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6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 1 of 10 - www.qorvo.com Product Description Qorvo’s TGP2105 is a 6-bit, digital phase shifter fabricated on Qorvo’s high performance 0.15μm GaAs pHEMT process. It operates over 6 to 18 GHz and provides 360° of phase coverage with a LSB of 5.625°. It also achieves a low RMS phase error of 4° with 8 dB of insertion loss over all states. The TGP2105 uses positive switch logic, eliminating the need for a negative voltage rail. That, along with low insertion and a high degree of resolution makes the TGP2105 ideally suited for a variety of wideband phased array applications, including commercial and military radars, satellite -based communication systems an d electronic warfare.

Ordering Information

Part No. Description

1096002 Waffle Pack, Qty 20

1101242 TGP2105 Evaluation Board

  • Frequency Range: 6 to 18 GHz
  • 6-Bit Digital Phase Shifter
  • 360° Coverage, LSB = 5.625°
  • RMS Phase Error: 4°
  • RMS Amplitude Error: 0.45 dB
  • Insertion Loss: <10 dB
  • Return Loss: >12 dB
  • Input P1dB: >25 dBm
  • Input IP3: >41 dBm
  • Control Voltage: 0/+5 V
  • Chip Dimensions: 3.15 x 3.15 x 0.10 mm

Applications

  • Phased Array Antenna Systems
  • Satellite Communication Systems
  • Electronic Warfare Block Diagram

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 2 of 10 - www.qorvo.com Absolute Maximum Ratings Parameter Value Control and Reference Voltage 6 V Control Current -15 to +5 mA Power Dissipation 0.9 W Input Power, CW, 50 Ω, 85°C 30 dBm Channel Temperature 200 °C Mounting Temperature (30 Seconds) 320 °C Storage Temperature -55 to 150 °C Operation of this device outside the parameter ranges given above may cause permanent damage. These are stress ratings only, and functional operation of the device at these conditions is not implied. Extended application of Absolute Maximum Rating conditions may reduce device reliability. Recommended Operating Conditions Parameter Value Control Voltage (50, 110, 220, 450, 900, 1800, REF) 0/+5 V Operating Temperature Range -40 ºC to +85 ºC Electrical specifications are measured at specified test conditions. Specifications are not guaranteed overall operating conditions. Bias and Truth Table Control voltage Logic “0” = VL, value between 0 to 0.2 V; Logic “1” = VH, value between +3V to +5V Phase Shift 50 110 220 450 900 1800 REF 0° (Reference) 0 0 0 0 0 0 1 5° 1 0 0 0 0 0 1 11° 0 1 0 0 0 0 1 22° 0 0 1 0 0 0 1 45° 0 0 0 1 0 0 1 90° 0 0 0 0 1 0 1 180° 0 0 0 0 0 1 1 355° 1 1 1 1 1 1 1 Electrical Specifications Test conditions unless otherwise noted: 25 °C Data de-embedded to device reference planes at end of feeds, data include bond wire effects Control Voltage (REF, 50, 110, 220, 450, 900, 1800) VL = 0 V, VH = +5 V; See Bias Truth Table Parameter Min Typical Max Units Operational Frequency Range 6 18 GHz Insertion Loss 6 - 10 dB Input Return Loss >12 dB Output Return Loss >12 dB RMS Phase Error 4 deg RMS Amplitude Error 0.45 dB Input P1dB >25 dBm Input IP3, Tone spacing = 10 MHz, Pin/Tone = 15 dBm >41 dBm Insertion Loss Temperature Coefficient 0.008 dB/°C

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 3 of 10 - www.qorvo.com Performance Plots – Small Signal Test conditions unless otherwise noted: 25 °C -14 -12 -10 4 6 8 10 12 14 16 18 20 S21 (dB) Frequency (GHz) Average Insertion Loss vs. Temperature All phase states; VREF=5V -40C +25C +85C -14 -12 -10 4 6 8 10 12 14 16 18 20 S21 (dB) Frequency (GHz) Insertion Loss vs. Frequency All phase states, VREF=5V, 25C -30 -24 -18 -12 4 6 8 10 12 14 16 18 20 S11 (dB) Frequency (GHz) Average IRL vs. Temperature All phase states; VREF=5V -40C +25C +85C -30 -24 -18 -12 4 6 8 10 12 14 16 18 20 S11 (dB) Frequency (GHz) Input Return Loss vs. Frequency All phase states, VREF=5V, 25C -30 -24 -18 -12 4 6 8 10 12 14 16 18 20 S22 (dB) Frequency (GHz) Average ORL vs. Temperature All phase states; VREF=5V -40C +25C +85C -30 -24 -18 -12 4 6 8 10 12 14 16 18 20 S22 (dB) Frequency (GHz) Output Return Loss vs. Frequency All phase states, VREF=5V, 25C

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 4 of 10 - www.qorvo.com Performance Plots – Small Signal Test conditions unless otherwise noted: 25 °C -30 -20 -10 0 45 90 135 180 225 270 315 360 Phase Error (degrees) State (degrees) Phase Error vs. State VREF=5V, 25C

6 GHz 9 GHz 12 GHz 15 GHz 18 GHz

0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 45 90 135 180 225 270 315 360 Amplitude Error (dB) State (degrees) Amplitude Error (relative to mean) VREF=5V, 25C RMS Phase Error (degrees) Frequency (GHz) RMS Phase Error vs. Frequency All phase states, VREF=5V -40C +25C 85C 0.0 0.5 1.0 1.5 2.0 4 6 8 10 12 14 16 18 20 RMS Amplitude Error (dB) Frequency (GHz) RMS Amplitude Error vs. Frequency All phase states, VREF=5V -40C +25C 85C 135 180 225 270 315 360 405 4 6 8 10 12 14 16 18 20 Relative Phase (degrees) Frequency (GHz) Relative Phase Shift vs. Frequency Major States, VREF=5V, 25C -30 -20 -10 4 6 8 10 12 14 16 18 20 Phase Error (degrees) Frequency (GHz) Phase Error vs. Frequency Major States, VREF=5V, 25C

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 5 of 10 - www.qorvo.com Performance Plots – Large Signal and Linearity Test conditions unless otherwise noted: 25 °C 6 8 10 12 14 16 18 Input P1dB (dBm) Frequency (GHz) Input P1dB vs. Frequency Major phase states; VREF=5V, 25C Pin = 30 dBm was max power level tested 6 8 10 12 14 16 18 Input IP3 (dBm) Frequency (GHz) Input IP3 vs. Frequency vs. Temperature REF State; VREF=5V -40C +25C +85C Pin/Tone = 15 dBm, Tone Spacing = 10 MHz 6 8 10 12 14 16 18 Input IP3 (dBm) Frequency (GHz) Input IP3 vs. Frequency Major phase states; VREF=5V, 25C Pin/Tone = 15dBm, Tone Spacing = 10 MHz

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 6 of 10 - www.qorvo.com Mechanical Information and Bond Pad Description Unit: millimeters, Die thickness: 0.10, Die x, y size tolerance: ± 0.050 Chip edge to bond pad dimensions are shown to center of pad, Ground is backside of die Bond Pad Symbol Description Pad Size 1 RF In Input; matched to 50 Ω; DC blocked 0.200 x 0.100 2 90 90° Bit 0.100 x 0.100 3, 11 5 5° Bit 0.100 x 0.100 4, 10 11 11° Bit 0.100 x 0.100 5 REF Reference 0.100 x 0.100 6 180 180° Bit 0.100 x 0.100 7 45 45° Bit 0.100 x 0.100 8 22 22° Bit 0.100 x 0.100 9 RF Out Output; matched to 50 Ω; DC blocked 0.200 x 0.100

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 7 of 10 - www.qorvo.com Applications Information 1. The spacing between MMIC and TFN at RF In and RF Out is <5 mils typical. 2. RF connections: Bond two 1-mil diameter, <20 mils length gold bond wires at RF In and RF Out for optimum RF performance.

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 8 of 10 - www.qorvo.com Assembly Notes Component placement and adhesive attachment assembly notes:

  • Vacuum pencils and/or vacuum collets are the preferred method of pick up.
  • Air bridges must be avoided during placement.
  • The force impact is critical during auto placement.
  • Organic attachment (i.e., conductive epoxy) can be used in low-power applications.
  • Curing should be done in a convection oven; proper exhaust is a safety concern. Reflow process assembly notes:
  • Use AuSn (80/20) solder and limit exposure to temperatures above 300C to 3-4 minutes, maximum.
  • Conductive epoxy die attach is recommended for PCB mounting.
  • Bonding pads plating: Au.
  • An alloy station or conveyor furnace with reducing atmosphere should be used.
  • Do not use any kind of flux.
  • Coefficient of thermal expansion matching is critical for long-term reliability.
  • Devices must be stored in a dry nitrogen atmosphere. Interconnect process assembly notes:
  • Thermosonic ball bonding is the preferred interconnect technique.
  • Force, time, and ultrasonics are critical parameters.
  • Aluminum wire should not be used.
  • Devices with small pad sizes should be bonded with 0.0007-inch wire.

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 9 of 10 - www.qorvo.com Thermal and Reliability Information Parameter Test Conditions Value Units Thermal Resistance (θJC) (1) PDISS = 0.09 W, TBASEPLATE = 85°C 22 ºC/W Channel Temperature, TCH (Under RF) 87 °C Median Lifetime (TM) 3.8E09 Hrs Notes: 1. Thermal resistance measured to back of carrier plate. MMIC mounted on 40 mils thick CuMo carrier using 1.5 mil 80/20 AuSn. Median Lifetime 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08 1E+09 1E+10 1E+11 1E+12 1E+13 1E+14 1E+15 25 50 75 100 125 150 175 200 Median Lifetime, TM (Hours) Channel Temperature, TCH (°C) Median Lifetime vs. Channel Temperature FET5

6-18 GHz 6-Bit Digital Phase Shifter (+Vc) Data Sheet Rev. B. Oct 02, 2019 | Subject to change without notice - 10 of 10 - www.qorvo.com Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information con tained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All informatio n contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anythin g described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2019 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc. Handling Precautions Parameter Rating Standard Caution! ESD-Sensitive Device ESD – Human Body Model (HBM) Class 1A ESDA / JEDEC JS-001-2012 RoHS Compliance This product is compliant with the 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment), as amended by Directive 2015/863/EU. This product also has the following attributes:

  • Lead Free
  • Halogen Free (Chlorine, Bromine)
  • Antimony Free
  • TBBP-A (C15H12Br402) Free
  • PFOS Free
  • SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Tel: 1-844-890-8163 Web: www.qorvo.com Email: customer.support@qorvo.com