74LS86A_V01 SS | Alldatasheet
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Low Power Schottky Logic – 74LS86A Rev 1.0 21/11/17 Quadruple 2-Input Exclusive OR Gate IC in bare die form Die Size (Unsawn) 1330 x 1090 52 x 43 µm mils Minimum Bond Pad Size 98 x 98 3.86 x 3.86 µm mils Die Thickness 350 (±20) 13.78 (±0.79) µm mils Top Metal Composition Al 1%Si 1.1µm Back Metal Composition N/A – Bare Si High speed – 22ns (Typ) propagation delay Low Power – I CC 10mA Max Direct drop-in replacement for obsolete components in long term programs. Features: The following part suffixes apply:
Description
The 74LS86A is fabricated using a 2µm 40V Bipolar process. The device contains four independent gates and performs the Boolean functions Y = A ⊕ B = AB + AB in positive logic. Ordering Information Die Dimensions in µm (mils) 1330 (52) 1090 (43) No suffix - MIL-STD-883 /2010B Visual Inspection For High Reliability versions of this product please see 54LS86A Supply Formats: Mechanical Specification Default – Die in Waffle Pack (400 per tray capacity) Sawn Wafer on Tape – On request Unsawn Wafer – On request Die Thickness <> 350µm(14 Mils) – On request Assembled into Plastic Package – On request Page 1 of 4 www.siliconsupplies.com PART OBSOLETE - DISCONTINUED
www.siliconsupplies.com d Low Power Schottky Logic – 74LS86A Rev 1.0 21/11/17 COORDINATES (mm) PAD FUNCTION X Y 1 A1 0.077 0.205 2 B1 0.338 0.079 3 Y1 0.528 0.079 4 A2 0.704 0.079 5 B2 0.894 0.079 6 Y2 1.154 0.129 7 GND 1.154 0.496 8 Y3 1.154 0.863 9 A3 0.894 0.913 10 B3 0.704 0.913 11 Y4 0.528 0.913 12 A4 0.338 0.913 13 B4 0.077 0.787 14 VCC 0.077 0.496 CONNECT CHIP BACK TO GND OR FLOAT Pad Layout and Functions Logic Diagram Pad 14 = VCC Pad 7 = GND Truth Table INPUTS OUTPUT A B Y L L H H L H L H L H H L H = High level (steady state) L = Low level (steady state) 1330µm (52.36 mils) 1090µm (42.91.12 mils) 0,0 Y = A ⊕ B = AB + AB 11 10 9 43 2 DIE ID PART OBSOLETE - DISCONTINUED
www.siliconsupplies.com Low Power Schottky Logic – 74LS86A Rev 1.0 21/11/17 PARAMETER SYMBOL MIN MAX UNITS Supply Voltage VCC 4.75 5.25 V High-Level Input Voltage VIH 2 - V Low-Level Input Voltage VIL - 0.8 V High-Level Output Current IOH - -0.4 mA Low-Level Output Current IOL - 8 mA Operating Temperature Range TJ 0 +85 °C Recommended Operating Conditions Absolute Maximum Ratings1 PARAMETER SYMBOL VALUE UNIT DC Supply Voltage VCC 7.0 V DC Input Voltage VIN 7.0 V DC Input Voltage VOUT 5.5 °C Storage Temperature Range TSTG -65 to 150 °C LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Minimum High-Level Input Voltage VIH - 2 - - V Maximum Low-Level Input Voltage VIL - - - 0.8 V Input Clamp Diode Voltage VIK VCC = MIN IIN = -18mA - -0.65 -1.5 V Output Voltage High VOH VCC = MIN, IOH = MAX VIN = VIL or VIH per Function Table 2.7 3.5 - V Output Voltage Low VOL VCC = MIN IOH = MAX VIN = VIL or VIH per Truth Table IOL = 8mA - 0.36 0.5 V VCC = MAX, VIN = 2.7V - - 40 µA Input High Current IIH VCC = MAX, VIN = 7.0V - - 0.2 mA Input Low Current IIL VCC = MAX, VIN = 0.4V - - -0.8 mA Short Circuit Current3 IOS VCC = MAX -20 - -100 mA Power Supply Current (Total) ICC VCC = MAX - 6.1 10 mA 2. All typical values @ VCC = 5V, TJ = 25°C. 3. Not more than one output should be shorted at a time, nor for more than 1 second. 1. Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may reduce device reliability. PART OBSOLETE - DISCONTINUED
www.siliconsupplies.com Low Power Schottky Logic – 74LS86A Rev 1.0 21/11/17 AC Electrical Characteristics4 LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS tPLH - 12 23 Propagation Delay, Other Input Low tPHL VCC = 5V, CL = 15pF 10 17 ns tPLH - 20 30 Propagation Delay, Other Input High tPHL VCC = 5V, CL = 15pF - 13 22 ns 4. Not production tested in die form, characterized by chip design and tested in package. DISCLAIMER: The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Silicon Supplies Ltd hereby disclaims any and all warranties and liabilities of any kind. LIFE SUPPORT POLICY: Silicon Supplies Ltd components may be used in life support devices or systems only with the express written approval of Silicon Supplies Ltd, if a failure of such components can reasonably be expected to cause the failure of that life support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. PART OBSOLETE - DISCONTINUED