BT134W-500D

BT134W-500D KERSEMI | Alldatasheet

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heating and static switching. industrial and domestic lighting, applications include motor control, voltage capability and high thermal cycling performance. Typical I GENERAL DESCRIPTION SOT-223 BT134W series Glass passivated triacs in a plastic SYMBOL PARAMETER MAX. MAX. MAX. UNIT envelope suitable for surface mounting, intended for use in BT134W- 500 600 800 applications requiring high BT134W- 500F 600F 800F bidirectional transient and blocking BT134W- 500G 600G 800G DRM Repetitive peak off-state 500 600 800 V T(RMS) RMS on-state current 1 1 1 A TSM Non-repetitive peak on-state 10 10 10 A LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT -500 -600 -800 V DRM Repetitive peak off-state - 500 600 800 V voltages I T(RMS) RMS on-state current full sine wave; T sp ≤ 108 ˚C - 1 A I TSM Non-repetitive peak full sine wave; T j = 25 ˚C prior to on-state current surge t = 20 ms - 10 A t = 16.7 ms - 11 A I tI t for fusing t = 10 ms - 0.5 A s dI T /dt Repetitive rate of rise of I TM = 1.5 A; I G = 0.2 A; on-state current after dI G /dt = 0.2 A/µs triggering T2+ G+ - 50 A/ µs T2+ G- - 50 A/ µs T2- G- - 50 A/ µs T2- G+ - 10 A/ µs I GM Peak gate current - 2 A V GM Peak gate voltage - 5 V P GM Peak gate power - 5 W P G(AV) Average gate power over any 20 ms period - 0.5 W T stg Storage temperature -40 150 ˚C T j Operating junction - 125 ˚C temperature T1T2 G 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 3 A/µs. QUICK REFERENCE DATA SYMBOL voltages current V I 2014-6-15 www.kersemi.com1

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-sp Thermal resistance full or half cycle - - 15 K/W junction to solder point R th j-a Thermal resistance pcb mounted; minimum footprint - 156 - K/W junction to ambient pcb mounted; pad area as in fig:14 - 70 - K/W STATIC CHARACTERISTICS T j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT I GT Gate trigger current V D = 12 V; I T = 0.1 A T2+ G+ - 5 35 25 50 mA T2+ G- - 8 35 25 50 mA T2- G- - 11 35 25 50 mA T2- G+ - 30 70 70 100 mA I L Latching current V D = 12 V; I GT = 0.1 A T2+ G+ - 7 20 20 30 mA T2+ G- - 16 30 30 45 mA T2- G- - 5 20 20 30 mA T2- G+ - 7 30 30 45 mA I H Holding current V D = 12 V; I GT = 0.1 A - 5 15 15 30 mA V T On-state voltage I T = 2 A - 1.2 1.50 V V GT Gate trigger voltage V D = 12 V; I T V D = 400 V; I T T j = 125 ˚C I D Off-state leakage current V D = V DRM(max) ; - 0.1 0.5 mA T j = 125 ˚C DYNAMIC CHARACTERISTICS T j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT dV D /dt Critical rate of rise of V DM =67% V DRM(max) ; 100 50 200 250 - V/ µs off-state voltage T j = 125 ˚C; exponential waveform; gate open circuit dV com /dt Critical rate of change of V DM = 400 V; T j commutating voltage I T(RMS) = 1 A; dI com /dt = 1.8 A/ms; gate open circuit t gt Gate controlled turn-on I TM time V D = V DRM(max) ; I G = 0.1 A; dI G /dt = 5 A/µs; BT134W series 2014-6-15 www.kersemi.com

Fig.1. Maximum on-state dissipation, P tot , versus rms on-state current, I T(RMS) , where α = conduction angle. Fig.2. Maximum permissible non-repetitive peak on-state current I TSM , versus pulse width t p , for sinusoidal currents, t p 20ms. Fig.3. Maximum permissible non-repetitive peak on-state current I TSM , versus number of cycles, for sinusoidal currents, f = 50 Hz. Fig.4. Maximum permissible rms current I T(RMS) versus solder point temperature T sp Fig.5. Maximum permissible repetitive rms on-state current I T(RMS) , versus surge duration, for sinusoidal currents, f = 50 Hz; T sp 108˚C. Fig.6. Normalised gate trigger voltage V GT j )/ V GT (25˚C), versus junction temperature T j 0.2 0.4 0.6 0.8 1.2 1.4 = 180 120 BT134W IT(RMS) / A Ptot / W Tsp(max) / C 125 122 119 116 113 110 107 104 -50 0 50 100 1500 0.2 0.4 0.6 0.8 1.2 BT134W Tsp / C IT(RMS) / A 108 C 100 1000 BT134W T / s ITSM / A 10us 100us 1ms 10ms 100ms T ITSM time I Tj initial = 25 C max T dI /dt limit T T2- G+ quadrant 0.01 0.1 1 100 0.5 1.5 BT134W surge duration / s IT(RMS) / A 1 10 100 10000 BT134W Number of cycles at 50Hz ITSM / A T ITSM time I Tj initial = 25 C max T -50 0 50 100 1500.4 0.6 0.8 1.2 1.4 1.6 BT136 Tj / C VGT(Tj) VGT(25 C) BT134W series 2014-6-15 www.kersemi.com

Fig.7. Normalised gate trigger current I GT j )/ I GT (25˚C), versus junction temperature T j Fig.8. Normalised latching current I L j )/ I L (25˚C), versus junction temperature T j Fig.9. Normalised holding current I H j )/ I H (25˚C), versus junction temperature T j Fig.10. Typical and maximum on-state characteristic. Fig.11. Transient thermal impedance Z th j-sp , versus pulse width t p Fig.12. Typical commutation dV/dt versus junction temperature, parameter commutation dI T /dt. The triac should commutate when the dV/dt is below the value on the appropriate curve for pre-commutation dI T /dt. -50 0 50 100 1500 0.5 1.5 2.5 BT136 Tj / C T2+ G+ T2+ G- T2- G- T2- G+ IGT(Tj) IGT(25 C) 0 0.5 1 1.5 20 0.5 1.5 BT134W VT / V IT / A Tj = 125 C typ max Tj = 25 C Vo = 1.0 V Rs = 0.21 Ohms -50 0 50 100 1500 0.5 1.5 2.5 TRIAC Tj / C IL(Tj) IL(25 C) 10us 0.1ms 1ms 10ms 0.1s 1s 10s tp / s 0.01 0.1 Zth j-sp (K/W)100 tp P t D unidirectional bidirectional BT134W -50 0 50 100 1500 0.5 1.5 2.5 TRIAC Tj / C IH(Tj) IH(25C) 0 50 100 1501 100 1000 1.83 Tj / C dIcom/dt = 5.1 3.9 2.3 dVcom/dt (V/us) A/ms 1.4 off-state dV/dt limit BT134...G SERIES BT134 SERIES BT134...F SERIES BT134W series 2014-6-15 www.kersemi.com

Dimensions in mm. Fig.13. soldering pattern for surface mounting SOT223. PRINTED CIRCUIT BOARD Dimensions in mm. Fig.14. PCB for thermal resistance and power rating for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µ m thick). 3.8 min 6.3 2.3 4.6 1.5 min 1.5 min 1.5 min (3x) 4.6 4.5 BT134W series 2014-6-15 www.kersemi.com

Net Mass: 0.11 g Fig.15. SOT223 surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". 6.7 6.3 3.1 2.9 1 23 2.3 1.05 0.85 0.80 0.60 4.6 3.7 3.3 7.3 6.7 B A 0.10 0.02 max 1.8 max max 0.32 0.24 (4x) BM0.1 AM0.2 BT134W series 2014-6-15 www.kersemi.com