XCL201

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Inductor Built-in Step-Down “micro DC/DC” Converters çççççç 100 0.01 0.1 1 10 100 1000 Output Current:IOUT (mA) Efficency:EFFI(%) 5.0V VOUT=3.3V XCL202(PWM/PFM) XCL201(PWM) 4.2V VIN= 5.5V ˙çTYPICAL PERFORMANCE CHARACTERISTICS ■APPLICATIONS ˔Mobile phones, Smart phones ˔Bluetooth Headsets ˔WiMAX PDAs, MIDs, UMPCs ˔Portable game consoles ˔Digital cameras, Camcorders ˔SSD(Solid State Drive) ˔PND(Portable Navigation Device) ˙TYPICAL APPLICATION CIRCUIT ETR2802-003 XCL201B331BR/XCL202B331BR VIN Vss CE LX Vss VOUT CL 10ЖF 4.7ЖF CIN 400mA XCL201/XCL202 Series ■GENERAL DESCRIPTION The XCL201/XCL201 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in one tiny package (2.5mm×2.0mm, h=1.0mm). A stable power supply with an output current of 400mA is configured using only two capacitors connected externally. transistor. As for operation mode, the XC L201 series is PWM control, the XCL202 series is automatic PWM/PFM switching control, allowing fast response, low ripple and high efficiency over the full range of loads (from light load to heavy load). During stand-by, the device is shutdown to reduce current consumption to as low as 1.0μA or less. With the built-in UVLO (Under Voltage Lock Out) function, the internal driver transistor is forced OFF when input voltage becomes 1.4V or lower. The series provide short-time turn-on by the soft start function internally set in 0.25ms (TYP). The series integrate C L auto discharge function which enables the electric charge stored at the output capacitor CL to be discharged via the internal auto-discharge switch located between the LX and VSS pins. When the devices enter stand-by mode, output voltage quickly returns to the VSS level as a result of this function. ■FEATURES Ultra Small : 2.5mm ʷ2.0mm, h=1.0mm Input Voltage : 2.0V ~ 6.0V Output Voltage : 0.8V ~ 4.0V ( ±2.0%) High Efficiency : 92%(V IN=4.2V,VOUT=3.3V) Output Current : 400mA Oscillation Frequency : 1.2MHz ( ±15%) Maximum Duty Cycle : 100% Output Capacitor : Low ESR Ceramic Current Limiter Circuit : Constant Current & Latching Control Methods : PWM (XCL201) PWM/PFM Auto (XCL202) CE Function : Soft-Start Circuit Built-In Operating Ambient Temperature : -40ˆʙ+85ˆ Environmentally Friendly : EU RoHS Compliant, Pb Free (TOP VIEW) * “L1 and LX”, and “L2 and VOUT” is connected by wiring. ˑGreenOperation Compatible

■PIN CONFIGURATION ■PIN ASSIGNMENT ■PRODUCT CLASSIFICATION ˔Ordering Information XCL201ᶃᶄᶅᶆᶇᶈ-ᶉ (*1) Fixed PWM control XCL202ᶃᶄᶅᶆᶇᶈ-ᶉ (*1) PWM / PFM automatic switching control PIN NUMBER PIN NAME FUNCTION

1 L x Switching Output

2,5 V SS Ground

3 V OUT Output Voltage

4 CE Chip Enable

6 V IN Power Input

8 L2 Inductor Electrodes

DESIGNATOR ITEM SYMBOL DESCRIPTION ᶃ Functions selection B C L auto discharge, High speed soft-start 10 1.0V 12 1.2V 15 1.5V 18 1.8V 25 2.5V 28 2.8V 30 3.0V ᶄᶅ Output Voltage (*2) 33 3.3V ᶆ Oscillation Frequency 1 1.2MHz ᶇᶈ-ᶉ (*1) Package (Order Unit)ç BR-G CL-2025 (3,000/Reel) (BOTTOM VIEW) V IN 6 Vss 5 1 Lx

2 Vss

3 VOUT CE

• It should be connected the VSS pin (No. 2 and 5) to the GND pin. * If the dissipation pad needs to be connected to other pins, it should be connected to the GND pin. * Please refer to pattern layout page for the connecting to PCB. (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. (*2) When other output voltages are needed, please contact your local Torex sales office for more information. Output voltage range is 0.8~4.0V.

■BLOCK DIAGRAM ççç ç CE/ CE Error Amp. Vref with Soft Start, CE Phase Compensation Current Feedback Current Limit PWM Comparator Logic Synch Buffer Drive UVLO UVLO Cmp Ramp Wave Generator OSC Lx VSS VIN VOUT CE Control Logic VSHORT FB CFB Inductor VSS L2 L1 PWM/PFM Selector ■ABSOLUTE MAXIMUM RATINGS Ta = 25ˆ PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage V IN - 0.3 ~ 6.5 V LX Pin Voltage V LX - 0.3 ~ V IN + 0.3ʽ6.5 V VOUT Pin Voltage V OUT - 0.3 ~ 6.5 V CE Pin Voltage V CE - 0.3 ~ 6.5 V LX Pin Current I LX ʶ1500 mA Power Dissipation Pd 1000 *1 mW Operating Ambient Temperature Topr - 40~ +85 ˆ Storage Temperature Tstg - 40 ~ +105 ˆ ˔XCL201B / XCL202B Series NOTE: The XCL201 offers a fixed PWM control, a signal from CE Control Logic to PWM/PFM Selector is fixed to "L" level inside. T he XCL202 control scheme is PWM/PFM automatic switching, a signal from CE Control Logic to PWM/PFM Selector is fixed to "H" level inside. The diodes placed inside are ESD protection diodes and parasitic diodes. *1: The power dissipation figure shown is PCB mounted (40mmʷ40mm, t=1.6mm, Glass Epoxy FR-4). Please refer to page 12 for details.

■ELECTRICAL CHARACTERISTICS XCL201B121BR/XCL202B121BR, VOUT=1.2V, fOSC=1.2MHz, Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage V OUT When connected to external components, VIN=VCE=5.0V, IOUT=30mA 1.176 1.200 1.224 V ① Operating Voltage Range VIN 2.0 - 6.0 V ① Maximum Output Current IOUTMAX VIN=VOUT(T)+2.0V, VCE=1.0V When connected to external components (*8) 400 - - mA ① UVLO Voltage V UVLO VCE=VIN,VOUT=0V Voltage which Lx pin holding “L” level (*1, *10) 1.00 1.40 1.78 V ② Supply Current (XCL201) - 22 50 Supply Current (XCL202) IDD V IN=VCE=5.0V, VOUT=VOUT(T)ʷ1.1V - 15 33 μA ② Stand-by Current I STB V IN=5.0V, VCE=0V, VOUT= VOUT(T)ʷ1.1V - 0 1.0 μA ③ Oscillation Frequency fOSC When connected to external components, VIN=VOUT(T)+2.0V, VCE=1.0V , IOUT=100mA 1020 1200 1380 kHz ① PFM Switching Current (*11) I PFM When connected to external components, VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA 140 180 240 mA ⑩ PFM Duty Limit (*11) DTY LIMIT_PFM V CE=VIN = 2.0V, IOUT=1mA - 200 300 % ① Maximum Duty Cycle MAXDTY V IN=VCE=5.0V, VOUT=VOUT (T)ʷ0.9V 100 - - % ③ Minimum Duty Cycle MINDTY V IN=VCE=5.0V, VOUT=VOUT (T)ʷ1.1V - - 0 % ③ Efficiency (*2) EFFI When connected to external components, VCE=VIN=VOUT (T)+1.2V, IOUT=100mA - 86 - % ① Lx SW "H" ON Resistance 1 RL͇H1 V IN=VCE=5.0V, VOUT=0V,ILX=100mA (*3) - 0.35 0.55 Ω ④ Lx SW "H" ON Resistance 2 RL͇H2 V IN=VCE=3.6V, VOUT=0V,ILX=100mA (*3) - 0.42 0.67 Ω ④ Lx SW "L" ON Resistance 1 RL͇L1 V IN=VCE=5.0V (*4) - 0.45 0.66 Ω - Lx SW "L" ON Resistance 2 RL͇L2 V IN=VCE=3.6V (*4) - 0.52 0.77 Ω - Lx SW "H" Leakage Current (*5) I LeakH V IN=VOUT=5.0V, VCE=0V, LX=0V - 0.01 1.0 μA ⑨ Current Limit (*9) I LIM V IN=VCE=5.0V, VOUT=VOUT (T)ʷ0.9V (*7) 700 800 1000 mA ⑥ Output Voltage Temperature Characteristics ˚VOUT/ (VOUTɾ˚Topr) IOUT=30mA -40ˆʽToprʽ85ˆ - ʶ100 - ppm/ ˆ ① CE "H" Voltage V CEH VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “H” level (*10) 0.65 - 6.0 V ③ CE "L" Voltage V CEL VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “L” level (*10) VSS - 0.25 V ③ CE "H" Current I CEH V IN=VCE=5.0V, VOUT=0V - 0.1 - 0.1 μA ⑤ CE "L" Current I CEL V IN=5.0V, VCE=0V, VOUT=0V - 0.1 - 0.1 μA ⑤ Soft Start Time tSS When connected to external components, VCE=0VˠVIN , IOUT=1mA - 0.25 0.40 ms ① Latch Time tLAT VIN=VCE=5.0V, VOUT=0.8ʷVOUT(T) Short Lx at 1Ω resistance (*6) 1.0 - 20 ms ⑦ Short Protection Threshold Voltage VSHORT Sweeping VOUT, VIN=VCE=5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms 0.450 0.600 0.750 V ⑦ CL Discharge RDCHG V IN=5.0V, LX=5.0V, VCE=0V, VOUT=open 200 300 450 Ω ⑧ Inductance Value L Test frequency=1MHz - 4.7 - μH- Allowed Inductor Current I DC ϶T=40ˆ - 600 - mA - Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(T)=Nominal Voltage NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI= { ( output voltage×output current ) / ( input voltage×input current) }×100 (*3) ON resistance (Ω)=(VIN - Lx pin measurement voltage) / 100mA (*4) Design value (*5) When temperature is high, a current of approximately 10ЖA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output vo ltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTYLIMIT_PFM are defined only for the XCL202 series which have PFM control function. (Not for the XCL201 series)

■ELECTRICAL CHARACTERISTICS (Continued) XCL201B181BR/XCL202B181BR, VOUT=1.8V, fOSC=1.2MHz, Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage V OUT When connected to external components, VIN=VCE=5.0V, IOUT=30mA 1.764 1.800 1.836 V ① Operating Voltage Range VIN 2.0 - 6.0 V ① Maximum Output Current IOUTMAX VIN=VOUT(E)+2.0V, VCE=1.0V When connected to external components (*8) 400 - - mA ① UVLO Voltage V UVLO VCE=VIN,VOUT=0V Voltage which Lx pin holding “L” level (*1, *10) 1.00 1.40 1.78 V ② Supply Current (XCL201) - 22 50 Supply Current (XCL202) IDD V IN=VCE=5.0V, VOUT=VOUT(T)ʷ1.1V - 15 33 μA ② Stand-by Current I STB V IN=5.0V, VCE=0V, VOUT=VOUT(T)ʷ1.1V - 0 1.0 μA ③ Oscillation Frequency fOSC When connected to external components, VIN=VOUT(T)+2.0V, VCE=1.0V , IOUT=100mA 1020 1200 1380 kHz ① PFM Switching Current (*11) I PFM When connected to external components, VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA 120 160 200 mA ⑩ PFM Duty Limit (*11) DTY LIMIT_PFM V CE=VIN=VOUT(T) +0.5V, IOUT=1mA - 200 300 % ① Maximum Duty Cycle MAXDTY V IN=VCE=5.0V, VOUT=VOUT (T)ʷ0.9V 100 - - % ③ Minimum Duty Cycle MINDTY V IN=VCE=5.0V, VOUT=VOUT (T)ʷ1.1V - - 0 % ③ Efficiency (*2) EFFI When connected to external components, VCE=VIN=VOUT (T)+1.2V, IOUT=100mA - 89 - % ① Lx SW "H" ON Resistance 1 RL͇H1 V IN=VCE=5.0V, VOUT=0V, ILX=100mA (*3) - 0.35 0.55 Ω ④ Lx SW "H" ON Resistance 2 RL͇H2 V IN=VCE=3.6V, VOUT=0V, ILX=100mA (*3) - 0.42 0.67 Ω ④ Lx SW "L" ON Resistance 1 RL͇L1 V IN=VCE=5.0V (*4) - 0.45 0.66 Ω - Lx SW "L" ON Resistance 2 RL͇L2 V IN=VCE=3.6V (*4) - 0.52 0.77 Ω - Lx SW "H" Leakage Current (*5) I LeakH V IN=VOUT=5.0V, VCE=0V, LX=0V - 0.01 1.0 ЖA ⑨ Current Limit (*9) I LIM V IN=VCE= 5.0V, VOUT=VOUT (T)ʷ0.9V (*7) 700 800 1000 mA ⑥ Output Voltage Temperature Characteristics ˚VOUT/ (VOUTɾ˚Topr) IOUT=30mA -40ˆʽToprʽ85ˆ - ʶ100 - ppm/ ˆ ① CE "H" Voltage V CEH VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “H” level (*10) 0.65 - 6.0 V ③ CE "L" Voltage V CEL VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “L” level (*10) VSS - 0.25 V ③ CE "H" Current I CEH V IN=VCE=5.0V, VOUT=0V - 0.1 - 0.1 μA ⑤ CE "L" Current I CEL V IN=5.0V, VCE=0V, VOUT=0V - 0.1 - 0.1 μA ⑤ Soft Start Time tSS When connected to external components, VCE=0VˠVIN , IOUT=1mA - 0.32 0.50 ms ① Latch Time tLAT VIN=VCE=5.0V, VOUT=0.8ʷVOUT(T) Short Lx at 1Ω resistance (*6) 1.0 - 20 ms ⑦ Short Protection Threshold Voltage VSHORT Sweeping VOUT, VIN=VCE=5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms 0.675 0.900 1.125 V ⑦ CL Discharge RDCHG V IN=5.0V L X=5.0V VCE=0V VOUT=open 200 300 450 Ω ⑧ Inductance Value L Test frequency=1MHz - 4.7 - μH- Allowed Inductor Current I DC ϶T=40ˆ - 600 - mA - Test conditions: Unless otherwise stated, VIN=5.0V, VOUT (T)=Nominal Voltage NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI={ ( output voltage×output current ) / ( input voltage×input current) }×100 (*3) ON resistance (Ω)=(VIN - Lx pin measurement voltage) / 100mA (*4) Design value (*5) When temperature is high, a current of approximately 10μA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output vo ltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTYLIMIT_PFM are defined only for the XCL202 series which have PFM control function. (Not for the XCL201 series)

■ELECTRICAL CHARACTERISTICS (Continued) The value and conditions are depends on setting output voltage. ˔PFM Switching Current (IPFM) (XCL202) NOMINAL OUTPUT VOLTAGE MIN. TYP. MAX. 0.8V≦VOUT(T) ≦1.2V 140mA 180mA 240mA 1.2V＜VOUT(T)＜1.8V 130mA 170mA 220mA 1.8V≦VOUT(T)≦4.0V 120mA 160mA 200mA ˔PFM Duty Limit DTY LIMIT_PFM (XCL202) SETTING VOLTAGE CONDITIONS 0.8VʽVOUT(T)ʻ1.0V VCE=VIN=2.0V, IOUT=1mA 1.0VʽVOUT(T)ʽ4.0V V CE=VIN=VOUT(T)+0.5V, IOUT=1mA ˔Soft-Start Time tSS ç SERIESç OUTPUT VOLTAGE MIN.ç TYP.ç MAX.ç 0.8VʽVOUT(T)＜1.5V - 0.25ms 0.40ms ç 1.5VʽVOUT(T)＜1.8V - 0.32ms 0.50ms ç 1.8VʽVOUT(T)＜2.5V - 0.28ms 0.40ms XCL201B 2.5VʽVOUT(T)ʽ4.0V - 0.32ms 0.50ms 0.8VʽVOUT(T)＜2.5V - 0.28ms 0.40ms XCL202B 2.5VʽVOUT(T)ʽ4.0V - 0.32ms 0.50ms ■TYPICAL APPLICATION CIRCUIT XCL201/XCL202 Series ˔External Components CIN : 10V/4.7ЖF(Ceramic) CLç : 6.3V/10ЖF(Ceramic) NOTE: The Inductor can be used only for this DC/DC converter. Please do not use this inductor for the other reasons. Please use B, X5R, and X7R grades in temperature characteristics for CIN and CL capacitors. These grade ceramic capacitors minimize capacitance-loss as a function of voltage stress. VIN Vss Vss Lx VOUT CE CIN CL

■OPERATIONAL DESCRIPTION The XCL201/XCL202 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOSFET driver transistor, N-channel MOSFET switching transistor for the synchronous switch, current limiter circuit, UVLO circuit with control IC, and an inductor. (See the block di agram below.) Using the error amplifier, the voltage of the internal voltage reference source is compared with the feedback voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The cu rrent feedback circuit monitors the P-channel MOS driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used ensuring stable output voltage. <Reference Voltage Source> The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. <Ramp Wave Circuit> The ramp wave circuit determines switching frequency. The frequenc y is fixed internally 1.2MHz. Clock pulses generated in thi s circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits. <Error Amplifier> The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by the internal split resistors, R1 and R2. When a feed back voltage is lower than the reference voltage, the output voltage of the e rror amplifier is increased. The gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer. CE/ CE Error Amp. Vref with Soft Start, CE Phase Compensation Current Feedback Current Limit PWM Comparator Logic Synch Buffer Drive UVLO UVLO Cmp Ramp Wave Generator OSC Lx VSS VIN VOUT CE Control Logic VSHORT FB CFB Inductor VSS L2 L1 PWM/PFM Selector

■OPERATIONAL DESCRIPTION (Continued) <Current Limit> The current limiter circuit of the XCL201/XCL202 series monito rs the current flowing through t he P-channel MOS driver transisto r connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode. ①çWhen the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the Lx pin at any given timing. ②çWhen the driver transistor is turned off, the limiter circuit is then released from the current limit detection state. ③çAt the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over current state. ④çWhen the over current state is eliminated, the IC resumes its normal operation. The IC waits for the over current state to end by repeating the steps ①çthrough ③. If an over current state cont inues for a few milliseconds and the above three steps are repeatedly performed, the IC performs the function of latching the OFF st ate of the driver transistor , and goes into operation suspension state. Once the IC is in suspension state, operations can be resumed by either turning the IC off via the CE pin, or by restoring power to the V IN pin. The suspension state does not mean a complete s hutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in operation. The cu rrent limit of the XCL201/XCL202 series can be set at 800mA at t ypical. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the e ffect of noise, an input capacitor is placed as close to the IC as possible. ç <Short-Circuit Protection> The short-circuit protection circui t monitors the internal R1 and R2 divider voltage from the V OUT pin (refer to FB point in the block diagram shown in the previous page). In case where output is accident ally shorted to the Ground and when the FB point voltage decrease s less than half of the reference voltage (Vref) and a current more than the I LIM flows to the driver transistor, the short-circuit protection quickly operates to turn off and to latch the driver transistor. In t he latch state, the operation can be resumed by either turning the IC off and on via the CE pin, or by restoring power supply to the VIN pin. When sharp load transient happens, a voltage drop at the VOUT is propagated to the FB point through CFB, as a result, short circuit protection may operate in the voltage higher than 1/2 VOUT voltage. <UVLO Circuit> When the VIN pin voltage becomes 1.4V or lower, the P-channel output driver transistor is forced OFF to pr event false pulse output caused b y unstable operation of the internal circuitry. When the V IN pin voltage becomes 1.8V or higher, swit ching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output startup operation. The soft start function opera tes even when the VIN pin voltage falls momentarily below the UVLO operating voltage. T he UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation. Current Limit LEVEL 0mA ILx VCE Lx VIN VOUT Vss Restart Limit > # msLimit < # ms

■OPERATIONAL DESCRIPTION (Continued) <PFM Switch Current> In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-ch MOSFET on. In this case, on-time (t ON) that the P-ch MOSFET is kept on can be given by the following formula. tON = LʷIPFM / (VINʵVOUT) ˠIPFM① <PFM Duty Limit> In the PFM control operation, the PFM Duty Limit (DTYLIMIT_PFM) is set to 200% (TYP.). Therefore, under the condition that the duty increases (e.g. the condition that the step-down ratio is small), it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. ˠIPFM② çççççç <CL High Speed Discharge> The XCL201/XCL202 series can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the LX pin and the VSS pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge resistance value [R] and an output capacitor value (CL) as Н(Н=C x R), discharge time of the output voltage after discharge via the N channel transistor is calculated by the following formula. V = VOUT(T) x e –t/Н o r t =τln (VOUT(T) / V) V : Output voltage after discharge V OUT(T) : Output voltage t: Discharge time, Н: C x R C=Capacitance of output capacitor (CL) R=CL auto-discharge resistance 100 0 20 40 60 80 100 Discharge Time ｔ(ms) Output Voltage (Relative Value) 100 = Setting Voltage Value CL=10μF CL=20μF CL=50μF tON Lx IPFM 0mA I PFM① I PFM② 0mA Lx fOSC େ IPFMݶ Output Voltage Discharge Characteristics RDCHG=300Њ(TYP.) ILx ILx IPFM DTY LIMIT_PFM

■OPERATIONAL DESCRIPTION (Continued) <CE Pin Function> The operation of the çXCL201/XCL202 series will enter into the shut down mode when a low level signal is input to the CE pin. During the shutdown mode, the current consumption of the IC becomes 0 ЖA (TYP.), with a state of high impedance at the Lx pin and V OUT pin. The IC starts its operation by inputting a high level signal to the CE pin. The input to the CE pin is a CMOS input and the sink curr ent is 0ЖA (TYP.). ˔XCL20/XCL202 series - Examples of how to use CE pin <Soft Start>ç Soft start time is internally set 0.25ms to 0.32ms (TYP). Soft start time is defined as the time to reach 90% of the output nominal voltage when the CE pin is turned on. ç ■FUNCTION CHART (A) SW_CE SELECTED STATUS ON Stand-by OFF Operation (B) SW_CE SELECTED STATUS ON Operation OFF Stand-by CE OPERATIONAL STATES VOLTAGE LEVEL XCL201 XCL202 H Level (*1) Synchronous PWM Fixed Control Synchronous PWM/PFM Automatic Switching L Level (*2) Stand-by Stand-by * CE pin voltage level range (*1) H level: 0.65V<VCE<6V (*2) L level: 0V<VCE<0.25V (*3) CE pin should not be left open to avoid unstable operation. tSS VCEH VOUT CE CE VIN VDD SW_CE R1 < IC inside > < IC inside > VIN VDD

■NOTE ON USE Limit > #ms ⑤ ③ Duty Lx ILIM ILx 1. The XCL201/XCL202 series is designed for use with ceramic output capacitors. If, however, the potential difference is too l arge between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on the output. If the input-output potential difference is la rge, connect an electrolytic capacitor in parallel to compensate for insufficient capacitance. 2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by ex ternal component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. 3. Depending on the input-output voltage differential, or load current, some pulses may be skipped, and the ripple voltage may increase. 4. When the difference between input and output is large in PWM control, very narrow pulses will be outputted, and there is the possibility that some cycles may be skipped completely. 5. When the difference between input and output is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that some cycles may be skipped completely. 6. With the IC, the peak current of the coil is controlled by the current limit circuit. Sinc e the peak current increases when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula: Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT L: Coil Inductance Value fOSC: Oscillation Frequency 7. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the external components such as a coil. 8. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. 9. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible. 10. Use of the IC at voltages below the recommended voltage range may lead to instability. 11. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device. 12. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the driver transistor. 13. The current limit is set to 1000mA (MAX.) at typical. However, the current of 1000mA or more may flow. In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when N-c h MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the r epetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current, which is supposed to be limited originally. Even in thi s case, however, after the over current state continues for several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent damage to the device. ①Current flows into P-ch MOSFET to reach the current limit (ILIM). ②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET. ③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small. ④Lx oscillates very narrow pulses by the current limit for several ms. ⑤The circuit is latched, stopping its operation.

■NOTE ON USE (Continued) ç the power loss of micro DC/DC according to the following formula: power loss = V OUTʷIOUTʷ((100/EFFI) – 1)ç (W) VOUT : Output Voltage (V) IOUT : Output Current (A) EFFI: Conversion Efficiency (%) Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6mm Through-hole: 4 x 0.8 Diameter 14. In order to stabilize V IN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN & VSS pins. 15. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode. 16. When PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for the range of MAXDUTY area with small input/output differential. 17. Please use within the power dissipation range below. Please also note that the power dissipation may changed by test conditions, the power dissipation figure shown is PCB mounted. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 Operating Temperature Ta (℃) Maximum Power Disspation Pd (W) Evaluation Board (unit: mm) 28.9 40.0 40.0 28.9 2.54 1.4 2.5

■NOTE ON USE (Continued) ˔Instructions of pattern layouts 1. In order to stabilize V IN voltage level, we recommend that a by-pass capacitor (C IN) be connected as close as possible to the VIN (No.6) & VSS (No.5) pins. 2. Please mount each external component as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potenti al caused by high ground currents at the time of switching may result in instability of the IC. 5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of driver transistors. 6. Please connect Lx (No.1) pin and L1 (No.7) pin by wiring on the PCB. 7. Please connect VOUT (No.3) pin and L2 (No.8) pin by wiring on the PCB. CIN CL IC LX VINGND GNDVOUT CE CIN CL IC LX VINGND GNDVOUT CE CE LX VINGND GNDVOUT BACK (Flip Horizontal) FRONT (PCB mounted) FRONT

■TEST CIRCUITSç < Circuit No.1 > < Circuit No.2 > VIN Lx VSS CE VOUT A V CL CIN Wave Form Measure Point VIN Lx VSS CE VOUT A 1μF ※ External Components CIN : 4.7μF(ceramic) CL : 10μF(ceramic) L2 L2 < Circuit No.3 > < Circuit No.4 > VIN Lx VSS CE VOUT VIN Lx Wave Form Measure Point L1 L1 V 100mACE VOUT Rpulldown 200Ω 1μF ON resistance = (VIN-VLx)/100mA VSS < Circuit No.5 > ILeakH <C i r c u i tN o . 6> Wave Form Measure Point 1μF L2 L2 L1 L1 VIN Lx VSS CE VOUT A ILeakL A ICEH ICEL < Circuit No.7 > VIN Lx VSS CE VOUT Rpulldown Ilat Wave Form Measure Point VIN Lx VSS CE VOUT V ILIM 1μF 1μF 1μF <C i r c u i tN o . 8> ILx VIN Lx VSS CE VOUT1uF A < Circuit No.9 > VIN Lx VSS CE VOUT A CIN L2 L2 L2L2 L1L1 < Circuit No.10 > VIN Lx VSS CE VOUT A V CL L CIN Wave Form Measure Point ※ External Components L : 4.7uH(選別品) CIN : 4.7μF(ceramic) CL : 10μF(ceramic) * External Components L: 4.7μH (Screening Parts) CIN: 4.7μF (Ceramic) CL: 10μF (Ceramic) * External Components CIN: 4.7μF (Ceramic) CL: 10μF (Ceramic)

■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current (2) Output Voltage vs. Output Current 100 0.01 0.1 1 10 100 1000 Output Current:IOUT (m A) Efficency:EFFI(%) 3.6V XCL202(PWM/PFM) XCL201(PWM) 2.7V VIN= 4.2V çç 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.01 0.1 1 10 100 1000 Output Current:I OUT (m A) Output Voltage:VOUT(V) VIN＝4.2V,3.6V,2.7V XCL201 (PWM/PFM) (PWM) XCL202 (3) Ripple Voltage vs. Output Current (4) Oscillation Frequency vs. Ambient Temperature 100 0.01 0.1 1 10 100 1000 Output Current:IOUT (m A) Ripple Voltage:Vr(mV) 3.6V XCL201 XCL202 VIN=4.2V 2.7V VIN=4.2V 3.6V 2.7V (PWM/PFM) (PWM) çç 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) VIN=3.6V Oscillation Frequency : fosc(MHz) (5) Supply Current vs. Ambient Temperature (6) Out put Voltage vs. Ambient Temperature -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Supply Current : IDD (μA) VIN=6.0V 4.0V 2.0V 1.5 1.6 1.7 1.8 1.9 2.0 2.1 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Output Voltage : VOUT (V) VIN=3.6V XCL201B181BR/XCL202B181BR XCL201B181BR/XCL202B181BR XCL201B181BR/XCL202B181BR XCL201B181BR/XCL202B181BR XCL202B181BR XCL201B181BR/XCL202B181BR

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) UVLO Voltage vs. Ambient Temperature (8) CE "H" Voltage vs. Ambient Temperature 0.0 0.3 0.6 0.9 1.2 1.5 1.8 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) UVLO Voltage : UVLO (V) CE=VIN 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CE "H" Voltage : VCEH (V) VIN=5.0V 3.6V 2.4V (9) CE "L" Voltage vs. Ambient Temperature (10) "Pch / Nch" Driver on Resistance vs. Input Voltage ç 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CE "L" Voltage : VCEL (V) VIN=5.0V 3.6V 2.4V 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0123456 Input Voltage : VIN (V) Pch on Resistance Nch on Resistance Lx SW ON Resistance:RLxH,RLxL ( Ω) (11) Rise Wave Form ĊČā÷õ÷ĝ˰øõ÷ĝ ĝĐĕĄüõ÷ĝ ĐĖĜěĄøõ÷ĴĈ Time:100μs/div ĝĖĜě øĪį ùĪį øĪįāøĝöīİĽçççççùĪįāøĝöīİĽ XCL201B331BR/XCL202B331BR XCL201B181BR/XCL202B181BR XCL201B181BR/XCL202B181BR XCL201B181BR/XCL202B181BR XCL201B181BR/XCL202B181BR

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) ( 1 2 ) S o f t - S t a r t T i m e v s . A m b i e n t T e m p e r a t u r e (13) CL Discharge Resistance vs. Ambient Temperature 100 200 300 400 500 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) VIN=5.0V IOUT=1.0mA Soft Start Time : tss (μs) 100 200 300 400 500 600 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CL Discharge Resistance: (Ω) VIN=6.0V 4.0V 2.0V (14) Load Transient Response MODEɿPWM/PFM Automatic Switching Control øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ ĐĖĜěĄøĴĈç˰çø÷÷ĴĈ øĪį ĝĖĜě ùĪį time:200μs/div ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ çç ĐĖĜěĄøĴĈç˰çú÷÷ĴĈ ĝĖĜě øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ time:200μs/div øĪį ùĪį ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ ĐĖĜěĄø÷÷ĴĈç˰çøĴĈ ĝĖĜě time:200μs/div ùĪį øĪį ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ ĐĖĜěĄú÷÷ĴĈç˰çøĴĈ ĝĖĜě time:200μs/div øĪį ùĪį ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ XCL201B121BR/XCL202B121BR XCL201B331BR/XCL202B331BR XCL202B181BR XCL202B181BR XCL202B181BR XCL202B181BR

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (14) Load Transient Response (Continued) MODEɿPWM Control øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ time:200μs/div ùĪį øĪį ĐĖĜěĄøĴĈç˰çø÷÷ĴĈ ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ ĝĖĜě çç øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ time:200μs/div ùĪį øĪį ĐĖĜěĄøĴĈç˰çú÷÷ĴĈ ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ ĝĖĜě time:200μs/div øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ ùĪį øĪį ĐĖĜěĄø÷÷ĴĈç˰çøĴĈ ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ ĝĖĜě çç time:200μs/div øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ ùĪį øĪį ĐĖĜěĄú÷÷ĴĈç˰çøĴĈ ĝĐĕĄúõýĝóĝĖĜěĄøõÿĝ ĝĖĜě XCL201B181BR XCL201B181BR XCL201B181BR XCL201B181BR

■PACKAGING INFORMATION ç ˔CL-2025 (unit:mm) ˔Reference Pattern Layout (unit:mm) ˔Reference Metal Mask Design (unit:mm) ˙External Lead

■MARKING RULE ① represents products series ② represents integer of output voltage and oscillation frequency ③ represents the decimal part of output voltage Example (Mark ②, ③) ④,⑤ represents production lot number 01ʙ09, 0Aʙ0Z, 11ʙ9Z, A1ʙA9, AAʙAZ, B1ʙZZ in order. ççççççççççççççççççççç (G, I, J, O, Q, W excluded) *No character inversion used. MARK PRODUCT SERIES MARK OUTPUT VOLTAGE (V) OSCILLATION FREQUENCY=1.2MHz 0.x F 1.x H 2.x K 3.x L 4.x M OUTPUT VOLTAGE (V) MARK PRODUCT SERIES MARK OSCILLATION FREQUENCY ② ③ ② ③ ② ③ 1.2MHz L 3 K C H L ⑤ ④ CL-2025

1. The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.