XCM517AD03DR

Torex Semiconductor

600mA Synchronous Dual Output Step-Down DC/DC Converters

Manufacturer: Torex Semiconductor

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600mA Synchronous Dual Output Step-Down DC/DC Converters ç ç ççççççççç çç Lx PGND VIN CE AGND VOUT XC9235/XC9236 Lx VIN CE VOUT XC9235/XC9236 ˙GENERAL DESCRIPTION The XCM517 series is a multi combination module IC which comprises of two 600mA driver transistor built-in synchronous step–down DC/DC converter. The XCM517 series is availa ble in an ultra small package USP-12B01 suited for space conscious applications. The XCM517 series is a group of synchronous-rectifi cation type DC/DC converters with a built-in 0.42 ЊP-channel driver transistor and 0.52ЊN-channel switching transistor, designed to allow the use of ceramic capacitors. The ICs enable a high efficiency, stable power supply with an output current of 600mA to be configured using only a coil and two capacitors connected for suiting to your particular applicati on. As for operation mode, the XCM517xA / XCM517xB se ries are PWM control, the XCM517xC / XCM517xD series are automatic PWM/PFM switchi ng control, allowing fast response, low ripple and high efficiency over the full range of loads (from light load to heavy load). The soft start and current control functions are internally optimized. During stand-by, all circuits are shutdown to reduce current consumption to as low as 1.0ЖA or less. With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel driver transistor is forced OFF when input voltage becomes 1.4V or lower. ç ˙APPLICATIONS ˔Mobile phones, Smart phones ˔Bluetooth equipment ˔Personal Device Assistances ˔Portable games ˔Digital still cameras, camcorders ˙FEATURES P-ch Driver Transistor Built-In : ON resistance 0.42 Ω N-ch Driver Transistor Built-In Input Voltage Range : ON resistance 0.52Ω : 2.7V ~ 6.0V High Efficiency : 92% (TYP .) Output Current : 600mA Oscillation Frequency : 1.2MHz, 3.0MHz (+ 15%) Maximum Duty Cycle Soft-Start Circuit Built-In : 100% Current Limiter Circuit Built-In (Constant Current & Latching) Ceramic Capacitor Compatible Control Methods : PWM (XCM517xA / XCM517xB) PWM/PFM Auto (XCM517xC / XCM517xD) *Performance depends on external components and wiring on the PCB. Combination of voltage 1 c h 2 c h XCM517xx01D 1 . 2 V 1 . 8 V XCM517xx02D 1 . 2 V 3 . 3 V XCM517xx03D 1 . 8 V 3 . 3 V XCM517xx06D 1 . 5 V 1 . 8 V XCM517xx07D 1 . 5 V 3 . 3 V *The other combination of voltage is semi-custom. ˙TYPICAL APPLICATION CIRCUIT ETR2425-007 * The dotted lines in the circuit indicate s the connection using through-holes at the backside of the PC board (TOP VIEW) VOUT1 AGND1 EN1 VIN2 Lx1 PGND1 VIN1 EN2 AGND2 VOUT2 Lx2 PGND2

ç ç ç çç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç PIN NUMBER PIN NAME USP-12B01 XCM517 XC9235/XC9236 XC9235/XC9236 FUNCTIONS

1 V OUT1 V OUT ― DC/DC-1 Channel Block:

2 AGND1 AGND ― DC/DC-1 Channel Block:

3 EN1 CE ― DC/DC-1 Channel Block:

4 V IN2 ― V IN DC/DC-2 Channel Block:

5 PGND2 ― PGND DC/DC-2 Channel Block :

6 Lx2 ― Lx DC/DC-2 Channel Block :

7 V OUT2 ― V OUT DC/DC-2 Channel Block :

8 AGND2 ― AGND DC/DC-2 Channel Block :

9 EN2 ― CE DC/DC-2 Channel Block :

10 V IN1 V IN ― DC/DC-1 Channel Block :

11 PGND1 PGND ― DC/DC-1 Channel Block :

12 Lx1 Lx ― DC/DC-1 Channel Block :

˙PIN CONFIGURATIOIN ˙PIN ASSIGNMENT USP-12B01 (BOTTOM VIEW) NOTE: * A dissipation pad on the reverse side of the package should be electrically isolated.ç *1: Electrical potential of the DC/DC 1 channels’ dissipation pad should be VSS level. *2: Electrical potential of the DC/DC 2 channels’ dissipation pad should be VSS level. Care must be taken for an electrical pot ential of each dissipation pad so as to en hance mounting strength and heat release when the pad needs to be connected to the circuit.

1 VOUT1

6 Lx2

5 PGND2

4 VIN2

3 EN1

2 AGND1

ç ç ç ˔Ordering Information XCM517ᶃᶄᶅᶆᶇᶈ DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION ᶃᶄ Control, Oscillation Frequency and Options - : See the chart below ᶅᶆ Output Voltage - : Internally set sequential number relating to output voltage (See the chart below) ᶇ Package D : USP-12B01 ᶈ Device Orientation R : Embossed tape, standard feed DESIGNATOR ᶃᶄ ᶃᶄ CONTROL OCSILLATION FREQUENCY CL DISCHARGE HIGH SPEED SOFT-START EN INPUT LOGIC AA PWM Control 1.2M Not Available Not Available High Active AB PWM Control 3.0M Not Available Not Available High Active AC PWM/PFM Auto 1.2M Not Available Not Available High Active AD PWM/PFM Auto 3.0M Not Available Not Available High Active BA PWM Control 1.2M Available Available High Active BB PWM Control 3.0M Available Available High Active BC PWM/PFM Auto 1.2M Available Available High Active BD PWM/PFM Auto 3.0M Available Available High Active DESIGNATOR ᶅᶆ Output Voltage ᶅᶆ VOUT1 VOUT2 01 1.2 1.8 02 1.2 3.3 03 1.8 3.3 06 1.5 1.8 07 1.5 3.3 ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ˙PRODUCT CLASSIFICATION *This series are semi-custom products. For other combinations, output voltages and etc., please ask Torex sales contacts.

PARAMETER SYMBOL RATINGS UNITS VIN1 / VIN2 Voltageçç VIN1 / VIN2ç - 0.3 ʙ 6.5 V Lx1 / Lx2 Voltage VL x1 / VLx2ç - 0.3 ʙ V IN1 + 0.3 or 6.5 V VOUT1 / VOUT2 Voltage V OUT1 / VOUT2ç - 0.3 ʙ 6.5 V EN1 / EN2 Voltage V EN1 / VEN2ç - 0.3 ʙ 6.5 V Lx1 / Lx2 Current ILx 1 / ILx2 ±1500 mA Power Dissipation (Ta=25ˆ)ç USP-12B01 Pd 150 mW Junction Temperature Tj 125 ˆç Operating Temperature Range Topr - 40 ʙ + 85 ˆç Storage Temperature Range Tstg - 55 ʙ + 125 ˆç ç CE Error Amp. Vref with Soft Start, CE Phase Compensation PWM/PFM Selector Current Feedback Current Limit PWM Comparator Logic Synch Buffer Drive UVLO UVLO Cmp Ramp Wave Generator OSC Lx CE/MODE Control Logic CE/ VSHORT CE Error Amp. Vref with Soft Start, CE Phase Compensation PWM/PFM Selector Current Feedback Current Limit PWM Comparator Logic Synch Buffer Drive UVLO UVLO Cmp Ramp Wave Generator OSC Lx VSS VIN VOUT CE/MODE Control Logic VSHORT ğĊĀùúüĈöğĊĀùúýĈ ğĊĀùúüĉöğĊĀùúýĉ VSS VIN VOUT ଎ιϑτελʔτç ˙MAXIMUM ABSOLUTE RATINGS ˙BLOCK DIAGRAMS Available with CL Discharge, High Speed Soft-Start XC9235B / XC9236B Series XC9235A / XC9236A Series NOTE: The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "L" level inside, and XC9235 series chooses only PWM control. The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "H" level inside, and XC9236 series chooses only PWM/PFM automatic switching control. Diodes inside the circuit are ESD protection diodes and parasitic diodes. *Diodes inside the circuit are an ESD protection diode and a parasitic diode.

˙ELECTRICAL CHARACTERISTICS ˔XCM517Ax, 1ch Block /2ch Blockçç VOUT=1.8V, fOSC=1.2MHz, Ta=25℃ Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltageʷoutput current ) öç( input voltageʷinput current) }ʷ100 *3: ON resistance (Њ)= (VIN - Lx pin measurement voltage) öç100mA *4: Design value *5: When temperature is high, a current of approximately 10ЖA (maximum) may leak. *6: Time until it short-circuits DC OUT with GND via 1 Њof resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is sma ll, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. * 1 0 : " H "ʹVINʙVIN - 1.2V, "L" ʹ+ 0.1V ʙ - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped. PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage V OUT When connected to external components, VIN=VEN=5.0V, IOUT1=30mA 1.764 1.800 1.836 V ᶃ Operating Voltage Range V IN 2.7 - 6.0 V ᶃ Maximum Output Current I OUTMAX When connected to external components, VIN=VOUT(E)+2.0V, VEN=1.0V (*8) 600 - - mA ᶃ UVLO Voltage V UVLO VEN=VIN,VOUT=0V, Voltage which Lx pin holding “L” level (*1, *10) 1.00 1.40 1.78 V ᶅ (XCM517AA) - 22 50 Supply Current I DD V IN=VEN=5.0V, VOUT=VOUT(E)×1.1V (XCM517AC) - 15 33 ЖA ᶄ Stand-by Current I STB V IN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V - 0 1.0 ЖA ᶄ Oscillation Frequency f OSC When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA 1020 1200 1380 kHz ᶃ PFM Switching Current I PFM When connected to external components, VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA (*11) 120 160 200 mA ᶃ Maximum IPFM Limit MAX I PFM V EN=VIN=(C-1) IOUT=1mA (*11) 200 % ᶃ Maximum Duty Ratio MAXDTY V IN=VEN5.0V, VOUT=VOUT (E)×0.9V 100 - - % ᶄ Minimum Duty Ratio MINDTY V IN=VEN5.0V, VOUT=VOUT (E)×1.1V - - 0 % ᶄ Efficiency (*2) EFFI When connected to external components, VEN=VINʹVOUT (E)+1.2V (*7) , IOUT =100mA - 92 - % ᶃ Lx SW "H" ON Resistance 1 R L͇H V IN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) - 0.35 0.55 Њ ᶆ Lx SW "H" ON Resistance 2 R L͇H V IN=VEN=3.6V, VOUT=0V,ILX =100mA (*3) - 0.42 0.67 Њ ᶆ Lx SW "L" ON Resistance 1 R L͇L V IN=VEN=5.0V (*4) - 0.45 0.66 Њ - Lx SW "L" ON Resistance 2 R L͇L V IN=VEN=3.6V, (*4) - 0.52 0.77 Њ - Lx SW "H" Leak Current (*5) ILeakH V IN=VOUT =5.0V, VEN=0V, LX=0V - 0.01 1.0 ЖA ᶇ Lx SW "L" Leak Current (*5) ILeakL V IN=VOUT =5.0V, VEN=0V, LX=5.0V - 0.01 1.0 ЖA ᶇ Current Limit (*9) ILIM V IN=VEN=5.0V, VOUT=VOUT (E)ʷ0.9V (*7) 900 1050 1350 mA ᶈ Output Voltage Temperature Characteristics ˚VOUT VOUTɾ˚topr IOUT=30mA -40ˆʽToprʽ85ˆ - ʶ100 - ppm/ ˆ ᶃ EN "H" Level Voltage V ENH VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “H” level (*10) 0.65 - 6.0 V ᶅ EN "L" Level Voltage V ENL VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “L” level (*10) VSS - 0.25 V ᶅ EN "H" Current I ENH V IN=VEN=5.0V, VOUT=0V - 0.1 0. ЖA ᶇ EN "L" Current I ENL V IN=5.0V, VEN=0V, VOUT=0V - 0.1 - 0.1 ЖA ᶇ Soft Start Time t SS When connected to external components, VEN=0V → VIN , IOUT=1mA 0.5 1.0 2.5 ms ᶃ Latch Time t LAT VIN= VEN=5.0V, VOUT=0.8× VOUT(E), Short Lx at 1Ω resistance (*6) 1.0 - 20.0 ms ᶉ Short Protection Threshold Voltage VSHORT Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms 0.675 0.900 1.125 V ᶉ

˙ELECTRICAL CHARACTERISTICS (Continued) ˔XCM517Ax, 1ch Block / 2ch Blockçç VOUT=1.8V, fOSC=3.0MHz, Ta=25℃ Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltageʷoutput current ) öç( input voltageʷinput current) }ʷ100 *3: ON resistance (Њ)= (VIN - Lx pin measurement voltage) öç100mA *4: Design value *5: When temperature is high, a current of approximately 10ЖA (maximum) may leak. *6: Time until it short-circuits DC OUT with GND via 1 Њof resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. * 1 0 : " H "ʹVINʙVIN - 1.2V, "L" ʹ+ 0.1V ʙ - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped. PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage VOUT When connected to external components, VIN=VEN=5.0V, IOUT1=30mA 1.764 1.800 1.836 V ᶃ Operating Voltage Range VIN 2.7 - 6.0 V ᶃ Maximum Output Current I OUTMAX When connected to external components, VIN=VOUT(E)+2.0V, VEN=1.0V (*8) 600 - - mA ᶃ UVLO Voltage V UVLO VEN=VIN,VOUT=0V, Voltage which Lx pin holding “L” level (*1, *10) 1.00 1.40 1.78 V ᶅ (XCM517AB) - 46 65 Supply Current I DD V IN=VEN=5.0V, VOUT=VOUT(E)×1.1V (XCM517AD) - 21 35 ЖA ᶄ Stand-by Current I STB V IN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V - 0 1.0 ЖA ᶄ Oscillation Frequency f OSC When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA 2550 3000 3450 kHz ᶃ PFM Switching Current I PFM When connected to external components, VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA (*11) 170 220 270 mA ᶃ Maximum IPFM Limit MAX I PFM V EN=VIN=(C-1) IOUT=1mA (*11) 200 300 % ᶃ Maximum Duty Ratio MAXDTY V IN=VEN5.0V, VOUT=VOUT (E)×0.9V 100 - - % ᶄ Minimum Duty Ratio MINDTY V IN=VEN5.0V, VOUT=VOUT (E)×1.1V - - 0 % ᶄ Efficiency (*2) EFFI When connected to external components, VEN=VINʹVOUT (E)+1.2V (*7) , IOUT =100mA - 86 - % ᶃ Lx SW "H" ON Resistance 1 R L͇H V IN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) - 0.35 0.55 Њ ᶆ Lx SW "H" ON Resistance 2 R L͇H V IN=VEN=3.6V, VOUT=0V,ILX =100mA (*3) - 0.42 0.67 Њ ᶆ Lx SW "L" ON Resistance 1 R L͇L V IN=VEN=5.0V (*4) - 0.45 0.66 Њ - Lx SW "L" ON Resistance 2 R L͇L V IN=VEN=3.6V, (*4) - 0.52 0.77 Њ - Lx SW "H" Leak Current (*5) ILeakH V IN=VOUT =5.0V, VEN=0V, LX=0V - 0.01 1.0 ЖA ᶇ Lx SW "L" Leak Current (*5) ILeakL V IN=VOUT =5.0V, VEN=0V, LX=5.0V - 0.01 1.0 ЖA ᶇ Current Limit (*9) ILIM V IN=VEN=5.0V, VOUT=VOUT (E)ʷ0.9V (*7) 900 1050 1350 mA ᶈ Output Voltage Temperature Characteristics ˚VOUT VOUTɾ˚topr IOUT=30mA -40ˆʽToprʽ85ˆ - ±100 - ppm/ ˆ ᶃ EN "H" Level Voltage V ENH VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “H” level (*10) 0.65 - 6.0 V ᶅ EN "L" Level Voltage V ENL VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “L” level (*10) VSS - 0.25 V ᶅ EN "H" Current I ENH V IN=VEN=5.0V, VOUT=0V - 0.1 0. ЖA ᶇ EN "L" Current I ENL V IN=5.0V, VEN=0V, VOUT=0V - 0.1 - 0.1 ЖA ᶇ Soft Start Time t SS When connected to external components, VEN=0V → VIN , IOUT=1mA 0.5 1.0 2.5 ms ᶃ Latch Time t LAT VIN= VEN=5.0V, VOUT=0.8× VOUT(E), Short Lx at 1Ω resistance (*6) 1.0 - 20.0 ms ᶉ Short Protection Threshold Voltage VSHORT Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms 0.675 0.900 1.125 V ᶉ

˙ELECTRICAL CHARACTERISTICS (Continued) ˔XCM517Bx, 1ch Block / 2ch Blockçç VOUT=1.8V, fOSC=1.2MHz, Ta=25℃ Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltageʷoutput current ) öç( input voltageʷinput current) }ʷ100 *3: ON resistance (Њ)= (VIN - Lx pin measurement voltage) öç100mA *4: Design value *5: When temperature is high, a current of approximately 10ЖA (maximum) may leak. *6: Time until it short-circuits DC OUT with GND via 1 Њof resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. *10: "H"ʹVINʙVIN - 1.2V, "L" ʹ+ 0.1V ʙ - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped. PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage V OUT When connected to external components, VIN=VEN=5.0V, IOUT1=30mA 1.764 1.800 1.836 V ᶃ Operating Voltage Range V IN 2.7 - 6.0 V ᶃ Maximum Output Current I OUTMAX When connected to external components, VIN=VOUT(E)+2.0V, VEN=1.0V (*8) 600 - - mA ᶃ UVLO Voltage V UVLO VEN=VIN,VOUT=0V, Voltage which Lx pin holding “L” level (*1, *10) 1.00 1.40 1.78 V ᶄ (XCM517BA) - 22 50 Supply Current IDD V IN=VEN=5.0V, VOUT=VOUT(E)×1.1V (XCM517BC) - 15 33 ЖA ᶅ Stand-by Current I STB V IN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V - 0 1.0 ЖA ᶅ Oscillation Frequency f OSC When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA 1020 1200 1380 kHz ᶃ PFM Switching Current I PFM When connected to external components, VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA (*11) 120 160 200 mA ᶃ Maximum IPFM Limit MAX I PFM V EN=VIN=(C-1) IOUT=1mA (*11) 200 % ᶃ Maximum Duty Ratio MAXDTY V IN=VEN5.0V, VOUT=VOUT (E)×0.9V 100 - - % ᶄ Minimum Duty Ratio MINDTY V IN=VEN5.0V, VOUT=VOUT (E)×1.1V - - 0 % ᶄ Efficiency (*2) EFFI When connected to external components, VEN=VINʹVOUT (E)+1.2V (*7) , IOUT =100mA - 92 - % ᶃ Lx SW "H" ON Resistance 1 R L͇H V IN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) - 0.35 0.55 Њ ᶆ Lx SW "H" ON Resistance 2 R L͇H V IN=VEN=3.6V, VOUT=0V,ILX =100mA (*3) - 0.42 0.67 Њ ᶆ Lx SW "L" ON Resistance 1 R L͇L V IN=VEN=5.0V (*4) - 0.45 0.66 Њ - Lx SW "L" ON Resistance 2 R L͇L V IN=VEN=3.6V, (*4) - 0.52 0.77 Њ - Lx SW "H" Leak Current (*5) ILeakH V IN=VOUT =5.0V, VEN=0V, LX=0V - 0.01 1.0 ЖA ᶋ Current Limit (*9) ILIM V IN=VEN=5.0V, VOUT=VOUT (E)ʷ0.9V (*7) 900 1050 1350 mA ᶈ Output Voltage Temperature Characteristics ˚VOUT VOUTɾ˚topr IOUT=30mA -40ˆʽToprʽ85ˆ - ʶ100 - ppm/ ˆ ᶃ EN "H" Level Voltage V ENH VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “H” level (*10) 0.65 - 6.0 V ᶅ EN "L" Level Voltage V ENL VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “L” level (*10) VSS - 0.25 V ᶅ EN "H" Current I ENH V IN=VEN=5.0V, VOUT=0V - 0.1 0. ЖA ᶇ EN "L" Current I ENL V IN=5.0V, VEN=0V, VOUT=0V - 0.1 - 0.1 ЖA ᶇ Soft Start Time t SS When connected to external components, VEN=0V → VIN , IOUT=1mA - 0.25 0.4 ms ᶃ Latch Time t LAT VIN= VEN=5.0V, VOUT=0.8× VOUT(E), Short Lx at 1Ω resistance (*6) 1.0 - 20.0 ms ᶉ Short Protection Threshold Voltage VSHORT Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms 0.675 0.900 1.125 V ᶉ ̡̘Discharge Rdischg V IN = 5.0V L X = 5.0V VEN = 0V VOUT = open 200 300 450 Њ ᶊ

˙ELECTRICAL CHARACTERISTICS (Continued) ˔XCM517Bx, 1ch Block /2ch Blockçç VOUT=1.8V, fOSC=3.0MHz, Ta=25℃ Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltageʷoutput current ) öç( input voltageʷinput current) }ʷ100 *3: ON resistance (Њ)= (VIN - Lx pin measurement voltage) öç100mA *4: Design value *5: When temperature is high, a current of approximately 10ЖA (maximum) may leak. *6: Time until it short-circuits DC OUT with GND via 1 Њof resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. *10: "H"ʹVINʙVIN - 1.2V, "L" ʹ+ 0.1V ʙ - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped. PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage V OUT When connected to external components, VIN=VEN=5.0V, IOUT1=30mA 1.764 1.800 1.836 V ᶃ Operating Voltage Range V IN 2.7 - 6.0 V ᶃ Maximum Output Current I OUTMAX When connected to external components, VIN=VOUT(E)+2.0V, VEN=1.0V (*8) 600 - - mA ᶃ UVLO Voltage V UVLO VEN=VIN,VOUT=0V, Voltage which Lx pin holding “L” level (*1, *10) 1.00 1.40 1.78 V ᶄ (XCM517BB) - 46 65 Supply Current IDD V IN=VEN=5.0V, VOUT=VOUT(E)×1.1V (XCM517BD) - 21 35 ЖA ᶅ Stand-by Current I STB V IN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V - 0 1.0 ЖA ᶅ Oscillation Frequency f OSC When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA 2550 3000 3450 kHz ᶃ PFM Switching Current I PFM When connected to external components, VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA (*11) 170 220 270 mA ᶃ Maximum IPFM Limit MAX I PFM V EN=VIN=(C-1) IOUT=1mA (*11) - 200 300 % ᶃ Maximum Duty Ratio MAXDTY V IN=VEN5.0V, VOUT=VOUT (E)×0.9V 100 - - % ᶄ Minimum Duty Ratio MINDTY V IN=VEN5.0V, VOUT=VOUT (E)×1.1V - - 0 % ᶄ Efficiency (*2) EFFI When connected to external components, VEN=VINʹVOUT (E)+1.2V (*7) , IOUT =100mA - 92 - % ᶃ Lx SW "H" ON Resistance 1 R L͇H V IN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) - 0.35 0.55 Њ ᶆ Lx SW "H" ON Resistance 2 R L͇H V IN=VEN=3.6V, VOUT=0V,ILX =100mA (*3) - 0.42 0.67 Њ ᶆ Lx SW "L" ON Resistance 1 R L͇L V IN=VEN=5.0V (*4) - 0.45 0.66 Њ - Lx SW "L" ON Resistance 2 R L͇L V IN=VEN=3.6V, (*4) - 0.52 0.77 Њ - Lx SW "H" Leak Current (*5) ILeakH V IN=VOUT =5.0V, VEN=0V, LX=0V - 0.01 1.0 ЖA ᶋ Current Limit (*9) ILIM V IN=VEN=5.0V, VOUT=VOUT (E)ʷ0.9V (*7) 900 1050 1350 mA ᶈ Output Voltage Temperature Characteristics ˚VOUT VOUTɾ˚topr IOUT=30mA -40ˆʽToprʽ85ˆ - ʶ100 - ppm/ ˆ ᶃ EN "H" Level Voltage V ENH VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “H” level (*10) 0.65 - 6.0 V ᶅ EN "L" Level Voltage V ENL VOUT =0V, Applied voltage to VEN, Voltage changes Lx to “L” level (*10) VSS - 0.25 V ᶅ EN "H" Current I ENH V IN=VEN=5.0V, VOUT=0V - 0.1 0. ЖA ᶇ EN "L" Current I ENL V IN=5.0V, VEN=0V, VOUT=0V - 0.1 - 0.1 ЖA ᶇ Soft Start Time t SS When connected to external components, VEN=0V → VIN , IOUT=1mA - 0.32 0.5 ms ᶃ Latch Time t LAT VIN= VEN=5.0V, VOUT=0.8× VOUT(E), Short Lx at 1Ω resistance (*6) 1.0 - 20.0 ms ᶉ Short Protection Threshold Voltage VSHORT Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms 0.675 0.900 1.125 V ᶉ ̡̘Discharge Rdischg V IN = 5.0V L X = 5.0V VEN = 0V VOUT = open 200 300 450 Њ ᶊ

˙ELECTRICAL CHARACTERISTICS (Continued) ˔PFM Switching Current (IPFM) by Oscillation Frequency and Setting Voltage (mA) VOUT(E) ≦1.2V 140 180 240 190 260 350 1.2V＜VOUT(E) ≦1.75V 130 170 220 180 240 300 1.8V≦VOUT(E) 120 160 200 170 220 270 ˔Input Voltage (VIN) for Measuring Maximum PFM Switching Current (MAXIPFM) Limit fOSC 1.2MHz 3.0MHz (C-1) V OUT(E)+0.5V V OUT(E)+1.0V Minimum operating voltage is 2.7V. ˔Soft-start time by each setting voltageʢXCM517Bx series onlyʣ ç PRODUCT SERIES fOSC SETTING VOLTAGE MIN. TYP. MAX.ç 1200kHz 0.8ʽV OUT(E)<1.5 - 250 400Жsç 1200kHz 1.5ʽV OUT(E)<1.8 - 320 500Жsç 1200kHz 1.8ʽV OUT(E)<2.5 - 250 400Жsç XC517BA 1200kHz 2.5ʽV OUT(E)ʽ4.0 - 320 500Жsç 1200kHz 0.8ʽV OUT(E)<2.5 - 250 400Жsç XC517BC 1200kHz 2.5ʽV OUT(E)ʽ4.0 - 320 500Жsç 3000kHz 0.8ʽV OUT(E)<1.8 - 250 400ЖsçXC517BB XC517BD 3000kHz 1.8ʽV OUT(E) ʽ4.0 - 320 500Жsç

˙ TYPICAL APPLICATION CIRCUIT ˔ç fOSC= 3 . 0 M H z ˔ f OSC=1.2MHz ç L1/L2: 1.5 ЖH (NR3015 TAIYO YUDEN) çççç L1/L2: 4.7 ЖH (NR4018 TAIYO YUDEN) CIN1/CIN2: 4.7 ЖF (Ceramic) ççççççççççç CIN1/CIN2: 4.7 ЖF (Ceramic) CL1/CL2 : 10 ЖF (Ceramic) ççççççççççç CL1/CL2 : 10 ЖF (Ceramic)

˙OPERATIONAL DESCRIPTION The XCM517 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOSFET driver transistor, N-channel MOSFET switching transistor for the synchronous switch, current limiter circuit, UVLO circuit and others. (See the block diagram above.) The series ICs compare, using the error amplifier, the voltage of the internal voltage reference source with the feedback voltage from the VOUT pin through split resistors, R1 and R2. Phase compensat ion is performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current feedback circ uit monitors the P-channel MOS driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a lo w ESR capacitor such as a ceramic capacitor is used ensuring stable output voltage. <Reference Voltage Source> The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. <Ramp Wave Circuit> The ramp wave circuit determines switching frequency. The frequenc y is fixed internally and can be selected from 1.2MHz or 3.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits. <Error Amplifier> The error amplifier is designed to monitor output voltage. T he amplifier compares the reference voltage with the feedback voltage divided by the internal split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the output voltage of the error amplifier increases. The gain and frequency characteristi cs of the error amplifier output are fixed internally to deliver an optimized signal to the mixer. <Current Limit> The current limiter circuit of the XCM517 series monitors the current flowing through the P-channel MOS driver transistor connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode. ᶃçWhen the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the Lx pin at any given timing. ᶄçWhen the driver transistor is turned off, the limiter circuit is then released from the current limit detection state. ᶅçAt the next pulse, the driver transistor is turned on. However, the transistor is imm ediately turned off in the case of an over current state. ᶆçWhen the over current state is eliminated, the IC resumes its normal operation. The IC waits for the over current state to end by repeating the steps ᶃçthrough ᶅ. If an over current state continues for a few ms and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver transistor, and goes into operation suspension mode. Once the IC is in suspension mode, operations can be resumed by either turning the IC off via the EN pin, or by restoring power to the V IN pin. The suspension mode does not mean a complete shutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in operation. The current limit of the XCM517 series can be set at 1050mA at typical. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible. VEN

˙OPERATIONAL DESCRIPTION (Continued) <Short-Circuit Protection> The short-circuit protection circuit monitors the internal R1 and R2 divider voltage from the VOUT pin (refer to FB point in the block diagram shown in the previous page). In case where output is accidentally shorted to the Ground and when the FB point voltage decreases less th an half of the reference voltage (Vre f) and a current more than the I LIM flows to the driver transistor, the short-circuit pr otection quickly operates to turn off and to latch the driver transistor. In latch mode, the operation can be resumed by either turning the IC off and on via the EN pin, or by restoring power supply to the VIN pin. When sharp load transient happens, a voltage drop at the VOUT is propagated to the FB point through CFB, as a result, short circuit protection may operate in the voltage higher than 1/2 VOUT voltage. < UVLO Circuit> When the V IN pin voltage becomes 1.4V or lower, the P-channel out put driver transistor is forced OFF to prevent false pulse output caused by unst able operation of the internal circuitry. When the V IN pin voltage becomes 1.8V or higher, switching operation takes place. By rele asing the UVLO function, the IC performs t he soft start function to initiate output startup operation. The soft start function operates even when the V IN pin voltage falls momentarily below the UVLO operating voltage. The UVLO circuit does not cause a comp lete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation. <PFM Switch Current> In PFM control operation, until coil current reaches to a specified level (I PFM), the IC keeps the P-ch MOSFET on. In this case, time that the P-ch MOSFET is kept on (tON) can be given by the following formula. tON= LʷIPFM / (VINʵVOUT) ˠIPFMᶃ <Maximum IPFM Limit> In PFM control operation, the maximum duty ratio (MAXI PFM) is set to 200% (TYP.). Ther efore, under the condition that the duty increases (e.g. the condition that the step-down ratio is small), it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. çˠ IPFMᶄ IPFMᶃ Ton Lx I Lx IPFM 0mA IPFMᶄ IPFM 0mA Lx I Lx FOSC Maxumum IPFM Current tON

Output Voltage Dischage Characteristics Rdischg （）= 300Ω TYP Discharge Time t (ms) 100 0 1 02 03 04 05 06 07 08 09 0 1 0 0 CL=10uF CL=20uF CL=50uF ˙OPERATIONAL DESCRIPTION (Continued) ʻCL High Speed Dischargeʼ The XCM517Bx series can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the EN pin which enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the LX pin and the VSS pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge resistance value [R] and an output capacitor value (CL) as Н(Н=C x R), discharge time of the output voltage after discharge via the N channel transistor is calculated by the following formulas. V = VOUT(E) x e –t/Н, or t= τln (VOUT(E) / V) V : Output voltage after discharge VOUT(E) : Output voltage t: Discharge time, Н: C x R C= Capacitance of Output capacitor (CL) R= CL auto-discharge resistance

ç ç ç ç ç SWʊEN STATUS ON Stand-by OFF Operation SWʊEN STATUS ON Operation OFF Stand-by ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç <EN Pin Function> The operation of the XCM517 series will enter into the shut down mode when a low level signal is input to the EN pin. During the shutdown mode, the current consumption of the IC becomes 0ЖA (TYP.), with a state of high impedance at the Lx pin and VOUT pin. The IC starts its operation by inputting a high level signa l to the EN pin. The input to the EN pin is a CMOS input and the sink current is 0ЖA (TYP.). ˔XCM517 series - Examples of how to use EN pin (A) (B) (A) (B) ˙OPERATIONAL DESCRIPTION (Continued) ʻSoft Startʼç Soft start time is available in two options via product selection. The XCM517Ax series provide 1.0ms (TYP). The XCM517Bx series provide 0.25ms (TYP). Soft start time is defined as the time to reach 90% of the output setting voltage when the VEN pin is turned on. 90% of setting voltage EN EN SW_EN SW_EN VENH

˙NOTE ON USE 1. The XCM517 series is designed for use with ceramic output capacitors. If, however, the pot ential difference is too large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on the output. If the input-output potential difference is large, connect an electrolytic capacitor in parallel to compensate for insufficient capacitance. 2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. 3. Depending on the input-output voltage differential, or load current, some pulses may be skipped, and the ripple voltage may increase. 4. When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the possibility that some cycles may be skipped completely. 5. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that some cycles may be skipped completely. 6. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula: Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT L: Coil Inductance Value f OSC: Oscillation Frequency 7. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the external components such as a coil. 8. Care must be taken when laying out the PC Board, in order to prevent misoperation of the current limit mode. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible. 9. Use of the IC at voltages below the recommended voltage range may lead to instability. OPERATIONAL STATES EN VOLTAGE LEVEL XCM517xA/XCM517xB XCM517xC/XCM517xD H Level (*1) Synchronous PWM Fixed Control Synchronous PWM/PFM Automatic Switching L Level (*2) Stand-by Stand-by ˙FUNCTION CHART Note on EN pin voltage level range (*1) H level: 0.65V < H level < VIN (*2) L level: 0V < L level < 0.25V

˙NOTE ON USE (Continued) 10. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device. 11. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the driver transistor. 12. The current limit is set to 1350mA (MAX.) at typical. However, the current of 1350m A or more may flow. In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when N-ch MOSFET is ON, there is almost no potentia l difference at both ends of the coil since the V OUT pin is shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to t he repetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent damage to the device. çᶃ Current flows into P-ch MOSFET to reach the current limit (ILIM). ᶄThe current of ILIM or more flows since the delay time of the circuit o ccurs during from the detecti on of the current limit to OFF of P-ch MOSFET. ᶅBecause of no potential difference at both ends of the coil, the time rate of coil current becomes quite small. ᶆLx oscillates very narrow pulses by the current limit for several ms. ᶇThe circuit is latched, stopping its operation. 13. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN and VSS pins. 14. High step-down ratio and very light load may lead an intermittent oscillation. 15. During PWM / PFM automatic switching mode, operating may become unstable at transition to continuous mode. Please verify with actual parts. # ms External Components

˙NOTE ON USE (Continued) 16. Please note the inductance value of the coil. The IC may enter unstable operation if the combination of ambient temperature, setting voltage, oscillation frequency, and L value are not adequate. In the operation range close to the maximum duty cycle, The IC may happen to enter unstable output voltage operation even if using the L values listed below.

The Range of L Value fOSC VOUT L Value VOUT≦2.5V 3.3 μH～6.8μH1.2MHz 2.5V＜VOUT 4.7 μH～6.8μH *When a coil less value of 4.7 μ H is used at fOSC=1.2MHz or when a coil less value of 1.5 μH is used at f OSC=3.0MHz, peak coil current more easily reach the current limit ILMI. In this case, it may happen that the IC can not provide 600mA output current. <External Components> 17. It may happen to enter unstable operation when the IC operat ion mode goes into continuo us operation mode under the condition of small input-output voltage difference. Care must be taken with the actual design unit. <External Components> ˔Instructions of pattern layouts 1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN & VSS pins. 2. Please mount each external component as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. 5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of driver transistors.

˙TEST CIRCUITS

˙TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current VOUT=1.8V,1.2MHz ççççç VOUT=1.8V,3.0MHz L=4.7ЖH(NR4018), CIN=4.7ЖF, CL=10ЖF çççççççççç L=1.5ЖH(NR3015), CIN=4.7ЖF, CL=10ЖF 100 0.1 1 10 100 1000 Output Current:IOUT(mA) Efficency:EFFI(%) PWM/PFM Automatic Sw itching Control PWM Control VIN= 4.2V 3.6V VI N = 4.2V 3.6V 100 0.1 1 10 100 1000 Output Current:IOUT(mA) Efficency:EFFI(%) PWM/PFM Automatic Sw itching Control PWM Control VIN= 4.2V 3.6V VIN= 4.2V 3.6V (2) Output Voltage vs. Output Current VOUT=1.8V,1.2MHz ççççç VOUT=1.8V,3.0MHz L=4.7ЖH(NR4018), CIN=4.7ЖF, CL=10ЖF çççççççççç L=1.5ЖH(NR3015), CIN=4.7ЖF, CL=10ЖF 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.1 1 10 100 1000 Output Current:IOUT(mA) Output Voltage:Vout(V) PWM/PFM Automatic Sw itching Control VI N＝4.2V,3.6V PWM Contr ol 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.1 1 10 100 1000 Output Current:IOUT(mA) Output Voltage:Vout(V) PWM/PFM Automatic Sw itching Control VI N＝4.2V,3.6V PWM Control (3) Ripple Voltage vs. Output Current VOUT=1.8V,1.2MHz ççççç VOUT=1.8V,3.0MHz L=4.7ЖH(NR4018), CIN=4.7ЖF, CL=10ЖF çççççççççç L=1.5ЖH(NR3015), CIN=4.7ЖF, CL=10ЖF 100 0.1 1 10 100 1000 Output Current:IOUT(mA) Ripple Voltage:Vr(mV) PWM Control VI N＝4.2V,3.6V PWM/PFM Automatic Sw itching Control VI N＝4.2V 3.6V 100 0.1 1 10 100 1000 Output Current:IOUT(mA) Ripple Voltage:Vr(mV) PWM/PFM Automatic Sw itching Control VI N＝4.2V 3.6V PWM Control VI N＝4.2V,3.6V

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Oscillation Frequency vs. Ambient Temperature VOUT=1.8V,1.2MHz ççççç VOUT=1.8V,3.0MHz L=4.7ЖH(NR4018), CIN=4.7ЖF, CL=10ЖF çççççççççç L=1.5ЖH(NR3015), CIN=4.7ЖF, CL=10ЖF 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) VIN=3.6V Oscillation Frequency : FOSC(MHz) 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) VIN=3.6V Oscillation Frequency : FOSC(MHz) (5) Supply Current vs. Ambient Temperature VOUT=1.8V,1.2MHz ççççç VOUT=1.8V,3.0MHz -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Supply Current : IDD (μA) VIN=6.0V VI N =4.0V - 5 0 - 2 50 2 55 07 5 1 0 0 Ambient Temperature: Ta (℃) Supply Current : IDD (μA) VIN=6.0V VIN=4.0V (6) Output Voltage vs. Ambient Temperatureçççççççççç (7) UVLO Voltage vs. Ambient Temperature VOUT=1.8V,3.0MHz ççç çç VOUT=1.8V,3.0MHz 1.5 1.6 1.7 1.8 1.9 2.0 2.1 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Output Voltage : VOUT (V) VIN=3.6V 0.0 0.3 0.6 0.9 1.2 1.5 1.8 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) UVLO Voltage : UVLO (V) CE=V IN EN=VIN EN=VIN EN=VIN

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) CE "H" Voltage vs. Ambient Temperatureçççççççççç (9) CE "L" Voltage vs. Ambient Temperature VOUT=1.8V,3.0MHz ççççç VOUT=1.8V,3.0MHz 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CE "H" Voltage : VCEH (V) VIN=5.0V VI N =3.6V 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CE "L" Voltage : VCEL (V) VIN=5.0V VIN=3.6V (10) Soft Start Time vs. Ambient Temperature VOUT=1.8V,3.0MHz ççççç VOUT=1.8V,3.0MHz L=4.7ЖH(NR4018), CIN=4.7ЖF, CL=10ЖF çç çççç L=1.5ЖH(NR3015), CIN=4.7ЖF, CL=10ЖF -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Soft Start Time : TSS (ms) VI N =3.6V - 5 0 - 2 50 2 55 07 5 1 0 0 Ambient Temperature: Ta (℃) Soft Start Time : TSS (ms) VIN=3.6V (11) "Pch / Nch" Driver on Resistance vs. Input Voltage VOUT=1.8V,3.0MHz 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0123456 Input Voltage : VIN (V) Pch on Resistance Nch on Resistance Lx SW ON Resistance:RLxH,RLxL ( Ω)

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (12) XCM517BxSeries Rise Wave Form VOUT=1.2V,1.2MHz çççç V OUT=3.3V,3.0MHz (13) XCM517BxSeries Soft-Start Time vs. Ambient Temperature VOUT=1.2V,1.2MHz çççç V OUT=3.3V,3.0MHz L=4.7ЖH(NR4018), CIN=4.7ЖF, CL=10ЖF ççççççç L = 1 . 5 ЖH(NR3015), CIN=4.7ЖF, CL=10ЖF (14) XCM517BxSeries CL Discharge Resistance vs. Ambient Temperature VOUT=3.3V,3.0MHz 100 200 300 400 500 600 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) VIN=6.0V VIN=4.0V 100 200 300 400 500 -50 -25 0 25 50 75 100 Ambient Temperature: Ta(℃) Soft Start Time :TSS (μs) 100 200 300 400 500 -50 -25 0 25 50 75 100 Ambient Temperature: Ta(℃) Soft Start Time :TSS (μs)VIN=5.0V IOUT=1.0mA VIN=5.0V IOUT=1.0mA L=4.7ЖH (NR4018), CIN=4.7ЖF, CL=10ЖF L=1.5ЖH (NR3015), CIN=4.7ЖF, CL=10ЖF 100Жs/div 100Жs/div CL Discharge Resistance: (Њ) VIN=5.0V IOUT=1.0mA VIN=5.0V IOUT=1.0mA VOUTɿ0.5V/div VOUTɿ1.0V/div ENɿ0.0V˰1.0V ENɿ0.0V˰1.0V

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response VOUT=1.2V, 1.2MHz (PWM/PFM Automatic Switching Control) L=4.7ЖH(NR4018), CIN=4.7ЖF(ceramic), CL=10ЖF(ceramic), Topr=25ˆ VIN=3.6V, EN=VIN IOUT=1mA ˠ 100mA I OUT =1mA ˠ 300mA 1ch : I OUT 1 c h : I OUT 2 c h 2 c h V OUT : 5 0 m V / d i v V OUT : 50mV/div 50Жs/div 50 Жs/div I OUT=100mA ˠ 1mA I OUT=300mA ˠ 1mA 1ch : I OUT 1 c h : I OUT 2 c h 2 c h V OUT: 5 0 m V / d i v V OUT: 50mV/div 200Жs/div 200 Жs/div

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response (Continued) VOUT=1.2V, 1.2MHz (PWM Control) L=4.7ЖH(NR4018), CIN=4.7ЖF(ceramic), CL=10ЖF(ceramic), Topr=25ˆ VIN=3.6V, EN=VIN IOUT=1mA ˠ 100mA I OUT=1mA ˠ 300mA 1ch: I OUT 1 c h : I OUT 2 c h 2 c h V OUT : 5 0 m V / d i v V OUT: 50mV/div 50Жs/div 50 Жs/div I OUT=100mA ˠ 1 m A I OUT=300mA ˠ 1mA 1ch: I OUT 1 c h : I OUT 2 c h 2 c h V OUT : 5 0 m V / d i v V OUT : 50mV/div 200Жs/div 200 Жs/div

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response (Continued) VOUT=1.8V, 3.0MHz (PWM/PFM Automatic Switching Control) L=1.5ЖH(NR3015), CIN=4.7ЖF(ceramic), CL=10ЖF(ceramic),Topr=25ˆ VIN=3.6V, EN=VIN IOUT=1mA ˠ 100mA I OUT=1mA ˠ 300mA 1ch : I OUT 1 c h : I OUT 2ch çççç 2ch V OUT : 5 0 m V / d i v V OUT : 50mV/div 50Жs/div 50 Жs/div I OUT=100mA ˠ 1 m A I OUT=300mA ˠ 1mA 1ch : I OUT 1 c h : I OUT 2ch çççç 2ch V OUT : 5 0 m V / d i v V OUT : 50mV/div 200Жs/div 200 Жs/div

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response (Continued) VOUT=1.8V, 3.0MHz (PWM Control) L=1.5ЖH(NR3015), CIN=4.7ЖF(ceramic), CL=10ЖF(ceramic), Topr=25ˆ VIN=3.6V, EN=VIN IOUT=1mA ˠ 100mA I OUT=1mA ˠ 300mA 1ch : I OUT 1 c h : I OUT 2ch çççç 2ch V OUT : 5 0 m V / d i v V OUT : 50mV/div 50Жs/div 50 Жs/div I OUT=100mA ˠ 1 m A I OUT=300mA ˠ 1mA 1ch : I OUT 1 c h : I OUT 2 c h 2 c h V OUT : 5 0 m V / d i v V OUT : 50mV/div 200Жs/div 200 Жs/div

ç ç ç ç ç ç ç ç ç ç ç ç ç ç ˙PACKAGING INFORMATION 0. 2 50. 2 5 0. 6 50. 6 5 0. 9 0 1. 3 5 0. 9 0 1. 3 5 0. 4 5 0. 4 5 1. 3 0 1. 6 0 0. 1 0 0. 1 0 1. 3 0 1. 6 0 0. 3 0 0 .0250. 0 2 5 0. 2 5 0 .025 0. 0 2 5 0. 5 5 0. 9 5 0. 2 5 0. 1 5 0. 6 5 1. 0 5 0. 2 0 0. 2 00. 5 0 0. 6 0 1. 1 0 1. 5 5 0. 6 0 1. 1 0 1. 5 5 0. 5 5 0. 9 5 1. 3 0 0. 5 5 0. 9 5 1. 3 0 0. 2 50. 2 5 0. 3 5 0. 3 5 0. 5 5 0. 9 5 0. 2 5 0. 1 5 0. 6 5 1. 0 5 0. 1 50. 1 5 0. 4 0 20/1 単位： m m 123456 7891112 10 ■外部リード処理：Au m in0 .3um ※端子側面はニッケルで、Auめっきされておりません。 ※端子1は他端子に比べ太くなっています。 0. 2 5±0 .05 0. 2±0 .05 0. 2±0 .05 0. 2 ± 0. 0 5 0. 2 ± 0. 0 5 0. 2±0 .05 1234 5678 2. 8 ± 0. 0 8 0. 4 ± 0. 1 MAX0 .6 (0 .15 ) (0 .25 ) 0. 7 ± 0. 0 50. 7 ± 0. 0 5 ˔USP-12B01 Reference Pattern Layout ˔USP-12B01 Reference Metal Mask Design ˔USP-12B01 * Au plate thickness: Minimum 0.3 Жm *The side of pins is not plated, nickel is exposed. *Pin #1 is wider than other pins. UNIT: mm

The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.

Product Information

XCM517AD03DR specifications and overview.

Summary

600mA Synchronous Dual Output Step-Down DC/DC Converters

Description

600mA Synchronous Dual Output Step-Down DC/DC Converters

Source title XCM517AD03DR Datasheet(PDF) - Torex Semiconductor

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