line 50ohm Line 100pF 100pF 100pF 100pF 100pF100pF100pF VGG 1 uF VDD VDD 1 uF 1 uF “Copper” is the recommended material for the package or carrier.

Ku-Band Power Amplifier MMIC FMM5063X ■■■■DIE ATTACH 1) The die-attach station must have accurate temperature control, and an inert forming gas should be used. 2) Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Preform Volume : per next Figure ■■■■ WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N ± 0.0196 N Stage Temperature : 215 deg.C ± 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond 500 1000 1500 2000 2500 0 2 4 6 8 1 01 21 41 61 82 0 Area of Chip Bach Surface (mm^2) Volume of Au-Sn Perform (10 -3/mm3) FMM5063X

For further information please contact : Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others. CAUTION Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: ・Do not put these products into the mouth. ・Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by- products are dangerous to the human body if inhaled, ingested, or swallowed. ・Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Ku-Band Power Amplifier MMIC FMM5063X © 2006 Eudyna Devices Inc. Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: +1 408 232-9500 FAX: +1 408 428-9111 Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 Eudyna Devices International Srl Via Teglio 8/2 - 20158 Milano, Italy TEL: +39-02-8738-1695 Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Suite 1906B, Tower 6, China Hong Kong City

33 Canton Road, Tsimshatsui, Kowloon

TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc.

1000 Kamisukiahara, showa-cho

Nakakomagun, Yamanashi 409-3883, Japan (Kokubo Industrial Park) TEL +81-55-275-4411 FAX +81-55-275-9461 Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL +81-45-853-8156 FAX +81-45-853-8170