A1193 MAT | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 2
Technical content
Ultra High Sensitivity Built-in Pull High Res Hall Effect Latch 050423 www.masteranalog.com Page 1 of 2 RD-30026 Rev 1.22 A1193 is a hall latch which has features as low current consumption, ultra high sensitivity and built-in Pull High Resistance. Absolute Maximum Ratings At (TA=25℃) Characteristics Values Unit Supply Voltage, (VDD) 28 V Output V oltage, (VOUT) 28 V Output Current, (ISINK) 50 mA Operating Temperature Range, (TA) -40 ~+125 ℃ Storage Temperature Range, (TS) -65 ~ +150 ℃ Package Power Dissipation, (PD) 606 / 230 mW Functional Block Diagram Voltage Regulator Amp VDD Out Vss Hall Sensor Pull-up Resistor Hall Sensor RA Electrical Specifications DC Operating Parameters： T A=+25℃, VDD=12V Parameters Test Conditions Min Typ Max Units Supply V oltage, (VDD) Operating 2.5 26.0 V Supply Current, (IDD) B<BOP 5.0 mA Output Saturation V oltage, (VDSON) IOUT=20mA, B>BOP 400.0 mV Output Leakage Current, (IOFF) IOFF B<BRP, VOUT = 12V 10.0 uA Output Switch Frequency, (FSW) N-->S, S-->N 3 kHz Output Rise Time, (TR) CL =20pF 1 1.5 uS Output Fall Time, (TF) CL =20pF 0.05 0.45 uS Electro-Static Discharge HBM 4 KV Pull-up Resistor, (RA) 10 KΩ Operate Point, (BOP) I3(S3) 5(-25) 25(-5) Gauss Release Point, (BRP) I3(S3) -25(5) -5(25) Gauss Hysteresis, (BHYS) |BOP - BRP| 30 Gauss DMOS Hall Effect Latch Supply Voltage 2.5 ~ 26V BOP：15 Gauss BRP：-15 Gauss Output Pull High Res Package SIP-3(I3) SOT-23(S3) Masteranalog
Ultra High Sensitivity Built-in Pull High Res Hall Effect Latch 050423 www.masteranalog.com Page 2 of 2 RD-30026 Rev 1.22 Package Dimension and Sensor Location (Top VieW) NOTES: 1. Controlling dimension: mm 2. Leads must be free of flash and plating voids 3. Do not bend leads within 1 mm of lead to package interface. 4. PINOUT: Pin No. Pin Name Function
1 VDD Power Supply
2 VSS Ground
3 VOUT Output
(Top VieW) NOTES: 1. Controlling dimension: mm 2. Leads must be free of flash and plating voids 3. Lead thickness after solder plating will be 0.254mm maximum 4. PINOUT: Pin No. Pin Name Function