XCM410 TOREX | Alldatasheet
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2 Channel Voltage Detector (Sense Pin separated from VDD)
ççççç ççççççççç ˙GENERAL DESCRIPTION The XCM410 series is a multi combination module IC wh ich comprises of two voltage detectors, XC6108 and XC6109 series. The two detectors inside are highly precise, low power consumption voltage detectors using laser trimming technology. The sense pin (VSEN) for channel 1 (VOUT1) is separated from power supply (VIN) so that it allows this pin to monitor added power supply. This feature enables output to maintain t he state of detection even when voltage of the monitored power supply drops to 0V. The output configuration is N-channel open-drain. ˙APPLICATIONS ˔Microprocessor reset circuitryç ˔Charge voltage monitors ˔Memory battery back-up switch circuitsç ˔Power failure detection circuitsç ç ˙FEATURES High Accuracy ɿʶ2ˋ(Detect Voltageʾ1.5V) ɿʶ30mV(Detect Voltageʻ1.5V) Low Power Consumption ç ɿ1.7ЖA (TYP) (VOUT1=1.5V, VOUT2=3.3V, VIN=4.0V) D e t e c t V o l t a g e R a n g e ɿChannel1 (VOUT1) 0.8Vʙ5.0V (0.1V increments) ɿChannel 2 (VOUT2) 1.1Vʙ5.0V (0.1V increments) Operating Voltage Range ɿ1.0Vʙ6.0V Detect Voltage Temperature Characteristics ɿʶ100ppm/ˆ(TYP.) Output Configuration ɿN-channel open drain Operating Temperature Range ɿ-40ˆʙ85ˆ Built-In 2 Detect Voltage Circuit Separated Sense Pin ɿChannel 1ʢVOUT1ʣ Small Package ɿSOT-25 ˙TYPICAL APPLICATION CIRCUIT ETR2426_001 別電源 R=100kΩ R=100kΩ 1 32 5 4 VIN VOUT1 VSS SOT-25 (TOP VIEW) VOUT2 VSEN Monitoring Power Supply
ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ˔Ordering Information XCM410ᶃᶄᶅᶆᶇᶈ DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION ᶃᶄ Output Configuration AA ɿVOUT1/VOUT2ɿN-ch open drain output ᶅᶆ Detect Voltage 01 ʙ ɿSequential numbers for two voltage detect combinationsç VOUT1 Detect Voltage Rangeɿ0.8V ʙ 5.0V (0.1V increments) VOUT2 Detect Voltage Rangeɿ1.1V ʙ 5.0V (0.1V increments) ᶇ Package M ɿSOT-25 R ɿEmbossed tape, standard feed ᶈ Device Orientation L ɿEmbossed tape, reverse feed DESIGNATOR ᶅᶆ Detect Voltage VOUT1 VOUT2 01 1.5 3.3 PIN XCM410 FUNCTION XC6108 XC6109
1 V OUT1 Output 1 VOUT -
2 V SS Ground VSS V SS
3 V OUT2 Output 2 - V OUT
4 V IN Input Voltage VIN V IN
5 V SEN Sense VSEN -
˙PRODUCT CLASSIFICATION ˙PIN CONFIGURATION ˙PIN ASSIGNMENT 1 32 5 4 VIN VOUT1 VSS SOT-25 (TOP VIEW) VOUT2 VSEN *This series are semi-custom products. For other combinations, output voltages and etc., please ask Torex sales contacts. 2:VSS1:VOUT1 3:VOUT2 XC6108 XC6109 4:VIN5:VSEN
PARAMETER SYMBOL RATINGS UNITS Input Voltage V IN V SS-0.3ʙ7.0 V Nch Open Drain V OUT1 VSS-0.3ʙ7.0 Output Voltage Nch Open Drain V OUT2 V SS-0.3ʙ7.0 V Sense Pin Voltage V SEN VSS-0.3ʙ7.0 V IOUT1 10 mA Output Current IOUT2 10 mA Power Dissipation SOT-25 Pd 250 mW Operating Temperature Range Ta -40 ʙ+85 oC Storage Temperature Range Tstg -55 ʙ+125 oC ˙BLOCK DIAGRAM ˙ABSOLUTE MAXIMUM RATINGS
˔XCM410AA Series PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Operating Voltage (*1) V IN 1 6 V - Detect Voltage 1 (*2) V DF1 E-1 V ᶃ Detect Voltage 2 (*2) V DF2 E-1 V ᶄ Hysteresis Width 1 V HYS1 V IN=1.0ʙ6.0V VDF1 X0.02 VDF1 X0.05 VDF1 X0.08 V ᶃ Hysteresis Width 2 V HYS2 V DF2(T)=1.1ʙ5.0V (*3) VDF2 X0.02 VDF2 X0.05 VDF2 X0.08 V ᶄ Supply Current 1 (*4) I SS1 VIN=VDF2ʷ0.9 VSEN=VDF1ʷ0.9 VDF2(T)=1.1Vʙ1.9V VDF2(T)=2.0Vʙ3.9V VDF2(T)=4.0Vʙ5.0V 1.4 1.5 1.6 3.3 3.5 3.6 ЖA ᶅ Supply Current 2 (*4) I SS2 VIN=VDF2ʷ1.1 VSEN=VDF1ʷ1.1 VDF2(T)=1.1Vʙ1.9V VDF2(T)=2.0Vʙ3.9V VDF2(T)=4.0Vʙ5.0V 1.8 2.0 3.1 3.6 3.8 4.0 ЖA ᶅ Output Current 1 I OUT1 VSEN=0V VDS=0.5V(N-ch) VIN=1.0V VIN=2.0V VIN=3.0V VIN=4.0V VIN=5.0V VIN=6.0V 0.1 0.8 1.2 1.6 1.8 1.9 0.7 1.6 2.0 2.3 2.4 2.5 mA ᶆ Output Current 2 I OUT2 VDS=0.5V(N-ch) VIN=1.0V (*5) VIN=2.0V (*6) VIN=3.0V (*7) VIN=4.0V (*8) 0.1 0.8 1.2 1.6 0.7 1.6 2.0 2.3 mA ᶇ N-ch Driver Leakage Current 1 ILEAK1 VIN=6.0V, VSEN=6.0V, VOUT=6.0V 0.2 0.4 ЖA ᶆ N-ch Driver Leakage Current 2 ILEAK2 VIN=6.0V VOUT=6.0V 0.2 0.4 ЖA ᶆ Temperature Characteristics (*1) ϶VDF/ ϶TaɾVDF -40 o CʽTaʽ85 o C ʶ100 ppm/ o C ᶃ Sense Resistance (*9) R SEN V SEN=5.0V VIN=0V E-2 M Њ ᶈ Detect Delay 1 (*10) t DF1 V IN=6.0V 30 230 Жs ᶉ Detect Delay 2 (*11) t DF2 V IN=6.0Vˠ1.0V 30 230 Жs ᶊ Release Delay 1 (*12) t DR1 V IN=6.0V 30 200 Жs ᶉ Release Delay 2 (*13) t DR2 V IN=1.0Vˠ6.0V 30 200 Жs ᶊ ˙ELECTRICAL CHARACTERISTICS NOTE: *1: VOUT1ŋVOUT2: same characteristics. *3: The detect voltage for VDF2(T) (V OUT2). *4: Current flowing to the sense resistor is not included. *5: V DF2(T)>1.0V *6: VDF2(T)>2.0V *7: VDF2(T)>3.0V *8: VDF2(T)>4.0V *9: Calculated from current value and voltage values at the both ends of the resistor. *10: Time until VSEN=VDF1 reaches VOUT1=VINx0.1 when VSEN falls. *11: Time until VIN=VDF2 reaches VOUT2=0.6V when VIN falls. *12: Time until VSEN=VDF1+VHYS1 reaches VOUT1=VIN when VSEN rises. *13: Time until VIN=VDF2+VHYS2 reaches VOUT2=5.4V when VIN rises.
DETECT VOLTAGE (*1) (V) SENSE RESISTANCE (MЊ) VDF1(T),VDF2(T) VDF1,VDF2 RSEN (V) MIN. MAX. MIN. TYP . 0.8 0.770 0.830 0.9 0.870 0.930 1.0 0.970 1.030 1.1 1.070 1.130 1.2 1.170 1.230 1.3 1.270 1.330 1.4 1.370 1.430 1.5 1.470 1.530 1.6 1.568 1.632 1.7 1.666 1.734 1.8 1.764 1.836 1.9 1.862 1.938 10 20 2.0 1.960 2.040 2.1 2.058 2.142 2.2 2.156 2.244 2.3 2.254 2.346 2.4 2.352 2.448 2.5 2.450 2.550 2.6 2.548 2.652 2.7 2.646 2.754 2.8 2.744 2.856 2.9 2.842 2.958 3.0 2.940 3.060 3.1 3.038 3.162 3.2 3.136 3.264 3.3 3.234 3.366 3.4 3.332 3.468 3.5 3.430 3.570 3.6 3.528 3.672 3.7 3.626 3.774 3.8 3.724 3.876 3.9 3.822 3.978 13 24 4.0 3.920 4.080 4.1 4.018 4.182 4.2 4.116 4.284 4.3 4.214 4.386 4.4 4.312 4.488 4.5 4.410 4.590 4.6 4.508 4.692 4.7 4.606 4.794 4.8 4.704 4.896 4.9 4.802 4.998 5.0 4.900 5.100 15 28 ˙VOLTAGE CHART (*1) When VDF1(T),VDF2(T)ʽ1.4V, detect accuracy is ʶ30mV. When VDF1(T),VDF2(T)ʾ1.5V, detect accuracy is ʶ2%.
⑤ The output voltage V OUT1 maintains high level (=VIN) while the sense pin voltage more than detect voltage (VSEN>VDF1). ⑥ The V IN input voltage pin is applied sufficiently high voltage to the release voltage (V DF2+VHYS2). While the input pin voltage VIN starts dropping to the detect voltage VDF2 (VIN > VDF2), the output voltage VOUT2 keeps high level (=VIN). * If a pull-up resistor of the N-ch open drain is connected to added power supply different from the input voltage pin, the high level will be a voltage value where the pull-up resistor is connected. ⑦ When the input pin voltage keeps dropping and becomes equal to the detect voltage (V IN = V DF2), the output voltage changes into low level (ʽVINʷ0.1). The detect delay time t DF2 is defined as time which ranges from VIN =VDF to the VOUT goes in low level. ⑧ While the input pin voltage keeps below the detect voltage V DF2, and 1.0V or more, the output voltage VOUT2 maintains low level. ⑨ While the input pin voltage drops to 1.0V or less and it increases again to 1.0V or more, the output voltage (VOUT2) may not be able to maintain low level. Such an operation is called “Undefined Operation”, and the output voltage from the VOUT2 pin is called undefined operating voltage VUNS. ⑩ While the input pin voltage increases from 1.0V to the release voltage level (V INʻVDF2 +VHYS2), the output voltage (VOUT2) maintains low level. ⑪ The release delay time t DR2 is defined as time which ranges from the VIN power supply voltage pin reaches release voltage (VIN≧VDF2+VHYS2) to the VOUT2 goes in high level. ⑫ The output voltage V OUT2 maintains high level (=VIN) while the power supply voltage more than detect voltage (VIN>VDF2). ⑬ If a pull-up resistor Rpull1 of the N-ch open drain is connected to power supply VIN, output voltage VOUT1 becomes same to the input voltage V IN. While the V IN power supply voltage drops below 1.0V and increases again to 1.0V or more, the output voltage VOUT2 may not be able to maintain low level. ˙OPERATIONAL EXPLANATION (Continued)
˙NOTE ON USE 1. Use this IC within the stated maximum ratings. Oper ation beyond these limits may cause degrading or permanent damage to the device. 2. The power supply input pin voltage drops by the resistance between power supply and the VIN pin, and by through current at operation of the IC. At this time, the IC may go into malfunction if the power supply input pin voltage falls below the minimum operating voltage range. 3. When the sense voltage is less than 1.0V, be sure to separate the VIN pin and the sense pin, and to apply the voltage over 1.0V to the VIN pin. 4. Note that a rapid and high fluctuation at the power supply input pin voltage may cause a wrong operation. 5. In N channel open drain output, V OUT voltages at detect and release are determi ned by resistance of a pull-up resistor connected at the VOUT pin. Please choose proper resistance values with referring to Figure 3; çç During detectionɿVOUT=Vpull / (1+Rpull / RON) VpullɿPull-up voltage RON (*1)ɿOn-resistance of N channel driver M3 can be calculated as VDS / IOUT1 from electrical characteristics, ççççç Rpull= (Vpull /VOUT-1)ʷRON= (3 / 0.1-1)ʷ625˺18̺Њ In this case, Rpull should be selected higher or equal to 18k Њ in order to keep the output voltage less than 0.1V during detection. (*1) VIN is smaller RON is bigger, be noted. (*2) For calculation, minimum VIN should be chosen among the input voltage range. During releasingɿVOUT = Vpull / (1 + Rpull / ROFF) VpullɿPull-up voltage ROFFɿOn-resistance of N channel driver M3 is 15MЊʢMIN.ʣwhen the driver is off (as to V OUT / ILEAK) For exampleɿwhen Vpull = 6.0V and VOUT ʾ 5.99V, Rpull = (Vpull / VOUT-1)ʷRoff = (6/5.99-1)ʷ15ʷ106 ˺25 kЊ In this case, Rpull should be selected smaller or equal to 25 k Њ in order to obtain output voltage higher than 5.99V during releasing. NOTE: Roff=VOUT/ILEAK Figure 3: Test Circuit
˙TEST CIRCUITS Circuit ᶃ Circuit ᶄ Circuit ᶅ Circuit ᶆ Circuit ᶇ Circuit ᶈ Circuit ᶉ Circuit ᶊ Waveform Measurement Pointᶃ Waveform Measurement Pointᶄ Waveform ᶃ Waveform ᶄ Waveform ᶃ Waveform ᶄ Waveform Measurement Pointᶃ Waveform Measurement Pointᶄ
(1)Detect Voltage vs. Ambient Temperature (2)Detect Voltage vs. Input Voltage (3)Hysteresis Voltage vs. Ambient Temperature (4)Output Voltage vs. Sense Voltage (5)Output Voltage vs. Input Voltage (6)Output Current vs. Input Voltage ˙TYPICAL PERFORMANCE CHARACTERISTICS XC6108C25AGR 2.45 2.50 2.55 - 5 0- 2 5 0 2 5 5 0 7 51 0 0 Ambient Temperature: Ta (℃) Detect Voltage: VDF (V) VIN=4.0V XC6108C25AGR 2.45 2.50 2.55 Supply Voltage: VIN (V) Detect Voltage: VDF (V) 85℃ Ta=25℃ -40℃ XC6108C25AGR 0.05 0.10 0.15 0.20 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Hysteresis Voltage: VHYS (V) VIN=4.0V XC6108C25AGR -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0123456 Sense Voltage: VSEN (V) Output Voltage: VOUT (V) Ta=25℃ 4.0V 1.0V VIN=6.0V XC6108N25AGR -1.0 0.0 1.0 2.0 3.0 4.0 00 . 5 11 . 5 22 . 5 3 Supply Voltage: VIN (V) Output Voltage: VOUT (V) VSEN=VIN Pull-up=VIN R=100kΩ 25℃ -40℃ Ta=85℃ XC6108C25AGR 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0123456 Supply Voltage: VIN (V) Output Current: Iout (mA) VD S(N ch)=0.5V Ta=-40℃ 25℃ 85℃
(7)Leak Current vs. Ambient Temperature (8)Leak Current vs. Output Voltage ˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6108N25AGR 0.10 0.15 0.20 0.25 -50 -25 0 25 50 75 100 Ambient Temperature: Ta ( ℃) Leak Carrent: ILEAK ( μ A) VI N =VSE N =6.0V VOU T =6.0V XC6108N25AGR 0.10 0.15 0.20 0.25 0123456 Supply Voltage: VOUT (V) Leak Carrent: ILEAK ( μA) VI N =VSE N =6.0V
˙PACKAGING INFORMATION ˔SOT-25 ˔SOT-25 Reference Pattern Layout *The side of pins are not gilded, but nickel is used: Sn 5 ʙ15Жm
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