XC8102AA017R-G

XC8102S TOREX | Alldatasheet

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Load Switch with Low On-Resistance ççççççççççççççççççççççç Step Down DC/DC XC9235 Li-ion DC/DC OUT 3.6V 2.1V XC8102 VIN CE VSS VOUT XC8102 VIN CE VSS VOUT XC8102 VIN CE VSS VOUT ON/OFF Control ON/OFF Control CL CL CL ON/OFF ControlCIN CIN CIN CPU CPU CPU IN IN IN VIN VOUT ˙APPLICATIONS ˔ Mobile phones, Smart phones ˔ Digital still cameras, Digital video cameras ˔ Portable game consoles ˔ Portable equipment ˙GENERAL DESCRIPTION The XC8102 series is a low ON resistance load switch IC with ON/OFF control and output current protection which integrates a P-channel MOSFET. By connecting the XC8102 to the output pin of a step-down DC/DC converter, t he CE pin controls ON/OFF for each distribution switch to deliver power per requirements and maximize total power efficiency. As a result, the XC8102 helps to extend battery life and product operation time. The series contains a current limit and prot ection circuit so these are not required externally unlike discrete circuit solutio ns where MOSFETs and resistors are used. When a low signal is input to the CE pin, the series enters stand-by mode. Even where a load capacitor is connected to the output pin during stand-by, the electric char ge stored at the load capacitor is dischar ged through the internal switch. As a result, the VOUT pin voltage falls quickly to the VSS level. The series contains over current protection with fold-back cu rrent circuitry which operates as over current protection and short circuit protection for the output pin. ˙TYPICAL APPLICATION CIRCUIT ˙çTYPICAL PERFORMANCE CHARACTERISTICS ETR2502-006a ˙FEATURES On Resistance : 0.28 Ω@ VIN=6.0V (TYP .) : 0.31 Ω@ VIN=4.0V (TYP .) : 0.35 Ω@ VIN=2.9V (TYP .) : 0.52 Ω@ VIN=1.8V (TYP .) : 0.60 Ω@ VIN=1.5V (TYP .) : 0.80 Ω@ VIN=1.2V (TYP .) Input Voltage Range : 1.2V ʙ6.0V Power Consumption : 3.0ЖA@ VIN=1.2V : 3.6 ЖA@ VIN=2.9V : 4.0 ЖA@ VIN=6.0V Stand-by Current : 0.1 ЖA Protection Circuit :Current limit(Output Current) 480mA (TYP.) (1.8ʽVINʽ6.0V) : Short-circuit Protection, Short current= 30mA (TYP .) ON/OFF Function : High Active Enable High-Speed Discharge Function Operating Temperature Range : -40 ˆʙ+85ˆç Packages : USP-4,SSOT-24, SOT-25 USPN-4 Environmentally Friendly : EU RoHS Compliant, Pb Free XC8102AA01M/XC8102AA01G 0.0 0.2 0.4 0.6 0.8 1.0 Input Voltage : VIN (V) ON Resistance : RON ( Ω V IN=CE IOUT=50mA CIN=None,CL=None Ta=85℃ 25℃ -40℃ ˔On Resistance vs. Input Voltage

USP-4 SOT-25 SSOT-24 USPN-4 PIN NAME FUNCTIONS 4 1 4 4 V IN Power Input 1 5 3 1 V OUT Output 2 2 2 2 V SS Ground 3 3 1 3 CE ON/OFF Control ʵ 4 ʵ - NC No Connection DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION ᶃ CE pin logic A CE High active ᶄ CL Discharge Function A Output capacitor (C L) auto-discharge function integrated ᶅᶆ Internal Standard Number 01 Fixed GR-G USP-4 MR-G SOT-25 NR-G SSOT-24 ᶇᶈôᶉç Packages Taping Type (*2) 7R-G USPN-4 ˙PIN CONFIGURATION ˙PIN ASSIGNMENT ˙PRODUCT CLASSIFICATION ˔Ordering Information XC8102ᶃᶄᶅᶆᶇᶈôᶉï*1ð *The heat dissipation pad of the USP-4 package is recommended to solder as shown in the recommended mount pattern and metal mask pa ttern for mounting st rength. The heat dissipation pad should be electrically opened or connected to the VSS (No. 2) pin. (*1) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. (*2) The device orientation is fixed in its embossed tape pocket. For reverse orientatio n, please contact your local Torex sales office or representative. (Standard orientation: ᶇR-ᶉ, Reverse orientation: ᶇL-ᶉ)

çççç * Please make sure that I OUT is less than Pd/ (VIN-VOUT) SERIES CE IC OPERATIONAL STATUS ON/OFF High ON XC8102AA01ç Low OFF PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN VSS-0.3ʙ+6.5 V Output Current IOUT 850* mA Output Voltage VOUT VSS-0.3ʙVIN V CE Input Voltage VCE VSS-0.3ʙ+6.5 V USP-4 120 SSOT-24 150 SOT-25 250 Power Dissipation USPN-4 Pd 100 mW Operating Temperature Range Topr -40ʙ+85 oC Storage Temperature Range Tstg -55ʙ+125 oC ˙BLOCK DIAGRAM ˔XC8102AA Series ˙ABSOLUTE MAXIMUM RATINGS ˙FUNCTION CHART each circuit ON/OFF Control GATE CONTROL Current Limit VIN VSS VOUT XC8102AAシリーズ CE Rdischg CE/ * Diodes inside the circuit are an ESD protection diode and a parasitic diode.

PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUITS Input Voltage V IN 1.2 - 6.0 V - VIN =6.0V, VCE=VIN - 0.28 0.425 VIN =4.0V, VCE=VIN - 0.31 0.475 VIN =2.9V, VCE=VIN - 0.35 0.475 VIN =1.8V, VCE=VIN - 0.52 0.625 VIN =1.5V, VCE=VIN - 0.60 0.80 On Resistance (SSOT-24/USPN-4) RON VIN =1.2V, VCE=VIN - 0.80 1.60 Ω ① VIN =6.0V, VCE=VIN - 0.35 0.475 VIN =4.0V, VCE=VIN - 0.38 0.525 VIN =2.9V, VCE=VIN - 0.43 0.525 VIN =1.8V, VCE=VIN - 0.59 0.675 VIN =1.5V, VCE=VIN - 0.67 0.85 On Resistance (SOT-25/USP-4) RON VIN =1.2V, VCE=VIN - 0.87 1.65 Ωçᶃ ç VIN =6.0V, VCE=VIN, VOUT=OPEN - 4.0 7.0 VIN =4.0V, VCE=VIN, VOUT=OPEN - 3.8 6.5 VIN =2.9V, VCE=VIN, VOUT=OPEN - 3.6 6.3 VIN =1.8V, VCE=VIN, VOUT=OPEN - 3.4 5.7 VIN =1.5V, VCE=VIN, VOUT=OPEN - 3.2 5.5 Supply Current IDD VIN =1.2V, VCE=VIN, VOUT=OPEN - 3.0 4.9 ЖA ②ç Stand-by Current I STBY V IN =6.0V, VCE=VSS, VOUT=OPEN - 0.01 0.10 ЖA ② Switch Leakage Current ILEAK V IN =6.0V, VCE=VSS, VOUT=0V - 0.01 0.10 ЖA ② VIN≧2.9V, VOUT = VIN -0.8V 400 480 - 1.8V≦VIN＜2.9V, VOUT = VIN -0.6V 400 480 - 1.5V≦VIN＜1.8V, VOUT =1.2V 200 - - Current Limit I LIM 1.2V≦VIN＜1.5V, VOUT =1.0V 90 - - mA ① Short Circuit Current I SHORT V CE=VIN, VOUT=0V - 30 75 mA ① CE High Level Voltage VCEH 1.1 - 6.0 V ③ CE Low Level Voltage VCEL - - 0.3 V ③ CE High Level Current ICEH V CE=VIN -0.1 - 0.1 ЖA ③ CE Low Level Current ICEL V CE=VSS -0.1 - 0.1 ЖA ③ CL Auto-Discharge Resistance RDCHG V IN=4.0V, VOUT=4.0V, VCE=VSS 380 480 570 Ω ④ Turn On Time (*1) tDLY(ON) VIN =4.0V, VCE=0.3V→1.2V, RL=80Ω, without CIN, CL - 8.5 18 Жs ⑤ Turn Off Time (*2) ˙ELECTRICAL CHARACTERISTICS ˔XC8102AA Series Ta=25ˆ NOTE: *1: Time to reach 90% of VOUT after VCE entering the VCEH threshold. *2: Time to fall to 10% of VOUT after VCE entering the VCEL threshold.

A V IshortIOUT V ˙TEST CIRCUITS Circuit ᶃ Circuit ᶄ Circuit ᶅ

˙TEST CIRCUITS (Continued) Circuit ᶆ Circuit ᶇ The measurement point of wave form The measurement point of wave form

<CE Pin> The XC8102 enables an output P-channel MOSFET switch and the IC internal circuitry to turn off by the signal to the CE pin. In the shutdown mode, the V OUT pin will be pulled down to the VSS by the CL auto-discharge function. The output voltage becomes unstable when the CE pin is opened. If the input voltage to the CE pin is within the specified threshold voltages, the logic is fixed and the XC8102 will operat e normally. However, supply current may increase as a result of the shoot-through current of internal circuitry when the medium level voltage is input to the CE pin. ＜Input/Output Capacitor＞ The XC8102 works well without an input and output capacitors. Also, an output capacitor of the power source can be used as an input capacitor of the XC8102 and a bypass capacitor of the driving IC can be used as an output capacitor of the XC8102. <CL Auto-Discharge Function> The XC8102AA contains a CL auto-discharge resistor and an N-channel transistor between the VOUT pin and the VSS pin. The device quickly discharge the electric charge in the output capacitor (C L) when a low signal to the CE pin is input to turn off a output capacitor (C L) is determined by a CL auto-discharge resistor value (Rdischg) and an output capacitor value. Time constant τ is defined as ( τ = C x Rdischg). Output voltage after starting discharge can be calculated by the following formula. V = VOUT x e –t/Н, or t= НIn (VOUT / V) V: Output voltage after starting discharge, VOUT: Output voltage, t : Discharge time, Н: Output discharge resistor value RdischgʷOutput capacitor (CL) value C <Current Limiter, Short-Circuit Protection> The XC8102 series contains a constant current limiter and fold-back current circuitry. The constant current limiter operates t o limit output current and the fold-back current circuitry operates as short circuit protection for the output pin. When the load current reaches the limit current, the constant current limiter operates and the output voltage drops. The outpu t voltage further, then the fold-back current circuitry operat es to decrease the output current. When the output pin is short-circuited to the ground, the output current drops and maintains a flow about 30mA. ˙NOTES ON USE ˙OPERATIONAL EXPLANATION 1. Please use this IC within the stated absolute maximum ra tings. Operation beyond these limits may cause degrading or permanent damage to the device. 2. The X8102 goes into an undefined operation when the CE pin is left open. The CE pin shall be tied to low or high level. 3. V OUT pin voltage should not be applied beyond the VIN pin voltage. The IC may get damage due to the reverse current toward the VIN pin. 4. Current limit function is integrated. However, power dissipati on may be beyond the limit before starting a fold-back current protection when used in high temperature. For the power dissipation of each package, please refer to the graphs of Package Power vs. Operating Temperature in page 15 to 18.

0.0 0.2 0.4 0.6 0.8 1.0 Input Voltage : VIN (V) ON Resistance : RON ( Ω VI N =C E IOUT=50mA CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01M/XC8102AA01G 0.0 0.2 0.4 0.6 0.8 1.0 Input Voltage : VIN (V) ON Resistance : RON ( Ω VI N =C E IOUT=50mA CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01M/XC8102AA01G 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) ON Resistance : RON ( Ω VI N =C E IOUT=50mA CIN=None,CL=None VI N =1.2V 1.5V 1.8V 2.9V4.0V 6.0V XC8102AA01N/XC8102AA017 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) ON Resistance : RON ( Ω V IN=CE IOUT=50mA CIN=None,CL=None VIN=1.2V 1.5V 1.8V 2.9V4.0V6.0V XC8102AA01 0.0 1.0 2.0 3.0 4.0 5.0 Input Voltage : VIN (V) Supply Current : IDD (uA) V IN=CE CIN=None,CL=None Ta=85℃ 25℃ -40℃ ç XC8102AA01 0.0 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) Supply Current : IDD (uA) VI N =CE CIN=None,CL=None VI N =1.2V 1.5V 1.8V 2.9V 4.0V 6.0V ˙TYPICAL PERFORMANCE CHARACTERISTICS (1) ON Resistance vs. Input Voltage (2) ON Resistance vs. Ambient Temperature (3) Supply Current vs. Input Voltage (4) Supply Current vs. Ambient Temperature

0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) VI N =C E =1.2V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01M/XC8102AA01G 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) V IN=CE=1.5V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01M/XC8102AA01G 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) VI N =C E =1.8V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01M/XC8102AA01G 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) V IN=CE=2.9V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01M/XC8102AA01G 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) V IN=CE=4.0V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01M/XC8102AA01G 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) VI N =C E =6.0V CIN=None,CL=None Ta=85℃ 25℃ -40℃ (5) Output Voltage vs. Output Current ˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) VI N =C E =1.2V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01N/XC8102AA017 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) V IN=CE=1.5V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01N/XC8102AA017 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) VI N =C E =1.8V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01N/XC8102AA017 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) V IN=CE=2.9V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01N/XC8102AA017 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) V IN=CE=4.0V CIN=None,CL=None Ta=85℃ 25℃ -40℃ XC8102AA01N/XC8102AA017 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) VI N =C E =6.0V CIN=None,CL=None Ta=85℃ 25℃ -40℃ ˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Output Voltage vs. Output Current

0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) CE High Level Voltage : VCEH (V) VI N =6.0V CIN=None,CL=None VC E H VC E L XC8102AA01 500 1000 1500 2000 2500 3000 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) Discharge Resistance : Rdischg (Ω) VI N =VOU T CE=V SS CIN=None,CL=None VI N =1.2V VI N =1.5V VI N =1.8V VIN=2.9V VI N =4.0V VIN=6.0V XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =1.2V CE=0.3V→1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =1.5V CE=0.3V→1.2V tr=tf=5μs , I OUT=50m A CIN=None , CL=None CE Input V oltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =1.8V CE=0.3V→1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =2.9V CE=0.3V→1.2V tr=tf=5μs , I OUT=50m A CIN=None , CL=None CE Input V oltage Output Voltage (6) CE Threshold Voltage vs. Ambient Temperature (7) CL Discharge Resistance vs. Ambient Temperature (8) Output Turn-on Time with CE ˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 Output Voltage :VOUT (V) VIN=4.0V CE=0.3V→1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 Output Voltage :VOUT (V) VI N =6.0V CE=0.3V→1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =1.2V CE=1.2V→0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =1.5V CE=1.2V→0.3V tr=tf=5μs , I OUT=50m A CIN=None , CL=None CE Input V oltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 10μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =1.8V CE=1.2V→0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 5μs/div CE Input Voltage: VCE (V) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage :VOUT (V) VI N =2.9V CE=1.2V→0.3V tr=tf=5μs , I OUT=50m A CIN=None , CL=None CE Input Voltage Output Voltage (9) Output Turn-off Time with CE ˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Output Turn-on Time with CE (Continued)

-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 5μs/div CE Input Voltage: VCE (V) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 Output Voltage :VOUT (V) VIN=4.0V CE=1.2V→0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage XC8102AA01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 Time: 5μs/div CE Input Voltage: VCE (V) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 Output Voltage :VOUT (V) VI N =6.0V CE=1.2V→0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage Output Voltage ˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Output Turn-off Time with CE (Continued)

˙PACKAGING INFORMATION ˔SOT-25 ˔SSOT-24 ˔USP-4 ˔USPN-4 Unit : mm Unit : mm Unit : mm Unit : mm

˔ç SOT-25 Power Dissipation Board Mount (Tj max = 125 ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 600 85 240 166.67 評価基板レイアウト（単位：mm） Pd-Ta特性グラフ 100 200 300 400 500 600 700 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） ˙PACKAGING INFORMATION (Continued) Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Pd vs. Ta Ambient Temperature Ta (ˆ) Power Dissipation Pd (mW) 1. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used) M a t e r i a l : G l a s s E p o x y ( F R - 4 ) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter

˔ç SSOT-24 Power Dissipation Board Mount (Tj max = 125 ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 500 85 200 200.00 ˙PACKAGING INFORMATION (Continued) Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 2. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces M a t e r i a l : G l a s s E p o x y ( F R - 4 ) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 40.0 40.0 2.54 2.5 28.9 28.9 1.4 Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Pd-Ta特性グラフ 100 200 300 400 500 600 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW Pd vs. Ta Power Dissipation Pd (mW) Ambient Temperature Ta (ˆ)

˔ç USP-4 Power Dissipation Board Mount (Tj max = 125ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100.00 ˙PACKAGING INFORMATION (Continued) Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces M a t e r i a l : G l a s s E p o x y ( F R - 4 ) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 40.02.5 28.9 Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Pd vs Ta 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient Temperature Ta（℃） Power Dissipation Pd (mW)

˔ç USPN-4 Power Dissipation Board Mount (Tj max = 125ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 640 85 240 166.67 ˙PACKAGING INFORMATION (Continued) Power dissipation data for the USPN-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 2. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces M a t e r i a l : G l a s s E p o x y ( F R - 4 ) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature 40.0 2.5 28.9 Pd-Ta特性グラフ 100 200 300 400 500 600 700 25 45 65 85 105 125 周囲温度Ta（℃） 許容損失Pd（mW）Power Dissipation Pd (mW) Pd vs Ta Ambient Temperature Ta(ˆ)

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