9435M BYCHIP | Alldatasheet
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Technical content
Features
VDS= -30V, ID= -5.1A RDS(ON) < 33 mΩ @ VGS = -10V RDS(ON) < 48 mΩ @ VGS = -4.5V
- Advanced Trench Technology
- Provide Excellent RDS(ON) and Low Gate Charge
- Lead Free and Green Available 100% UIS TESTED! 100% ΔVds TESTED! General Features www.bychip.cn SOP-8 Schematic diagrampin assignment 9435M v1.0
■ Electrical Characteristics (TJ=25℃ unless otherwise noted) Parameter Symbol Conditions Min Typ Max Units Static Parameter Drain-Source Breakdown Voltage BVDSS VGS= 0V, ID=-250μA -30 - - V Zero Gate Voltage Drain Current IDSS VDS=-30V, VGS=0V - - -1 μA VDS=-30V, VGS=0V, Tj=150℃ - - -100 Gate-Body Leakage Current IGSS VGS= ± 20V, VDS=0V - - ± 100 nA Gate Threshold Voltage VGS(th) VDS= VGS, ID=-250μA -1.0 -3.0 V Static Drain-Source On-Resistance RDS(on) VGS=-10V, ID=-5A - 33 mΩ VGS=-4.5V, ID=-3.5A 48 Diode Forward Voltage VSD IS=-5A, VGS=0V - - -1.2 V Gate resistance RG f=1MHz - 15 - Ω Maximum Body-Diode Continuous Current IS - - -5.1 A Dynamic Parameters Input Capacitance Ciss VDS=-15V, VGS=0V, f=1MHz - 490 - pF Output Capacitance Coss - 75 - Reverse Transfer Capacitance Crss - 60 - Switching Parameters Total Gate Charge Qg VGS=-10V, VDS=-15V, ID=-5A - 9 - nC Gate-Source Charge Qgs - 1.5 - Gate-Drain Charge Qgd - 2.3 - Reverse Recovery Charge Qrr IF=-5A, di/dt=100A/us - 12 - nC Reverse Recovery Time trr - 32 - ns Turn-on Delay Time tD(on) VGS=-10V, VDD=-15V, ID=-5A RGEN=2.5Ω - 9 - ns Turn-on Rise Time tr - 3 - Turn-off Delay Time tD(off) - 29 - Turn-off fall Time tf - 15 - A. Repetitive rating; pulse width limited by max. junction temperature. B. Pd is based on max. junction temperature, using junction-case and junction-ambient thermal resistance. C. The value of RθJA is measured with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in the still air environment with TA =25℃. The maximum allowed junction temperature of 150℃. The value in any given application depends on the user's specific board design. www.bychip.cn 9435M v2.0
Figure 13. Maximum Transient Thermal Impedance Figure 14. Safe Operation Area