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8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 1 of 8 - www.qorvo.com Product Description The Qorvo TGL2209 is a high power, X-band GaAs VPIN limiter capable of protecting sensitive receive channel components against high power incident signals. The TGL2209 does not require DC bias and achieves a low insertion loss in a small form factor. These features allow for simple integration with minimal impact to system performance. The TGL2209 operates from 8–12 GHz with low insertion loss of less than 0.5 dB. Receive protection is rated up to

50 W incident pulsed-power with a low flat leakage of less

than 18 dBm. The TGL2209 is offered in die form and is well suited for both commercial and defense related applications.

Applications

  • Receive Chain Protection
  • Commercial and Military Radar

Ordering Information

Part No. Description TGL2209 8–12 GHz 50W VPIN Limiter

1126046 Evaluation Board

  • Frequency Range: 8 – 12 GHz
  • Insertion Loss: < 0.5 dB
  • Peak Power Handling: 50 W (pulsed)
  • Flat Leakage: < 18 dBm
  • Spike Leakage: < 20 dBm
  • Passive (no DC bias required)
  • Recovery Time: < 30 nS
  • Die Size: 2.00 x 2.00 x 0.10 mm Performance is typical across frequency. Please reference electrical specification table and data plots for more details. Block Diagram 1 2 RF Output RF Input

8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 2 of 8 - www.qorvo.com Absolute Maximum Ratings Parameter Value / Range Incident Power, Pulsed1, 50 , 25 °C 47 dBm Incident Power, Pulsed1, 50 , 85 °C 46 dBm Incident Power, CW, 50 , 25 °C 40 dBm Incident Power, CW, 50 , 85 °C 36 dBm Mounting Temperature (30 seconds) 320 °C Storage Temperature -40 to 150 °C Note:

1 Pulse RF conditions: PW = 100 µs, Duty Cycle = 10%

Operation of this device outside the parameter ranges given above may cause permanent damage. These are stress ratings only, and functional operation of the device at these conditions is not implied. Recommended Operating Conditions Parameter Min Typ Max Units Operating Temperature Range -40 +25 +85 °C Passive – No Bias Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Thermal and Reliability Information Parameter Test Conditions Value Units Incident Power (RF Operational Life Test (1)) 10 GHz Pulsed, PW=100 µs, DC=10%, 50 , 25°C 50 W Notes: 1. Test terminated after 100 hours. Electrical Specifications Test conditions, unless otherwise noted: 25 °C Parameter Min Typ Max Units Operational Frequency Range 8 – 12 GHz Insertion Loss < 0.5 dB Input Return Loss > 12 dB Output Return Loss > 12 dB Flat Leakage Power at PIN > 30 dBm < 18 dBm Pulse Recovery Time < 30 nS Spike Leakage < 20 dBm Insertion Loss Temperature Coefficient 0.006 dB/ °C

8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 3 of 8 - www.qorvo.com Performance Plots – Small Signal Test conditions unless otherwise noted: Temp. = 25 °C -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 4 6 8 10 12 14 16 Insertion Loss (dB) Frequency (GHz) Insertion Loss vs. Frequency vs. Temp. -40 C +25 C +85 C -30 -25 -20 -15 -10 4 5 6 7 8 9 10 11 12 13 14 15 16 Input Return Loss (dB) Frequency (GHz) Input Return Loss vs. Freq. vs. Temp. -40 C +25 C +85 C -30 -25 -20 -15 -10 4 5 6 7 8 9 10 11 12 13 14 15 16 Output Return Loss (dB) Frequency (GHz) Output Return Loss vs. Freq. vs. Temp. -40 C +25 C +85 C

8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 4 of 8 - www.qorvo.com Performance Plots – Large Signal Test conditions unless otherwise noted: Temp. = 25 °C 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) Input Power (dBm) Output Power vs. Input Power vs. Freq.

8 GHz 11 GHz

9 GHz 12 GHz

10 GHz

Temp. = 25 °C 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) Input Power (dBm) Output Power vs. Input Power vs. Temp. -40 C +25 C +85 C Frequency = 10.0 GHz 30 31 32 33 34 35 36 37 38 39 40 Output Power (dBm) Input Power (dBm) Output Power vs. Pin vs. Frequency 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 Output Power (dBm) Input Power (dBm) Output Power vs. Pin vs. Frequency Pulsed RF Power: 100us/10%

8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 5 of 8 - www.qorvo.com Applications Circuit Note: RF Input and RF Output ports are not interchangeable. Evaluation Board (EVB) Layout Assembly & Mounting Detail connector interface is optimized for the Southwest Microwave end-launch connector 1092-01A-5. The pad pattern shown has been developed and tested for optimized assembly at Qorvo. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. Note: Multiple vias should be employed under die to minimize inductance and thermal resistance. 1 2 RF Output RF Input

8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 6 of 8 - www.qorvo.com Mechanical Drawing and Bond Pad Description Unit: millimeters Thickness: 0.10 Die x, y size tolerance: ± 0.050 Chip edge to bond pad dimensions are shown to center of pad Ground is backside of die Pad No. Symbol Description Pad Size (mm x mm) 1 RF Input RF Input, 50 Ω, DC coupled 0.145 x 0.340 2 RF Output RF Output, 50 Ω, DC coupled 0.110 x 0.210 NOTE: The RF Input and RF Output ports are not interchangeable. 1 2 2.000 1.000 0.000 0.000 0.141 1.868 2.000 1.006 Dimensions are in mm

8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 7 of 8 - www.qorvo.com Assembly Notes Component placement and adhesive attachment assembly notes:

  • Vacuum pencils and/or vacuum collets are the preferred method of pick up.
  • Air bridges must be avoided during placement.
  • The force impact is critical during auto placement.
  • Curing should be done in a convection oven; proper exhaust is a safety concern. Reflow process assembly notes:
  • Use AuSn (80/20) solder and limit exposure to temperatures above 300 C to 3 – 4 minutes, maximum.
  • An alloy station or conveyor furnace with reducing atmosphere should be used.
  • Do not use any kind of flux.
  • Coefficient of thermal expansion matching is critical for long-term reliability.
  • Devices must be stored in a dry nitrogen atmosphere. Interconnect process assembly notes:
  • Thermosonic ball bonding is the preferred interconnect technique.
  • Force, time, and ultrasonic are critical parameters.
  • Aluminum wire should not be used.
  • Devices with small pad sizes should be bonded with 0.0007-inch wire.

8 – 12 GHz 50 Watt VPIN Limiter Data Sheet Rev. B – February 9, 2021 - 8 of 8 - www.qorvo.com Solderability Use only AuSn (80/20) solder and limit exposure to temperatures above 300 °C to 3 – 4 minutes, maximum. RoHS Compliance This product is compliant with the 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment), as amended by Directive 2015/863/EU. This product also has the following attributes:

  • Lead Free
  • Halogen Free (Chlorine, Bromine)
  • Antimony Free
  • TBBP-A (C15H12Br402) Free
  • PFOS Free
  • SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Tel: 1-844-890-8163 Web: www.qorvo.com Email: customer.support@qorvo.com Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information con tained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All informatio n contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anythin g described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2021 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc. Handling Precautions Parameter Rating Standard Caution! ESD-Sensitive Device ESD – Human Body Model (HBM) Class 1C ESDA / JEDEC JS-001-2012