XCL301

XCL301 TOREX | Alldatasheet

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Inductor Built-in Inverting “micro DC/DC” Converters ■FEATURES Input Voltage Range : 2.7V~5.5V Output Voltage : -3.3V Output Voltage accuracy ±2.0% O u t p u t C u r r e n t : - 5 0 m A @ VOUT=-3.3V, VIN=3.3V (TYP) Internal Driver : 1 . 3 Ω (Pch Driver Tr) Q u i e s c e n t C u r r e n t :4 0 μA (TYP.) C o n t r o l M e t h o d s : PFM / Fixed off time PWM Auto Transient Response : -50mV (VIN=3.3V,VOUT=-3.3V,IOUT=1mA→50mA) PFM switch Current : 550mA Function : Current Limit Soft-Start CL High Speed Discharge UVLO CL High Speed Discharge Operating Ambient Temperature : -40 ～+85℃ Packages : CL-2025-02 Environmentally Friendly : EU RoHS Compliant, Pb Free ■GENERAL DESCRIPTION The XCL301 series is a inverting micro DC/DC converter which integrates a P-channel FET, an inductor and a control IC in applications that require an internally -3.3V fixed output voltage. The XCL301 series uses automatic PFM/fixed off time PWM. In automatic PFM/fixed off time PWM control, the IC operates by PFM control when the load is light to achieve high efficiency over the full load range from light to heavy. The device provides a stable inverting power supply to be configured using only a SBD and two capacitors connected externally. During stand-by, all circuits are shutdown to reduce current consumption to as low as 0.1μA (TYP) or less. With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel MOS driver transistor is forced OFF when input voltage becomes 2.2V or lower. The XCL301 integrate CL High Speed discharge function which enables the electric charge at the output capacitor CL to be discharged via the internal discharge. ■APPLICATIONS

• Negative power supply for AMP
• Negative power supply for LCD
• Negative power supply for CCD
• General purpose Negative power supply ☆GreenOperation Compatible ETR28015-002 ■TYPICAL APPLICATION CIRCUIT 3 4 6Lx VOUT NC CE GND VIN CIN 10μF CL 10μF SD ■TYPICAL PERFORMANCE CHARACTERISTICS
• Efficiency-Output Voltage

■BLOCK DIAGRAM ■PRODUCT CLASSIFICATION

• Ordering Information XCL301①②③④⑤⑥-⑦ DESIGNATOR ITEM SYMBOL DESCRIPTION ① Product Type A Refer to Selection Guide ②③ Output Voltage 33 Out put Voltage = -3.3V only ④ PFM Switch Current 1 550mA (TYP.) ⑤⑥-⑦ (*1) Packages (Order Unit) ER-G CL-2025-02 (3,000pcs/Reel) (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
• Selection Guide TYPE OUTPUT VOLTAGE CL DISCHARGE UVLO CHIP ENABLE A -3.3V Fixed Yes Yes Yes * Diodes inside the circuit are an ESD protection diode and a parasitic diode. Logic Vreｆ for U.V.L.O. Error Amp PWM Comparator LX Buffer Drive Internal ON/OFF Controller VIN GND VOUT CE Current Limit UVLO Vref CL Discharge Current Feedback Inductor L2 L1

XC9140 (Design Target) XCL301 Series ■PIN CONFIGURATION ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS CL-2025-02

1 L X Switching Output

2 V OUT Output Voltage

3 NC No Connection

4 CE Chip Enable

5 GND Ground

6 V IN Power Input

7 L1 Inductor Electrodes

8 L2 Inductor Electrodes

■ FUNCTION PIN NAME SIGNAL STATUS CE H Operation L Standby * Please do not leave the CE pin open. ■ABSOLUTE MAXIMUM RATINGS Ta=25˚C PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage V IN -0.3 ~ +6.0 V LX Pin Voltage V LX V IN-13.0 ~ VIN+0.3 or +6.0 (*1) V VOUT Pin Voltage V OUT V IN-22.0 ~ VIN+0.3 or +6.0 (*1) V CE Pin Voltage V CE -0.3 ~ +6.0 V LX Pin Current I LX 1500 mA Power Dissipation Pd 1000(40mm×40mm, t=1.6mm, FR-4) (*2) mW Operating Ambient Temperature Topr -40 ~ +85 ˚C Storage Temperature Tstg -55 ~ +125 ˚C * All voltages are described based on the GND pin. (*1) The maximum value should be either VIN +0.3V or +6.0V in the lowest. (*2) The value of power dissipation varies with the mount board (40mm×40mm, FR-4) conditions. * The dissipation pad should be solder-p lated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 5) pin. NC (No.3) doesn’t connect to IC chip. (BOTTOM VIEW) VIN 6 GND 5 CE 4 1 Lx

2 VOUT

■ELECTRICAL CHARACTERISTICS XCL301A33AER-G Measurement conditions: Unless otherwise stated, VIN=VCE=3.7V (*1) VOUT pin voltage measured when LX pin oscillation starts. (*2) VOUT (E) is Effective Output Voltage (*3) VOUT (T) is nominal output voltage (-3.3V) (*4) EFFI= {(Output Voltage) × (Output Current)} / {(Input Voltage) × (Input Current)} ×100 (*5) On resistance = (Voltage measured at VIN pin – Voltage measured at LX pin) / 100mA (*6) "H" = VIN～VIN -1.2V, "L" = +0.1V～-0.1V PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Input Voltage V IN - 2.700 - 5.500 V - Output Voltage (*1) V OUT(E) (*2) The voltage which LX starts oscillation while VOUT is increasing. -3.366 -3.300 -3.234 V ① UVLO Detection Voltage VUVLOD VIN=VCE,VOUT=0V, Voltage which Lx pin holding “L” level (*6) 1.75 2.20 - V ① UVLO Release Voltage VUVLOR VIN=VCE,VOUT=0V, Voltage which Lx pin holding “H” level (*6) - 2.35 2.69 V ① UVLO Hysteresis Width VUVLOH V UVLOH=VUVLOH - VUVLOD 0.02 0.15 0.25 V ① Supply Current I DD V IN=VCE =5.5V, VOUT=VOUT(T)×1.1V (*3) - 40 80 μA ② Stand-by Current ISTB V IN=5.5V, VCE=0V - 0 1.0 μA ③ PFM Switch Current I PFM When connected to external components, IOUT=1mA 280 550 800 mA ④ ILIMSS Switch Current I LIMSS When connected to external components, IOUT=1mA 150 400 700 mA ④ Efficiency (*4) EFFI When connected to external components, IOUT =10mA - 63 - % ④ LX SW "High" ON Resistance (*5) RLXH I LX=100mA 0.8 1.3 1.95 Ω ⑤ LX SW "Low" Leakage Current ILEAKL V IN=5.5V, VCE=0V, VLX=0V - 0.01 1.00 μA ⑥ Maximum Current Limit I LIM When connected to external components 550 900 1300 mA ④ Output Voltage Temperature Characteristics UVOUT / (VOUT・Utopr) IOUT=10mA, -40℃< Topr < 85℃ - ±100 - ppm / oC ④ CL Auto-Discharge Resistance RDCHG V IN=3.7V, VCE=0V, VOUT =-1V 180 300 480 Ω ⑥ CE "High" Voltage V CEH VIN=5.5V, VOUT=VOUT(T)×0.9V (*3) , Applied voltage to VCE, voltage changes LX to "H" level (*6) 1.2 - 5.5 V ① CE "Low" Voltage V CEL VIN=5.5V, VOUT=VOUT(T)×0.9V (*3) , Applied voltage to VCE, voltage changes LX to "L" level (*6) GND - 0.4 V ① CE "High" Current I CEPH V IN=VCE=5.5V -0.1 - 0.1 μA ⑥ CE "Low" Current I CEPL V IN=5.5V, VCE=0V -0.1 - 0.1 μA ⑥ Inductance Value L Test Frequency=1MHz - 4.7 - μH - Inductor Rated Current IDC ∆T=+40℃ - 700 - mA - Ta=25˚C

XC9140 (Design Target) XCL301 Series ■ TEST CIRCUITS TEST CIRCUITS CE GND VIN VOUT LX 22μF 0.1μF 47Ω L2 L1 < Test Circuit No. ① > Wave Form Measu re Poin t CE GND VIN VOUT LX 22μF 0.1μF L2 L1 < Test Circuit No. ② > A CE GND VIN VOUT LX 22μF L2 L1 < Test Circuit No. ③ > A CE GND VIN VOUT LX 22μF 10μF 47Ω L2 L1 < Test Circuit No. ④ > Wave Form Measure Point A CE GND VIN VOUT LX 22μF L2 L1 < Test Circuit No. ⑤ > V IS CE GND VIN VOUT LX 22μF 0.1μF L2 L1 < Test Circuit No. ⑥ > Wave Form Measu re Poin t A A A

■TYPICAL APPLICATION CIRCUIT 【Typical Examples】 MANUFACTURE PRODUCT NUMBER VALUE CIN TAIYO YUDEN LMK105CBJ106MVLF 10μF/10V CL TAIYO YUDEN LMK105CBJ106MVLF×2 10μF/10V SD PANJIT SBA240CH 2A/40V * Take capacitance loss, withstand voltage, and other conditions into consideration when selecting components. * Recommend 20uF for CL Value. * If a tantalum or electrolytic capacitor is used for the load capacitance CL, ripple voltage will increase, and there is a possibility that operation will become unstable. Test fully using the actual device. 3 4 6Lx VOUT NC CE GND VIN CIN 10μF CL 10μF×2 SD

XC9140 (Design Target) XCL301 Series ■OPERATIONAL EXPLANATION The XCL301 series consists of a reference voltage source, error amplifier, PWM comparator, output voltage adjustment resistance, P-ch MOS driver transistor, current limiting circuit, UVLO circuit, and other components (refer to the block diagram). The internal reference voltage and the feedback voltage from the VOUT pin that passes through R3 and R4 are compared by the error amplifier and a signal that determines the on time for switching during PWM operation is generated. A current feedback circuit detects the current of the P-ch MOS driver transistor at each switching and generates a current feedback signal. The PWM comparator compares the signal generated by the error amplifier and the current feedback signal, sends the output to the buffer drive circuit, and this is output from the LX pin as the on time of switching. The off time of PWM operation is fixed inside the IC, and the P-ch MOS driver transistor is turned on after the fixed time elapses. This operation is performed continuously to stabilize the output voltage. XCL301 Series <Vref> Reference voltage that acts as the reference used to stabilize the output voltage of this IC. <Error Amp.> The error amplifier is designed to monitor the output voltage. The voltage divided by the internal R3 and R4 resistances is fed back and compared to the reference voltage. In response to feedback of a voltage higher than the reference voltage, the output voltage of the error amplifier increases. The frequency characteristics of the error amplifier are optimized internally. <Current Feedback> Detects the current of the P-ch MOS driver transistor at each switching and generates a current feedback signal. <PWM Comparator> The signal generated by the error amplifier and the current feedback signal are compared, and when the signal generated by the error amplifier is lower, a signal that turns the driver transistor off is output. <Buffer Drive> Outputs the signal that drives the P-ch MOS driver transistor. Logic Vreｆ for U.V.L.O. Error Amp PWM Comparator LX Buffer Drive Internal ON/OFF Controller VIN GND VOUT CE Current Limit UVLO Vref CL Discharge Current Feedback Inductor L2 L1

■OPERATIONAL EXPLANATION (Continued) <Current Limit> The current limiting circuit of the XCL301 series monitors the current that flows through the P-ch MOS driver transistor that is connected to the LX pin and limits the current. (1) If the driver current is higher than a specific current, the current limiting function activates and turns off the pulse that is output from the LX pin at any selected timing. (2) The driver transistor remains off until the inductor current becomes 0A. (3) The P-ch MOS driver transistor turns on at the timing of the next pulse, however, if there is over-current at this time, the P-ch MOS driver transistor turns off immediately. (4) When the over-current state no longer exists, normal operation takes place. While repeating (1) to (3), the IC waits for the over-current state to stop. <UVLO> To prevent incorrect pulse output due to instable operation of the internal circuitry when the V IN pin voltage drops below 2.2V (TYP.), the driver transistor is forcibly turned off. When the VIN pin voltage rises higher than 2.35V (TYP.), switching operation is performed. When the UVLO function is canceled, the soft-start function activates and output start operation begins. Soft-start also operates if the VIN pin momentarily drops below the UVLO operation voltage. The UVLO function only stops pulse output; it does not shut down the IC and thus the internal circuitry continues to operate. <PFM Switch Current> During PFM operation, the P-ch MOS driver transistor is on until the current flowing through the inductor reaches a specific value PFM). This P-ch MOS driver transistor on time (tON) is determined by the following equation: tON = L × IPFM / VIN Current Limit LE VEL 0mA VIN CE LX ILX GND GND

XC9140 (Design Target) XCL301 Series ■OPERATIONAL EXPLANATION (Continued) < CL Auto Discharge > The XCL301 series allows high-speed discharge of the output capacitor (CL) through the IC internal CL discharge resistance when an L level signal is input into the CE pin (when the IC is in the standby state). This makes it possible to prevent application malfunctioning due to a charge remaining on CL when the IC is stopped. The discharge time is determined by the CL discharge resistance and CL. t = -τln ((VIN-V) /(VIN-VOUT(T))) V: Output voltage after discharge VOUT (T): Nominal output voltage t: Unit: mm Discharge time τ: CL×RDCHG CL: Capacitance of output capacitor RDCHG: CL auto-discharge resistance <CE Pin Function> The XCL301 series can be put in the shutdown state by L level input to the CE pin. In the shutdown state, the supply current of the IC is 0μA (TYP.). Operation is started by inputting H level to the CE pin. The CE pin input is CMOS input and the sink current is 0μA (TYP.). <The rise operation> The rise time is determined by the input voltage, output voltage, output capacitance, and soft-start current limit (I LIMSS). (1) When the CE pin is turned on, the driver transistor turns on. (2) When the driver current exceeds the soft-start current limit value, the driver transistor is turned off. (3) The driver transistor remains off until the inductor current becomes 0A. (4) When the inductor current becomes 0A, the driver transistor is turned on again. (5) If the output voltage is larger than setting voltage, the operations of (2) to (5) are repeated. (6) When the output voltage becomes smaller than setting voltage, operation starts in PFM/fixed off-time PWM control. Current Limit LE VEL in Start-up 0mA GND LX VOUT ILX VIN CE GND GND 100% of set ting voltage

■NOTE ON USE 1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC. 2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the characteristics of the capacitor used for the load capacity C L and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA Standard) ceramic capacitor. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance. 5. When the input voltage is high or the ambient temperature is low temperature, there is a case that the coil current at the time of rise is superimposed and the inrush current becomes larger than 700 mA Please test fully using the actual device before use. (See the figure below) VIN=5.5V, VOUT=-3.3V, IOUT=10mA, Ta=-40℃ Z O O M 6. Ripple voltage will be if both the input voltage is high and the ambient temperature is low. Once the design has been completed, verification with actual components should be done. (Please refer to below) V IN=5.5V, VOUT=-3.3V, IOUT=50mA, Ta=-40℃ Lx [10V/div] VOUT [100mV/div] Use of the IC at voltages below the recommended voltage range may lead to instability. 8. In case load current (resistance load) is large when rising, output voltage may not reach the setting voltage. Once the design has been completed, verification with actual components should be done. 9. CL discharge function may end even if more than 10% output voltage remains at the following conditions: CE pin=L with lower than 3V input voltage, or input voltage is lower than UVLO detection voltage. (*1) 10. CL discharge function may not work under any of the following conditions: When the voltage at the CE pin is turned Low level, following a situation when the output voltage never reached less than -3V despite the voltage at the CE pin was turned high level. With the CE pin connected to V IN, when the VIN voltage drops below the UVLO detect voltage, following a situation when the output voltage never reached less than -3V despite the input voltage rise above the UVLO release voltage. (*1) ILX[500mA/div] VOUT[2V/div] LX[10V/div] CE[10V/div] 100[us/div] 10[us/div]

XC9140 (Design Target) XCL301 Series ■NOTE ON USE (Continued) 11. If the output is short-circuited, the IC internal power dissipation may exceed the power dissipation specified in the data sheet even if the inductor current does not reach the maximum current limit. 12. When the input voltage is hi gh or the ambient temperature is low, the coil current may be superimposed and the maximum current limit value may exceed 1300 mA. This may cause the possibility of exceeding the rated current of the IC, coil and schottky diode in some cases. Please test fully using the actual device before use. 13. For temporary, transitional voltage dr op or voltage rising phenomenon, the IC is liable to malfunction should the ratings b e exceeded. 14. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 15. Please use within the power dissipation range below. Please al so note that the power dissipation may be changed by test conditions, the power dissipation figure shown is PCB mounted. The power loss of micro DC/DC according to the following formula: Power loss = V OUT×IOUT× ((100/EFFI) – 1) (W) VOUT: Output Voltage (V) IOUT: Output Current (A) EFFI: Conversion Efficiency (%) Power dissipation vs. Operating Temp Package Body Temp vs. Operating Temp

■NOTES ON LAYOUT 1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the V IN & GND pins. 2. Please mount each external component as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. 5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-ch MOS driver transistors. 6. As precautions on mounting, please set the mounting position accuracy within 0.05 mm.

• Recommended Pattern Layout T o p v i e w B o t t o m v i e w ■ABOUT THE APPEARANCE (1) Coils are compliant with general surface mount type chip coil (inductor) specifications and may have scratches, flux contamination and the like.

XC9140 (Design Target) XCL301 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current (2) Output Voltage vs. Output Current (3) Ripple Voltage vs. Output Current (4) Output Voltage Vs. Ambient Temperature (5) Supply Current vs. Ambient Temperature (6) Standby Current vs. Ambient Temperature 0.0 1.0 2.0 3.0 4.0 5.0 - 5 0 - 2 50 2 55 07 5 1 0 0 Standby Current: ISTB (μA) Ambient Temperature: Ta( ℃) XCL301A331 VＩＮ=2.7V,3.7V,5.5V VCE=0V 100 -50 -25 0 25 50 75 100 Supply Current : IDD (μA) Ambient Temperature: Ta( ℃) XCL301A331 VIN=3.7V VIN=VCE,VOUT=VOUT(T) ×1.1 -5.0 -4.0 -3.0 -2.0 -1.0 -50 -25 0 25 50 75 100 Output Voltage : V OUT (V) Ambient Temperature: Ta( ℃) XCL301A331 VIN=2.7V,5.5V 0.1 1 10 100 E ffi ci e n cy : E FFI ( % ) Output Current : I OUT (mA) VIN=3.6V VIN=2.7V VIN=5.0V XCL301A331 CIN=10μF(LMK105CBJ106MVLF),CL=10μF×2(LMK105CBJ 106MV LF) SBD:SBA240CH -3.5 -3.4 -3.3 -3.2 -3.1 0.1 1 10 100 Output Voltage : V OUT (V) Output Current : I OUT (mA) VIN=2.7V,3.6V,5.0V XCL301A331 CIN=10μF(LMK105CBJ106MVLF),CL=10μF×2(LMK105CBJ 106MV LF) SBD:SBA240CH 100 150 200 250 300 0.1 1 10 100 Ripple Voltage : Vr (mV) Output Current : I OUT (mA) XCL301A331 CIN=10μF(LMK105CBJ106MVLF),CL=10μF×2(LMK105CBJ 106MV LF) SBD:SBA240CH VIN=2.7V VIN=3.6V VIN=5.0V

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) UVLO Release Voltage vs. Ambient Temperature (8) PFM Switching Current vs. Ambient Temperature (9) Minimum OFF Time vs. Ambient Temperature (10) Maximum ON Time vs. Ambient Temperature (11) Lx SW "Hign" ON Resistance vs. Ambient Temperature (12) Lx SW "Low" Leakage Current vs. Ambient Temperature 0.0 0.5 1.0 1.5 2.0 2.5 -50 -25 0 25 50 75 100 LX SW “Pch” ON Resistance: RLXP (Ω) Ambient Temperature: Ta( ℃) XCL301A331 VIN=3.7V VIN=VCE,VOUT=0V,ILX=100m A 0.0 0.5 1.0 1.5 2.0 2.5 3.0 - 5 0 - 2 50 2 55 07 5 1 0 0 LX Leak Current : I LXL (μA) Ambient Temperature: Ta ( ℃) VIN =5.5V XCL301A331 VCE=0V,VLX=0V 0.0 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 Maximum ON Time: t ONMAX (μS) Ambient Temperature: Ta( ℃) XCL301A331 VIN=2.7V,3.6V,4.2V 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 Minimum OFF Time: t OFFMIN (μS) Ambient Temperature: Ta( ℃) XCL301A331 VIN=2.7V,3.7V,5.5V 200 400 600 800 1,000 - 5 0 - 2 50 2 55 07 5 1 0 0 PFM Switching Current: I PFM (mA) Ambient Temperature: Ta ( ℃) XCL301A331 CIN=10μF(LMK105CBJ106MVLF),CL=10μF×2(LMK105CBJ 106MV LF) SBD:SBA240CH VIN=2.5V VIN=5.5V VIN=3.7V 1.90 2.10 2.30 2.50 2.70 - 5 0 - 2 50 2 55 07 5 1 0 0 UVLO Release Voltage: V RELEASE (V) Ambient Temperature: Ta( ℃) XCL301A331 VIN=VCE,VOUT=0V VR ELEASE( T)=2.35V

XC9140 (Design Target) XCL301 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) CE "High" Voltage vs. Ambient Temperature (14) CE "Low" Voltage vs. Ambient Temperature (15) CL Discharge vs. Ambient Temperature (16) Rising Output Voltage (17) Load Transient Response 100 200 300 400 500 600 -50 -25 0 25 50 75 100 CL Auto-Discharge Resistance: ( Ω) Ambient Temperature: Ta ( ℃) XCL301A331 VIN=2.5V VCE=0V,VOUT=-1.0V VIN=5.5V 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 CE “Low” Voltage: VCEL (V) Ambient Temperature: Ta ( ℃) XCL301A331 VIN=2.7V,5.5V 0.0 0.5 1.0 1.5 2.0 - 5 0 - 2 50 2 55 07 5 1 0 0 CE “High” Voltage: VCEH (V) Ambient Temperature: Ta ( ℃) XCL301A331 VIN=2.7V,5.5V XCL301A331 VIN=VCE=0→3.7V,IOUT=100uA VOUT:2V/div,VIN:5V/div,VLX :5V/di v,Time: 200μs/di v CIN=10μF(LMK105CBJ106MVLF),CL=10μF×2(LMK105CBJ 106MV LF) SBD:SBA240CH VOUT VIN VLX XCL301A331 VIN=3.7V, IOUT=-1mA→-50mA VOUT:100mV/div,IOUT :50mA/di v,VLX :5 V /d iv,Tim e:1 00μs/di v CIN=10μF(LMK105CBJ106MVLF),CL=10μF×2(LMK105CBJ 106MV LF) SBD:SBA240CH VOUT Iout VLX

■PACKAGING INFORMATION

• CL-2025-02 (unit: mm) ■External Lead
• Reference Pattern Layout ( u n i t : m m ) ●Reference Metal Mask Design (unit: mm) 213 654 2.5±0.1 (0.32 MAX)(0.32 MAX) 2.0±0.1

1.04 MAX

0.3±0.05 0.2±0.05 1.1±0.05 0.2±0.05 (0.22) (0.22)(0.55) ■外部リード処理 Au Sn 1PIN INDENT 0.3 2.9 1.5 0.30.3 0.35 0.3750.375 0.4 2.1 0.4 0.55 0.55 1.1 2.1 2.25 2.85 1.30.45 0.45 0.3 0.5 0.9 2.05 2.2 2.20.325 0.325 0.3 0.55 0.55

XC9140 (Design Target) XCL301 Series

■MARKING RULE

• C L - 2 0 2 5 - 0 2 ① Represents products series ② Represents integer of the output voltage ③ Represents the decimal part of output voltage ④, ⑤ represents production lot number (G, I, J, O, Q, W excluded) Note: No character inversion used. MARK PRODUCT SERIES MARK Product Type Output Voltage (V) PFM Switch Current (mA) PRODUCT SERIES 3 A -3.x 550 (TYP) XCL301A3*1ER-G MARK Output Voltage （V) PRODUCT SERIES 3 -x.3 XCL301**3*ER-G ⑤ ④

XC9140 (Design Target) XCL301 Series 1. The product and product specific ations contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or repres entations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulati ons should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted fo r use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious propert y damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to impr ove the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their de signs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD.