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Negative Output Voltage DC/DC Converters ■FEATURES Input Voltage Range : 2.7V ~ 5.5V Output Voltage : -3.2V ~ -3.6V FB Voltage 0.5V ± 10mV VREF Voltage 1.6V ± 40mV Output Current : 300mA @VOUT=-3.3V, VIN=3.3V(TYP .) Quiescent Current : 250μA ( TYP. ) Control Methods : PWM Control (XC9307 Series) : PWM/PFM Control (XC9308 Series) Oscillation Frequency : 2.5MHz Protection Function : Current Limit (1.1A TYP.) Function : Soft Start Time External Adjustment UVLO Operating Ambient Temperature : -40 ~ 105℃ Packages : USP-6EL (1.8 x 2.0 x 0.4mm) Environmentally Friendly : EU RoHS Compliant, Pb Free ■GENERAL DESCRIPTION The XC9307/XC9308 series are 1.8 x 2.0 x 0.4mm small and thin package negative voltage micro DC/DC converter IC. The oscillating frequency is a fast 2.5MHz contributes significantly to space saving in PCB area. Compared to a charge pump type solution, the switching method of the XC9307/XC9308 maintains a stable output voltage even when the input voltage fluctuates. In addition, this DC/DC converter can support larger output current than a charge pump solution. The PWM controlled XC9307 series can be selected for applications where low noise is important, and the PWM/PFM automatic switching controlled XC9308 series can be selected for applications where high efficiency at light load current and low noise at high load current is important. The XC9307/XC9308 series allows users to select either a PWM control or PWM/PFM automatic switching control method, which are optimum for applications where low noise and high efficiency are important. The output voltage can be set from -3.2V to -3.6V by external resistor. ■APPLICATIONS
- Negative power supply for AMP
- Negative power supply for LCD
- Negative power supply for CCD
- General purpose Negative power supply ☆Green Operation Compatible ETR34002-001 ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS 3 4 6Lx FB CE GND VIN CIN CL SD VREF CV REF RFB1 RFB2 L
■ BLOCK DIAGRAM ■PRODUCT CLASSIFICATION
- Ordering information XC9307①②③④⑤⑥-⑦ PWM Control XC9308①②③④⑤⑥-⑦ PWM/PFM Automatic Switching Control DESIGNATOR ITEM SYMBOL DESCRIPTION ① Product Type A Refer to Selection Guide ②③ Feedback Voltage 05 Feedback Voltage is fixed at 0.5V ④ Oscillation Frequency 2 2.5MHz ⑤⑥-⑦ (*1) Packages (Order Unit) 4R-G USP-6EL (3,000pcs/Reel) (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
- Selection Guide TYPE OUTPUT VOLTAGE CHIP ENABLE UVLO CURRENT LIMIT SOFT START A External set Yes Yes Yes Yes * Diodes inside the circuit are an ESD protection diode and a parasitic diode. PWM Comparator CE Controller LogicCE GND LX Buffer Driver AVDD UVLOVIN FB VR EF Error Amp Current Sense Current Limiter Phase Compensation RAMP Wave Generatar Each Circuit PWM/PFM Controller Logic Oscillator PVDD AVDD AVDD PVDD VR EF VIN start up Controller
XC9140 (De XC9307/XC9308 Series ■PIN CONFIGURATION ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS USP-6EL
1 LX Switching Output
2 FB Feedback Voltage
3 VREF Reference Voltage
4 CE Chip Enable
5 GND Ground
6 VIN Power Input
■ FUNCTION PIN NAME SIGNAL STATUS CE H Operation L Stand-by * Please do not leave the CE pin open. ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage VIN -0.3 ~ 6.2 V LX Pin Voltage VLX VIN - 13.0 ~ VIN + 0.3 or 6.2 (*1) V FB Pin Voltage VFB -0.3 ~ VIN + 0.3 or 6.2 (*1) V VREF Pin Current IREF -1.0 ~ 1.0 (*3) mA VREF Pin Voltage VREF -0.3 ~ VIN + 0.3 or 6.2 (*1) V CE Pin Voltage VCE -0.3 ~ 6.2 V Power Dissipation (Ta=25℃) Pd 750 (40mm x 40mm Standard board) (*2) mW Operating Ambient Temperature Topr -40 ~ 105 ˚C Storage Temperature Tstg -55 ~ 125 ˚C * All voltages are described based on the GND pin. (*1) The maximum value should be either VIN+0.3V or +6.2V in the lowest. (*2) The power dissipation figure shown is PCB mounted and is for reference only. The mounting condition is please refer to PACKAGING INFORMATION. (*3) Please do not apply voltage to the VREF pin from outside. * The dissipation pad should be solder-plated in recommended mount pattern and metal masking to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 5) pin. (BOTTOM VIEW) VIN 6 GND 5 CE 4 1 LX 2 FB
3 VR EF
■ELECTRICAL CHARACTERISTICS XC9307A0524R-G, XC9308A0524R-G Ta=25˚C Unless otherwise stated, VIN=VCE=3.7V (*2) VFB(E) : Effective FB Voltage, (*3) VFB(T) : Setting FB Voltage(0.5V) (*4) ON resistance = (VIN – VLX pin measurement voltage) / 100mA PARAMETER SYMBOL CONDITIONS MIN. T YP. MAX. UNITS CIRCUIT Input Voltage VIN - 2.7 - 5.5 V - FB Voltage VFB(E) (*2) VIN=VCE=3.7V, The voltage which LX starts oscillation while VFB is increasing. 0.49 0.50 0.51 V ① VREF Voltage VREF VIN=VCE=3.7V 1.56 1.60 1.64 V ① UVLO Detection Voltage VUVLOD VIN=VCE,VFB=VFB(T)×1.025 (*3), Voltage which Lx pin holding “L” level (*1) 1.85 2.10 - V ① UVLO Release Voltage VUVLOR VIN=VCE, VFB(T)×1.025 (*3), Voltage which Lx pin holding “H” level (*1) - 2.25 2.60 V ① UVLO Hysteresis Width VUVLOH VUVLOH=VUVLOR - VUVLOD 0.08 0.15 0.25 V - Supply Current IDD VIN=VCE=5.5V, VFB=VFB(T)×0.975 (*3) 215 250 310 μA ② Stand-by Current ISTB VIN=5.5V, VCE=0V - 0.0 0.1 μA ② PFM Switch Current (XC9308 Series) IPFM When connected to external components, IOUT=1mA - 300 - mA ③ Soft Start Time tSS FB Voltage rise up time, VFB=0V→VFB(T)×0.95 (*3), VCE=0V→VIN, IOUT=1mA, CVREF=0.47uF 0.5 1.5 2.5 ms ③ Oscillation Frequency fOSC VFB=VFB(T)×1.025 (*3) 2.1 2.5 2.9 MHz ① Maximum ON Time tONMAX VFB=VFB(T)×1.025 (*3) 300 350 385 ns ① Minimum ON Time tONMIN VFB=VFB(T)×0.975 (*3) - - 0 ns ① Efficiency EFFI When connected to external components, VOUT=-3.3V, IOUT =100mA - 78 - % ③ LX SW "H" ON Resistance (*4) RLXH VIN=5.0V, ILX=100mA - 0.50 0.65 Ω ④ LX SW "L" Leakage Current ILEAKL VIN=5.5V, VCE=0V, VLX=0V - 0.01 0.10 μA ⑤ Maximum Current Limit ILIM When connected to external components - 1100 - mA ① VREF Voltage T emperature Characteristics VREF / (VREF・topr) -40℃< Topr < 105℃ - ±50 - ppm / oC ① FB Voltage Temperature Characteristics VFB / (VFB・topr) -40℃< Topr < 105℃ - ±50 - ppm / oC ① CE "H" Voltage VCEH VIN=5.5V, VFB=VFB(T)×1.025 (*3) , Applied voltage to VCE, voltage changes LX to "H" level (*1) 1.2 - 5.5 V ① CE "L" Voltage VCEL VIN=5.5V, VFB=VFB(T)×1.025 (*3) , Applied voltage to VCE, voltage changes LX to "L" level (*1) GND - 0.4 V ① CE "H" Current ICEH VIN=VCE=5.5V -0.1 0.0 0.1 μA ⑥ CE "L" Current ICEL VIN=5.5V, VCE=0V -0.1 0.0 0.1 μA ⑥ FB "H"" Current IFBH VIN=VCE=VFB=5.5V -0.1 0.0 0.1 μA ⑥ FB "L" Current IFBL VIN=VCE =5.5V, VFB=0V -0.1 0.0 0.1 μA ⑥
XC9140 (De XC9307/XC9308 Series ■TEST CIRCUITS CE GND VIN FB LX CIN CVR EF RLX < Test Circuit No.① > Wa ve Fo rm M e as ur e P oi nt CIN < Test Circuit No.② > A < Test Circuit No.③ > < Test Circuit No.④ > < Test Circuit No.⑤ > < Test Circuit No.⑥ > VREF V CVR EF A CL RL Wa ve Fo rm M e as ur e P oi nt CVR EF CIN RFB2 RFB1 Wa ve Fo rm M e as ur e P oi nt V IS CIN CIN CVR EF CVR EF A CIN A CVR EF A CE GND VIN FB LX VREF CE GND VIN FB LX VREF CE GND VIN FB LX VREF CE GND VIN FB LX VREF CE GND VIN FB LX VREF
■TYPICAL APPLICATION CIRCUIT EXTERNAL COMPONENTS SELECTION 【Typical example】 MANUFACTURE PRODUCT NUMBER VALUE Notes L Murata DFE2016CKA-2R2M 2.2uH t=0.65mm max CIN Murata GRM188D71A106KA73 10μF/10V Ta≦105℃ GRM155R60J106ME15 10uF/6.3V Ta≦85℃ CL Murata GRM188D71A106KA73 10μF/10V Ta≦105℃ GRM155R60J106ME15 10uF/6.3V Ta≦85℃ CVREF Murata GRM155C71A105KE11 1μF/10V Ta≦105℃ SD Nexperia PMEG2010BELD 1A/20V - ON Semiconductor NSR1020MW2 1A/20V - * Take capacitance loss, withstand voltage, rated current and other conditions into consideration when selecting components. * 10μF ~ 44μF output capacitor (CL) value is recommended. When the output capacitor (CL) is large, there is a possibility that the output voltage will be unstable. * If a tantalum or electrolytic capacitor is used for the output capacitor (CL), ripple voltage will increase, and there is a possibility that operation will become unstable. Test fully using the actual device. * When Schottky Diodes, which have a large junction capacity are used, there is a possibility that the output voltage will be unstable. ＜Output voltage (VOUTSET) setting＞ Output voltage can be set by adding an external resistor. Output voltage can be set between -3.2V to -3.6V. Output voltage is set by the following equation according to RFB1, RFB2, VFB and VREF. V OUTSET = VFB - RFB1 / RFB2 × ( VREF - VFB ) Please select within 100kΩ ≦ RFB1 + RFB2 ≦ 500kΩ range. VOUTSET RFB1 RFB2 -3.2V 91Ω 27kΩ -3.3V 150kΩ 43kΩ -3.6V 160kΩ 43kΩ 3 4 6Lx FB CE GND VIN CIN CL SD VREF CV REF RFB1 RFB2 L
XC9140 (De XC9307/XC9308 Series ■TYPICAL APPLICATION CIRCUIT EXTERNAL COMPONENTS SELECTION (Continued) ＜Setting soft start time (tSS)＞ Soft start time is determined by the capacity of the CVREF connected to the VREF terminal. Please select the capacitance value of CVREF within the range of 0.47μF ~ 10μF referring to the below graph. 0 1 2 3 4 5 6 7 8 9 10 Soft Start Time : tSS (ms) CVREF Capacitance (uF) IOUT = 1mA, 200mA VIN = 3.7V, VOUT = -3.3V Ta = 25℃
■OPERATIONAL EXPLANATION This IC consists of a standard voltage reference, error amp, ramp wave circuit, oscillator circuit, PWM comparator, PWM/PFM controller, Pch driver transistor, current sensing circuit, UVLO circuit, VREF startup circuit and etc. Control method is a current mode control method which allows for the use of low ESR ceramic capacitors. XC9307/XC9308 Series block diagram PWM Comparator CE Controller LogicCE GND LX Buffer Driver AVDD UVLOVIN FB VR EF Error Amp Current Sense Current Limiter Phase Compensation RAMP Wave Generatar Each Circuit PWM/PFM Controller Logic Oscillator PVDD AVDD AVDD PVDD VR EF VIN start up Controller
XC9140 (De XC9307/XC9308 Series ■OPERATIONAL EXPLANATION (Continued) <Normal Operation> The FB terminal voltage divided by the output voltage is compared with the VREF voltage by the error amp. Phase compensation is applied to the error amp output, which is then forwarded to the PWM comparator. At the PWM comparator the error amp output and ramp wave are compared to determine the ON time during PWM control. The XC9307 series (PWM control) is switched using a constant switching frequency (fOSC) independent of the output current. During light load current, the ON time is short, and the IC operates in a non-continuous mode. As the output current increases, the ON time becomes longer, and the IC operates in a continuous mode. At high load currents, the ON time depends heavily on the input voltage, output voltage, and output current, and the maximum ON time (tONMAX) restriction determines the maximum output current that can flow under the conditions of each input voltage and output voltage. Refer to the typical performance characteristics for the maximum output current under each condition. The XC9308 series (PWM/PFM automatic switching control) turns ON the Pch driver transistor until the coil current reaches the PFM current (IPFM) and to lower the switching frequency during light load current. This operation reduces loss during light loads to achieve high efficiency from light to high load currents. As the output current grows larger, the switching frequency increases proportional to the output current, and when the switching frequency reaches the fOSC to switch from PFM control to PWM control the switching frequency is fixed. Further, the phase compensation circuit optimizes the error amp frequency characteristics and is used to phase compensate the Pch driver transistor current feedback signal. This achieves output voltage stability even when low ESR capacitors, such as ceramic capacitors are used. 0mA IPFM Coil Current Lx IOUT tON XC9307 Series: Example of operation at light load current XC9307 Series: Example of operation at high load currents XC9308 Series: Example of operation at light load current XC9308 Series: Example of operation at high load currents fOSC 0mA Coil Current Lx IOUT tON 0mA IPFM Coil Current Lx IOUT tON fOSC 0mA Coil Current Lx IOUT tON
■OPERATIONAL EXPLANATION (Continued) <CE Function> When “H” voltage (VCEH) is input to the CE terminal, it operate s normally after the output voltage is started by the soft start function. When “L” voltage (VCEL) is input to the CE terminal, it goes to the stand-by state, the quiescent current is suppressed to the stand-by current ISTB ( TYP. 0μA) level and the Pch driver transistor turns OFF. <UVLO Function> When the VIN terminal voltage drops below the UVLO detect voltage level (VUVLOD), the UVLO function operates and turns off the Pch driver transistor to prevent any erroneous pulse output due to possible unstable action of the internal circuit. When the VIN terminal voltage increases above the UVLO release voltage level (VUVLOR), the UVLO function is released. After the UVLO function is released, the soft start function starts the output voltage and the IC operates normally. The UVLO function operates even if the VIN terminal momentarily drops below the UVLO detect voltage. In addition, whilst the UVLO function is in operation, rather than being in a stand-by state, the IC is in a switching operation stopped state, so the internal circuit is still operating. <Soft Start Function> This gently starts up the output voltage when the IC starts up and the UVLO function is released to suppress the inrush current. The VREF startup circuit operates after the “H” voltage (VCEH) is input to the CE terminal and after the UVLO function is released. The VREF startup circuit charges the CVREF with current and can gently raise the VREF voltage and FB voltage. In response to this, the output voltage is lowered proportionally to the increase in the V REF voltage and FB voltage. This action makes it possible to prevent input current inrush and to smoothly lower the output voltage. The output voltage startup time (soft start time) is determined by the capacity of the CVREF connected to the VREF terminal. In the stand-by state and during the UVLO function operation, the charge accumulated in the C VREF is discharged and the VREF voltage is made to be 0V. VCE VOUT VREF VC EH VC EL VR EF Voltage 1.6V (TYP.) VFB VFB Voltage 0.5V (TYP.) Soft Start Time : tss (Depend on CVR E F) Normal operation St and-by Fall time depends on Iout VOU TSE T
XC9140 (De XC9307/XC9308 Series ■OPERATIONAL EXPLANATION (Continued) <Current Limit Function> The current limit circuit monitors the current flowing to the Pch driver transistor to restrict overcurrent. The current limit function operates as follows. 1) The current flowing to the Pch driver transistor is increased, and when the current limit value of I LIM=1100mA (TYP.) is reached, the current limit state is entered and the Pch driver transistor is turned OFF. 2) The Pch driver transistor is turned OFF for a period of 4μs (TYP.), and the coil current is greatly decreased. During this time, lowering the coil current that has reached the current limit lowers the input current and output current while the current is restricted. 3) Other switching operations are performed, and when the output voltage is a load resistance tha t does not reach the set voltage, the coil current increases and the current limit function operates again. 4) Operations 1) to 3) are repeated during the current limit state period. 5) When the load resistance increases much more than the load resistance during current limit detection, the current limit state is released and the IC automatically returns to normal operation.
■NOTE ON USE 1) For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2) Switching regulators like this DC/DC converter generate spike noise and ripple voltage. This greatly affects the surroundi ng components (Schottky diodes, capacitors, peripheral component circuit board layout etc.). When making a design, please be sure to sufficiently check this in an actual device. 3) The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected components, so refer to EXTERNAL COMPONENTS SELECTION and the specifications of each component and be careful when selecting the components. Be especially careful of the characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA Standard) ceramic capacitor. 4) The maximum output current of this IC is determined by the current limit value and the maximum ON time restrictions, and this depends greatly on the input voltage and output voltage. Further, when the input voltage is low and during low temperature, there is a possibility that the maximum ON time decreases and the maximum output current drops. For the maximum output current, please refer to the typical performance characteristics of “Maximum Output Current vs. Output Voltage.” 5) With the XC9307 series, there is a possibility that the switching frequency will decline when the input voltage is high and the load curr ent is light. 6) When Schottky Diodes, which have a large junction capacity, are used or when the C L output capacity is large, there is a possibility that the output voltage will be unstable. 7) When there is steep output current fluctuation, there could be a large drop in the output voltage that can cause the duty to increase which in turn triggers the operation of the current limit function. 8) If the IC is started under a condition where the output current is large, there is a possibility that the inrush current will increase and the current limit function may operate. 9) When the input voltage is lowered below the UVLO detect voltage level for a short time, there are times when it is not possible to discharge the CVREF charge. When the input voltage is started again in this state, the shortening of the soft start time at startup could trigger the current limit function. 10) When current limit is released from current limit condition, soft start function does not operate to recover output voltage and there is a possibility that output voltage will be overshoot. 11) Under the condition where the input voltage is close to 1V, there is a possibility that the UVLO function will not operate. 12) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
XC9140 (De XC9307/XC9308 Series ■NOTE ON USE (Continued) 13) Note on board layout 1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the V IN & GND pins. 2. Please mount each external component as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. 5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of Pch driver transistors.
- Recommended Pattern Layout Layer1 Layer2 Layer3 Layer4
■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Currrent (2) Output Voltage vs. Output Current (3) Ripple Voltage vs. Output Current 100 150 200 1 10 100 1000 Ripple Voltage : Vr (mV) Output Current : IOUT ( mA ) XC9307A052 VOUT = -3.3V L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN = 2.7V, 3.7V, 5.0V VIN = VCE Ta = 25℃ - 3.5 - 3.4 - 3.3 - 3.2 - 3.1 1 10 100 1000 Output Voltage : VOUT (V) Output Current : IOUT ( mA ) XC9307A052 VOUT = -3.3V L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD , RFB1=150kΩ, RFB2=43kΩ VIN = 2.7V, 3.7V, 5.0V VIN = VCE Ta = 25℃ 1 10 100 1000 E fficiency : E FFI (%) Output Current : IOUT ( mA ) VIN=2.7V VIN=3.7V VIN=5.0V XC9307A052 VOUT = -3.3V L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN = VCE Ta = 25℃ 100 150 200 1 10 100 1000 Ripple Voltage : Vr (mV) Output Current : IOUT ( mA ) XC9308A052 VOUT = -3.3V L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN = 2.7V, 3.7V, 5.0V VIN = VCE Ta = 25℃ - 3.5 - 3.4 - 3.3 - 3.2 - 3.1 1 10 100 1000 Output Voltage : VOUT (V) Output Current : IOUT ( mA ) XC9308A052 VOUT = -3.3V L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN = 2.7V, 3.7V, 5.0V VIN = VCE Ta = 25℃ 1 10 100 1000 E fficiency : E FFI (%) Output Current : IOUT ( mA ) VIN=2.7V VIN=3.7V VIN=5.0V XC9308A052 VOUT = -3.3V L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN = VCE Ta = 25℃
XC9140 (De XC9307/XC9308 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Maximum Output Current vs. Output Voltage (5) VREF Voltage vs. Ambient Temperature (6) FB Voltage vs. Ambient Temperature (7) Supply Current vs. Ambient Temperature (8) Stand-by Current vs. Ambient Temperature (9) UVLO Voltage vs. Ambient Temperature 0.44 0.46 0.48 0.50 0.52 0.54 - 50 - 25 0 25 50 75 100 125 FB Voltage: VREF (V) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VＩＮ = VCE = 3.7V 100 150 200 250 300 350 400 Maximum Output Current: Iout_MAX (mA) Output Voltage : VOUT (V) XC930xA052 L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), C VR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD VIN=2.7V VIN=3.3V VIN=3.7V VIN=4.2V, 5.5V VIN = VCE 1.7 1.9 2.1 2.3 2.5 - 50 - 25 0 25 50 75 100 125 UVLO Voltage (V) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VIN = VC E = 3.7V VU VLOR VU VLOD 0.0 1.0 2.0 3.0 4.0 5.0 - 50 - 25 0 25 50 75 100 125 Stand-by Current: ISTB (μA) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VＩＮ = 5.5V VC E = 0V 100 200 300 400 500 - 50 - 25 0 25 50 75 100 125 Supply Current : IDD (μA) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VIN = VCE = 5.5V VFB = VFB(T)×0.975 1.4 1.5 1.6 1.7 1.8 - 50 - 25 0 25 50 75 100 125 VREF Voltage: VREF (V) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VＩＮ = 3.7V VIN = VCE
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) PFM Switch Current vs. Ambient Temperature (11) Maximum Current Limit vs. Ambient Temperature (12) Oscillation Frequency vs. Ambient Temperature (13) Maximum ON Time vs. Ambient Temperature (14) Minimum OFF Time vs. Ambient Temperature (15) Lx SW "H" ON Resistance vs. Ambient Temperature 0.0 0.2 0.4 0.6 0.8 1.0 - 50 - 25 0 25 50 75 100 125 LX SW “H” ON Resistance RLXH (Ω) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μFGRM155C71A105KE11) VIN = VC E ILX = 100mA VIN=3.7V VIN=5.0V 300 600 900 1200 1500 1800 - 50 - 25 0 25 50 75 100 125 Mux imumCurrent: Limit ILIM ( mA ) Ambient Temperature: Ta (℃) VIN=5.0V VIN=3.7V XC930xA052 L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN=2.7V VIN = VCE, VOUT = -3.3V 2.1 2.3 2.5 2.7 2.9 - 50 - 25 0 25 50 75 100 125 Oscillation Frequency: fosc ( MHz ) Ambient Temperature: Ta(℃) VＩＮ = VCE XC930xA052 L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VFB = VFB(T)×1.025 VOUT = -3.3V VIN = 2.7V,3.7V,5.0V 100 200 300 400 500 - 50 - 25 0 25 50 75 100 125 Max imum ON Time: tONMA X (ns) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VIN = 2.7V,3.7V,5.0V VIN = VCE VFB = VFB(T)×1.025 100 - 50 - 25 0 25 50 75 100 125 Minimum OFF Time: tOFFMIN (ns) Ambient Temperature: Ta(℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VIN = 2.7V,3.7V,5.0V VIN = VCE VFB = VFB(T)×1.025 100 200 300 400 500 600 - 50 - 25 0 25 50 75 100 125 PFM Sw itch Current: IPFM ( mA ) Ambient Temperature: Ta (℃) VIN=2.7V VIN=5.0VVIN=3.7V XC9308A052 L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN = VCE, VOUT = -3.3V
XC9140 (De XC9307/XC9308 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (16) Lx SW "L" Leakage Current vs. Ambient Temperature (17) CE "H" Voltage vs. Ambient Temperature (18) CE "L" Voltage vs. Ambient Temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 - 50 - 25 0 25 50 75 100 125 CE “L” Voltage: VCEL (V) Ambient Temperature: Ta (℃) XCL30xA052KR CIN=10μF(LMK105CBJ106MVLF) VIN = 2.7V,5.5V XCL30xA052KR CIN=10μF(LMK105CBJ106MVLF) VIN = 2.7V,5.5V XC930xA052 CIN=10μF(GRM188D71A106KA73)), CVR EF=1μF(GRM155C71A105KE11) VIN = 2.7V,5.0V 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 - 50 - 25 0 25 50 75 100 125 CE “H” Voltage: VCEH (V) Ambient Temperature: Ta (℃) XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VIN=2.7V VIN=5.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 - 50 - 25 0 25 50 75 100 125 Lx Leak Current : ILEAKL (μA) Ambient Temperature: Ta (℃) VIN = 5.0V XC930xA052 CIN=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) VC E = VLX = 0V
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (19) Rising Output Voltage XC9308A052 VIN = VCE=0→3.7V, IOUT = 300mA L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ XC9307A052 VIN = VCE=0→3.7V, IOUT = 300mA L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ XC9308A052 VIN = VC E = 0→3.7V, IOUT = 1mA L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ XC9307A052 VIN = VC E = 0→3.7V, IOUT = 1mA VOUT (2V/div) Ta = 25℃, VOUT = -3.3V L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VIN (5V/div) VLX (5V/div) 500μs/div VOUT (2V/div) VIN (5V/div) VLX (5V/div) 500μs/div VOUT (2V/div) VIN (5V/div) VLX (5V/div) 500μs/div VOUT (2V/div) VIN (5V/div) VLX (5V/div) 500μs/div Ta = 25℃, VOUT = -3.3V Ta = 25℃, VOUT = -3.3V Ta = 25℃, VOUT = -3.3V
XC9140 (De XC9307/XC9308 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (20) Load Transient Response XC9308A052 VIN = VC E = 3.7V, IOUT = 10mA→50mA (tr=tf=10 μs) VOUT VLX IOUT L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ XC9307A052 VIN = VCE= 3.7V, IOUT = 10mA→50mA (tr=tf=10μs) L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VOUT XC9308A052 VIN = VC E = 3.7V, IOUT = 10mA→100mA L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ XC9307A052 VIN = VC E = 3.7V, IOUT = 10mA→100mA L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ VOUT XC9308A052 VIN = VC E = 3.7V, IOUT = 100mA→300mA (tr=tf=10 μs) L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ XC9307A052 VIN = VC E = 3.7V, IOUT = 100mA→300mA (tr=tf=10 μs) L=2.2uH(DFE2016CKA-2R2M), C IN=10μF(GRM188D71A106KA73) CL=10μF(GRM188D71A106KA73), CVR EF=1μF(GRM155C71A105KE11) SD:PMEG2010BELD, RFB1=150kΩ, RFB2=43kΩ Ta = 25℃, VOUT = -3.3V Ta = 25℃, VOUT = -3.3V Ta = 25℃, VOUT = -3.3V Ta = 25℃, VOUT = -3.3V Ta = 25℃, VOUT = -3.3V Ta = 25℃, VOUT = -3.3V VOUT (500mV/div) IOUT (50mA /div) VLX (5V/div) 500μs/div VOUT (500mV/div) IOUT (50mA /div) VLX (5V/div) 500μs/div VOUT (500mV/div) IOUT (100mA /div) VLX (5V/div) 500μs/div VOUT (500mV/div) IOUT (100mA /div) VLX (5V/div) 500μs/div VOUT (500mV/div) IOUT (200mA /div) VLX (5V/div) 500μs/div VOUT (500mV/div) IOUT (200mA /div) VLX (5V/div) 500μs/div
■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS USP-6EL USP-6EL PKG Standard Board USP-6EL Power Dissipation
XC9140 (De XC9307/XC9308 Series ■MARKING RULE
- USP-6EL ① Represents products series ② Represents product type ③ Represents FB voltage and oscillation frequency ④, ⑤ represents production lot number (G, I, J, O, Q, W excluded) Note: No character inversion used. MARK PRODUCT SERIES F XC9307A0524*-G H XC9308A0524*-G MARK PRODUCT SERIES A XC930*A0524*-G MARK FB voltage (V) OSCILLATION FREQUENCY (MHz) PRODUCT SERIES 5 0.5 2.5 XC930*A0524*-G
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