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Datasheet, December 11, 2018 | Subject to change without notice 1 of 10 www.qorvo.com SoT-636 Package Key Features

  • DC – 6000 MHz
  • 11 dB Gain at 900 MHz
  • +6.5 dBm P1dB at 900 MHz
  • +19 dBm OIP3 at 900 MHz
  • Single Voltage Supply
  • Internal Matched to 50 Ω
  • Robust 1000V ESD, Class 1C
  • Lead-free / Green / RoHS Compliant SoT-636 Package Product Overview The AG201-63G is a general-purpose buffer amplifier that offers high dynamic range operation in a low -cost surface mount package. At 900 MHz, the AG201 -63G provides typical 11 dB of gain, +19 dBm OIP3 and +6.5 dBm P1dB. This device combines d ependable performance with consistent quality to maintain MTTF values exceeding 1000 years at mounting temperatures of +85°C. The device is housed in a lead -free/Green/RoHS-compliant SOT -363 industry standards SMT package. The AG201-63G consists of a Darl ington-pair amplifier using the high reliability InGap/GaAs HBT process technology and only requires DC -blocking capacitors, a bias resistor, and an inductive RF choke for operation. This broadband MMIC amplifier can b e directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, an d WCDMA. In addition, The AG201 -63G will work for other various applications within the DC to 6 GHz frequency range such as CATV and WiMAX. Functional Block Diagram Top View

Applications

  • Mobile Infrastructure
  • CATV / FTTX
  • WLAN / ISM
  • RFID
  • WiMAX / WiBro Pin Configuration Pin No. Function

3 RF Input

6 RF Output

1, 2, 4, 5 Ground

Ordering Information

Part No. Description AG201-63G 3,000 pieces on a 7” reel AG201-63 PCB 700 –2400 MHz Evaluation Board

Datasheet, December 11, 2018 | Subject to change without notice 2 of 10 www.qorvo.com Recommended Operating Conditions Parameter Min Typ Max Units Device Voltage (VDEVICE) +4 V Device Current (ICC) 20 mA TCASE −40 +105 °C Tj for >106 hours MTTF +177 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Absolute Maximum Ratings Parameter Rating Storage Temperature −55 to +125 °C Operational Temperature −55 to +105 °C Device DC Voltage +4.5 V RF Input Power (continuous) +10 dBm Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Electrical Specifications Parameter Conditions (1) Min Typ Max Units Operational Frequency Range DC 6000 MHz Test Frequency 900 MHz Gain 11.3 dB Input Return Loss 25 dB Output Return Loss 16 dB Output P1dB +6.5 dBm Output IP3 Pout = -10 dBm/tone, ∆f = 10 MHz +19.1 dBm Output IP2 +27 dBm Noise Figure 4.4 dB Test Frequency 1900 MHz Gain 10 11 12 dB Output P1dB +5.8 dBm Output IP3 Pout = -10 dBm/tone, ∆f = 10 MHz +18.5 dBm Device Voltage +4 V Device Current 20 mA Thermal Resistance, θjc Junction to case 410 °C/W Notes: 1. Test conditions unless otherwise noted: Supply Voltage = +5.0 V, RBIAS = 49.9 Ω, Temp = +25 °C, 50 Ω system.

Datasheet, December 11, 2018 | Subject to change without notice 3 of 10 www.qorvo.com S-Parameters Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Test Conditions: VDEVICE = +5 V, ICC= 20 mA (typ.), Temp.=+25 °C, reference plane at device leads

Datasheet, December 11, 2018 | Subject to change without notice 4 of 10 www.qorvo.com Typical Performance – AG201-63G Parameter Typical Performance Value (1) Units Frequency 100 500 900 1900 2140 2400 3500 5800 MHz Input Return Loss −30 −30 −25 −20 −15 −16 −18 −20 dB Output Return Loss −16 −16 −16 −16 −16 −16 −20 −14 dB Notes: 1. Test conditions unless otherwise noted: Supply Voltage = +5V, VDEVICE = +4V, Rbias = 49.9 Ω, ICC = 20 mA, Temp.=+25 °C 2. Pout = -10 dBm/tone, Δf=10 MHz 700–2400 MHz Evaluation Board – AG201-63 PCB Bill of Material – AG201-63 PCB Reference Des. Value Description Manuf. Part Number PCB Printed Circuit Board Qorvo U1 Amplifier, InGaP GaAs HBT Qorvo AG201-63G C1, C2 56 pF Capacitor, 56 pF, 5%, 50V, C0G, 0603 various C3 0.018 μF Capacitor, 0.018 μF, 50V, X7R, 0603 L1 39 nH Inductor, 39 nH, 5%, Wire wound, 0603 various R1 49.9 Ω Resistor, 49.9 Ω, 1%, 1/16W, 0603 various Note: see Component Values table for Optimum performance in specific frequency bands Component Values for Specific Frequencies and Supply Voltages Frequency (MHz) 50 500 900 1900 2200 2500 3500 L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH C1, C2, C4 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF VSUPPLY (V) 5 6 7 8 9 10 12 R1 (Ω) 50 100 150 200 250 300 400 Component Size 0603 0603 0805 0805 1206 1210 1210

Datasheet, December 11, 2018 | Subject to change without notice 5 of 10 www.qorvo.com Performance Plots – AG201-63G PCB Test conditions unless otherwise noted: Supply Voltage = +5 V, ICC = 20 mA, RBIAS = 49.9 Ω, Temp.=+25 °C 0 1 2 3 4 Gain (dB) Frequency (GHz) Gain vs. Frequency +85°C +25°C −40°C -40 -30 -20 -10 0 1 2 3 4 5 6 S11, S22 (dB) Frequency (GHz) Return Loss vs. Frequency S22 S11 I-V Curve 3.0 3.5 4.0 4.5 Device Voltage (V) Device Current (mA) Optimal operating point 0 0.5 1 1.5 2 2.5 3 OIP3 (dBm) Frequency (GHz) Output IP3 vs. Frequency +85°C +25°C −40°C 0 200 400 600 800 1000 OIP2 (dBm) Frequency (MHz) Output IP2 vs. Frequency +85°C +25°C −40°C 0 0.5 1 1.5 2 2.5 3 NF (dB) Frequency (GHz) Noise Figure vs. Frequency +85°C +25°C −40°C -10 0 0.5 1 1.5 2 2.5 3 3.5 4 P1dB (dBm) Frequency (GHz) P1dB vs. Frequency +85°C +25°C −40°C -20 -16 -12 -8 -4 0 4 Output Power (dBm) Gain (dB) Input Power (dBm) Output Power / Gain vs. Input Power Output Power Gain Frequency = 900 MHz -20 -16 -12 -8 -4 0 4 Output Power (dBm) Gain (dB) Input Power (dBm) Output Power / Gain vs. Input Power Output Power Gain Frequency= 2000 MHz

Datasheet, December 11, 2018 | Subject to change without notice 6 of 10 www.qorvo.com Performance Plots – AG201-63G (Supply Voltage +6V) Test conditions unless otherwise noted: Supply Voltage = +6 V, ICC = 20 mA, RBIAS = 100 Ω, Temp.=+25 °C Performance Plots – AG201-63G (Supply Voltage +8V) Test conditions unless otherwise noted: Supply Voltage = +8 V, ICC = 20 mA, RBIAS = 200 Ω, Temp.=+25 °C 0 1 2 3 4 Gain (dB) Frequency (GHz) Gain vs. Frequency +85°C +25°C −40°C 0 0.5 1 1.5 2 2.5 3 OIP3 (dBm) Frequency (GHz) Output IP3 vs. Frequency +85°C +25°C −40°C 0 200 400 600 800 1000 OIP2 (dBm) Frequency (MHz) Output IP2 vs. Frequency +85°C +25°C −40°C -10 0 0.5 1 1.5 2 2.5 3 3.5 4 P1dB (dBm) Frequency (GHz) P1dB vs. Frequency +85°C +25°C −40°C 0 0.5 1 1.5 2 2.5 3 NF (dB) Frequency (GHz) Noise Figure vs. Frequency +85°C +25°C −40°C 0 1 2 3 4 Gain (dB) Frequency (GHz) Gain vs. Frequency +85°C +25°C −40°C 0 0.5 1 1.5 2 2.5 3 OIP3 (dBm) Frequency (GHz) Output IP3 vs. Frequency +85°C +25°C −40°C 0 200 400 600 800 1000 OIP2 (dBm) Frequency (MHz) Output IP2 vs. Frequency +85°C +25°C −40°C -10 0 0.5 1 1.5 2 2.5 3 3.5 4 P1dB (dBm) Frequency (GHz) P1dB vs. Frequency +85°C +25°C −40°C 0 0.5 1 1.5 2 2.5 3 NF (dB) Frequency (GHz) Noise Figure vs. Frequency +85°C +25°C −40°C

Datasheet, December 11, 2018 | Subject to change without notice 7 of 10 www.qorvo.com Pad Configuration and Description Top View Pad No. Label Description 1, 2, 4, 5 GND RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern for suggested footprint. 3 RF IN RF input. External DC Block required. 6 RF OUT RF output and VDEVICE. External DC Block and bias voltage required.

Datasheet, December 11, 2018 | Subject to change without notice 8 of 10 www.qorvo.com Package Marking and Dimensions Marking: Part Designator – F Lot Code – XX Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 3. Contact plating: Matte-Tin (Thickness: 7.6 to 20 μm) FXX

Datasheet, December 11, 2018 | Subject to change without notice 9 of 10 www.qorvo.com PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. And Make copper metal area as much as possible in inner and outer layers near the part to obtain optimal thermal performance 3. Via holes are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.01”). 4. No solder mask on the backside of the PCB in the region where the board contacts the heatsink 5. Mounting screws can be added near the part to fasten the board to a heatsink. To ensure the ground and thermal via holes contact the heatsink

Datasheet, December 11, 2018 | Subject to change without notice 10 of 10 www.qorvo.com Handling Precautions Parameter Rating Standard Caution! ESD-Sensitive Device ESD – Human Body Model (HBM) Class 1C ESDA / JEDEC JS-001-2012 ESD – Charged Device Model (CDM) Class C3 JEDEC JESD22-C101F MSL – Moisture Sensitivity Level Level 3 IPC/JEDEC J-STD-020 Solderability Solder profiles available upon request. Contact plating: Matte Tin (Thickness: 7.6 to 20 μm) RoHS Compliance This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Cert ain Hazardous Substances in Electr ical and Electronic Equipment) as amended by Directive 2015/863/EU. This product also has the following attributes:

  • Lead Free
  • Halogen Free (Chlorine, Bromine)
  • Antimony Free
  • TBBP-A (C15H12Br402) Free
  • PFOS Free
  • SVHC Free Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information con tained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All informatio n contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anythin g described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2018 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-890-8163 Email: customer.support@qorvo.com For technical questions and application information: Email: appsupport@qorvo.com Pb