XC6901

XC6901 TOREX | Alldatasheet

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200mA Negative Voltage Regulator with ON/OFF Control ETR03043-007 CL:1.0μF GND -VIN CE -VOUT NC SOT - 25 （ TOP VIEW ) CIN : 1 . 0 μF ( ceramic ) (ceramic) ■GENERAL DESCRIPTION The XC6901 Series is a negative voltage CMOS regulator which includes a reference voltage source, error amplifier, driver transistor, current limiter and phase compensator. The CE function enables the circuit to be in stand-by mode by inputting low level signal. In the stand-by mode, the electric charge at the output capacitor (CL) will be discharged via the internal auto-discharge switch and as a result the -VOUT pin quickly returns to the VSS level. The over current protection circuit will operate when the output current reaches limit current. The thermal shutdown circuit wi ll operate when the junction temperature reaches limit temperature. ■APPLICATIONS

• Negative power supplies
• Modules (Wireless LAN, Digital still cameras, etc)
• Digital still cameras
• Mobile devices / terminals ■FEATURES Maximum Output Current : 200mA Input Voltage Range : -2.4V ～-12.4V(VCE＝3.6V) Output Voltage Range : -0.9V~-12.0V Accuracy : ±1.5%(V OUT＜‐2.0V) Temperature Stability : TYP. ±50ppm/℃ CE High Level Voltage : +1.2V~+3.6V,(Active High) Dropout Voltage : 400mV ＠IOUT=100mA Low Power Consumption : 100 μA MAX. Stand-by Current : Less than 0.1 μA Protection Circuits : Current Limit 350mA TYP , Foldback Overheat Protection TTSB=150℃ Output Capacitor : Ceramic Capacitor Compatible Built-in Function : CL High-Speed Discharge Operating Ambient Temperature ： -40℃~＋85℃ Packages : SOT-25, SOT-89-5, USP-6C Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT XC6901x501 -5.8 -5.6 -5.4 -5.2 -5.0 -4.8 -4.6 Time(100μs/div) Output Voltage: VOUT [V] 100 150 200 250 300 Output Current: I OUT [mA] Output Current Output Voltage 1mA 100mA IOUT =1⇔100mA,tr=tf=5μs,Ta=25℃,V CE=1.5V VIN=-6V,CIN=1μF(ceramic),CL=1μF(ceramic) ■ TYPICAL PERFORMANCE CHARACTERISTICS

■PIN CONFIGURATION ■PIN ASSIGNMENT PIN NUMBER USP-6C SOT-25 SOT-89-5 PIN NAME FUNCTIONS 1 5 5 -V OUT Negative Output 2,5 4 1 NC No Connection 3 2 2 -V IN Negative Supply Input 4 3 3 CE ON/OFF Control 6 1 4 GND Ground ■FUNCTION CHART XC6901 Series D type PIN NAME SIGNAL STATUS L Stand-by H Active CE OPEN Stand-by * The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the -VIN (No. 3) pin.

■PRODUCT CLASSIFICATION

• Ordering Information XC6901①②③④⑤⑥-⑦(*1) ON/OFF Control Voltage Regulator (CE Active High) DESIGNATOR ITEM SYMBOL DESCRIPTION ① Type(*2) D CE Pull-down resistor CL Auto-discharge ②③ Output Voltage 09～C0 -0.9V~-12V A：10, B：11, C：12 1 0.10V Increments e.g. -1.2V→②＝1, ③ ＝2, ④ ＝1 ④ Output Type B 0.05V Increments for -0.95V~-4.95V ER-G USP-6C (3,000/Reel) MR-G SOT-25 (3,000/Reel) ⑤⑥-⑦ Packages (Order Unit) PR-G SOT-89-5 (1,000/Reel) (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. (*2) For the type without CL auto-discharge, please contact your local Torex sales office or representative. ■STANDARD VOLTAGE
• Examples for standard voltage PACKAGES VOUT (V) USP-6C SOT-25 SOT-89-5 -1.2V XC6901D121ER-G XC6901D121MR-G XC6901D121PR-G -2.5V XC6901D251ER-G XC6901D251MR-G XC6901D251PR-G -2.6V XC6901D261ER-G XC6901D261MR-G XC6901D261PR-G -3.0V XC6901D301ER-G XC6901D301MR-G XC6901D301PR-G -3.3V XC6901D331ER-G XC6901D331MR-G XC6901D331PR-G -4.0V XC6901D401ER-G XC6901D401MR-G XC6901D401PR-G -4.5V XC6901D451ER-G XC6901D451MR-G XC6901D451PR-G -5.0V XC6901D501ER-G XC6901D501MR-G XC6901D501PR-G -6.0V XC6901D601ER-G XC6901D601MR-G XC6901D601PR-G -12.0V XC6901DC01ER-G XC6901DC01MR-G XC6901DC01PR-G

■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS Input Voltage V IN GND-18+V CE ～ GND+0.3 V Output Current I OUT 500 (*1) mA Output Voltage V OUT -V IN-0.3 ～ GND+0.3 V CE Input Voltage V CE GND-0.3 ～ V IN+18 V

120 USP-6C 1000 (PCB mounted)

(*2)

250 SOT-25 600 (PCB mounted)

(*2) 500 Power Dissipation SOT-89-5 Pd 1300 (PCB mounted) (*2) mW Operating Ambient Temperature Topr -40 ～+85 ℃ Storage Temperature Tstg -55 ～+125 ℃ GND=0V, Ta=25℃ (*1): Please use within the range of IOUT≦Pd/( VOUT - VIN) (*2) The power dissipation figure shown is PCB mounted and is for reference only. Please refer to page 24~26 for details.

■BLOCK DIAGRAM XC6901 Series D type *Diodes inside the circuit are an ESD protection diode and a parasitic diode.

■ELECTRICAL CHARACTERISTICS

• XC6901 Series PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage V OUT(E) (*2) I OUT=20mA VOUT(T)≧-2.0V -0.030 VOUT(T) (*1) +0.030 V ① VIN=VOUT(T)-2.0V VOUT(T)≦-2.4V Maximum Output Current (*4) IOUTMAX VIN=-4.4V VOUT(T)＞-2.4V 200 - - mA ① VIN=VOUT(T)-1.0V VOUT(T)≦-3.0V VIN=-4.0V VOUT(T)＞-3.0V Load Regulation ∆VOUT 1mA≦IOUT≦100mA - 20 60 mV ① Dropout Voltage Vdif (*3) I OUT=20mA - E-1 (*5) mV ① Supply Current I BIAS V IN=-14.5V, VCE=1.5V, IOUT=0mA - 100 200 μA ① Stand-by Current I STB V IN=-14.5V, VCE=0V, IOUT=0mA - 0.01 0.1 μA ① -14.5V～VOUT(T)-1V VOUT(T)≦-1.4V -14.5V～-2.4V VOUT(T)＞-1.4V Input Line Regulation ∆VOUT/ (∆VIN・VOUT） IOUT=20mA - 0.01 0.20 %/V ① Input Voltage V IN -16 ＋VCE - -2.4 V ① Output Voltage Temperature Characteristics ∆VOUT/ (∆Topr・VOUT） IOUT=20mA -40℃≦Topr≦85℃ - ±50 - ppm/℃① Power Supply Rejection Ratio PSRR VIN=｛VOUT(T)-1.0｝+0.5Vp-pAC, I OUT=20mA, f=1kHz - 45 - ｄB ② VIN=VOUT(T)-2.0V VOUT(T)≦-2.4V Limit Current I LIM VIN=-4.4V VOUT(T)＞-2.4V 210 300 - mA ① Short-Circuit Current I SHORT V IN=VOUT(T)-2.0V Short -VOUT to GND level - 80 - mA ① Detect Thermal Shutdown Temperature TTSD IC Junction temperature - 150 - ℃ ① Release Thermal Shutdown Temperature TTSR IC Junction temperature - 125 - ℃ ① Hysteresis Width T HYS T TSD-TTSR - 25 - ℃ ① CE "H" Level Voltage VCEH 1.2 - 3.6 V ① CE "L" Level Voltage VCEL GND - 0.4 V ① CE "H" Level Current ICEH VIN=-12.4V, VCE=3.6V XC6901D Series 1.8 4 7 μA ① CE "L" Level Current ICEL V CE=GND -0.1 - 0.1 μA ① CL Discharge Resistor RDCHG V IN=-8V,VOUT=-2V,VCE=GND 0.7 1.2 1.8 k Ω ① VOUT(T)＞-4.0V 0.15 0.4 1.2 ms ③ Soft Start Time t SS RL=3kΩ,Rise Time CE="H" to 95% of VOUT(E) VOUT(T)≦-4.0V 0.3 0.7 2 ms ③ GND=0V,Ta=25℃ NOTE: Unless otherwise stated regarding input voltage conditions V CE=1.5V、GND=0V、VIN=VOUT(T)-1.0V or -2.4V the one which bigger absolute value. *1) VOUT(T): Nominal output voltage *2) VOUT(E): Effective output voltage (see the voltage chart) (ie. The output voltage when “VOUT(T)-1.0V” or “-2.4V”is provided at the VIN pin while maintaining a certain IOUT value. VIN1 is the input voltage when VOUT1 appears at the VOUT pin while input voltage is gradually increased VOUT1 is the voltage equal to 98% of the normal output voltage when amply stabilized VOUT (T) -1.0V or -2.4V (the bigger absolute value one ) are input at the VIN pin. *4) The maximum current may not be able to flow when thermal shutdown operates, it depends on power dissipation. *5) E-1: Refer to dropout voltage chart.

■ELECTRICAL CHARACTERISTICS(Continued) Dropout Voltage Chart (VOUT(T)=-0.9V～-5V) E-1 E-1 E-1 DROPOUT VOLTAGE DROPOUT VOLTAGE DROPOUT VOLTAGE NOMINAL OUTPUT VOLTAGE Vdif (mV) NOMINAL OUTPUT VOLTAGE Vdif (mV) NOMINAL OUTPUT VOLTAGE Vdif (mV) -0.90 800 1500 -2.85 116 157 -4.80 80 115 -0.95 750 1450 -2.90 114 155 -4.85 80 115 -1.00 700 1400 -2.95 112 153 -4.90 79 115 -1.05 650 1350 -3.00 110 151 -4.95 79 115 -1.10 600 1300 -3.05 109 150 -5.00 78 114 -1.15 550 1250 -3.10 108 148 -1.20 500 1200 -3.15 107 147 -1.25 450 1150 -3.20 105 145 -1.30 400 1100 -3.25 104 144 -1.35 350 1050 -3.30 102 142 -1.40 300 1000 -3.35 102 141 -1.45 270 950 -3.40 101 140 -1.50 230 900 -3.45 101 139 -1.55 220 850 -3.50 100 137 -1.60 210 800 -3.55 99 136 -1.65 205 750 -3.60 98 135 -1.70 200 700 -3.65 97 134 -1.75 195 650 -3.70 95 133 -1.80 190 600 -3.75 95 132 -1.85 183 550 -3.80 94 131 -1.90 176 500 -3.85 94 130 -1.95 171 450 -3.90 93 129 -2.00 165 400 -3.95 92 128 -2.05 161 350 -4.00 91 127 -2.10 156 300 -4.05 90 126 -2.15 152 250 -4.10 89 125 -2.20 148 200 -4.15 89 125 -2.25 144 187 -4.20 88 124 -2.30 140 185 -4.25 87 123 -2.35 138 183 -4.30 86 122 -2.40 135 181 -4.35 86 122 -2.45 132 178 -4.40 85 121 -2.50 129 174 -4.45 85 120 -2.55 127 172 -4.50 84 119 -2.60 125 169 -4.55 83 119 -2.65 123 166 -4.60 82 119 -2.70 121 163 -4.65 82 118 -2.75 119 161 -4.70 82 117 -2.80 117 159 -4.75 81 116

■ELECTRICAL CHARACTERISTICS(Continued) Dropout Voltage Chart (VOUT(T)=-5.1V～-12V) E-1 E-1 DROPOUT VOLTAGE DROPOUT VOLTAGE NOMINAL OUTPUT VOLTAGE Vdif(mV) NOMINAL OUTPUT VOLTAGE Vdif(mV) VOUT(T) TYP. MAX. VOUT(T) TYP. MAX. -5.1 77 113 -9.0 58 93 -5.2 77 112 -9.1 58 92 -5.3 76 111 -9.2 58 92 -5.4 75 110 -9.3 57 92 -5.5 74 110 -9.4 57 91 -5.6 73 109 -9.5 56 91 -5.7 73 108 -9.6 56 91 -5.8 72 107 -9.7 56 91 -5.9 71 106 -9.8 55 90 -6.0 70 105 -9.9 55 90 -6.1 70 105 -10.0 54 90 -6.2 69 104 -10.1 54 90 -6.3 69 104 -10.2 54 89 -6.4 68 103 -10.3 54 89 -6.5 67 102 -10.4 54 89 -6.6 66 102 -10.5 53 88 -6.7 66 101 -10.6 53 88 -6.8 65 101 -10.7 53 88 -6.9 65 100 -10.8 53 88 -7.0 65 100 -10.9 53 88 -7.1 64 99 -11.0 52 88 -7.2 64 99 -11.1 53 88 -7.3 63 98 -11.2 52 87 -7.4 63 98 -11.3 51 87 -7.5 62 98 -11.4 51 87 -7.6 62 98 -11.5 50 87 -7.7 62 97 -11.6 50 87 -7.8 61 96 -11.7 50 87 -7.9 61 96 -11.8 50 87 -8.0 60 96 -11.9 50 87 -8.1 60 96 -12.0 50 87 -8.2 60 95 -8.3 60 95 -8.4 60 94 -8.5 59 94 -8.6 59 94 -8.7 59 94 -8.8 59 93 -8.9 59 93

■TEST CIRCUITS 1) CIRCUIT① 2) CIRCUIT② 3) CIRCUIT③ -VOUT CE -VIN GND V A -VIN A SW1 V V IOUT SW2 VCE VOUT1 ACIN=1μF(ceramic) CL=1μF (ceramic)

■OPERATIONAL EXPLANATION ＜Soft Start Function＞ Figure1：Soft Start Time and Inrush Current ＜Current Limit, Short-Circuit Protection＞ The XC6901 series’ fold-back circuit operates as an output curr ent limiter and a short protecti on circuit for the output pin. When the output current reaches the current limit level, output voltage drops with the decrease of the output current. There are no par asitic diode between the –VOUT pin and GND pin. The minimized short-circuit current is maintained even if the –VOUT pin voltage is pulled up toward positive. ＜Thermal Shutdown＞ The XC6901 Series has an internal thermal Shutdown(TSD) circuit for protection against overheating. When the junction temperature reac hes the detection temperature, t he driver transistor is forcibly turned off. When the junctio n temperature falls to the release temperatur e with the driver transistor still in the off state, the driver transistor turns on (automatic recovery) and restarts regulator operation. ＜CE Pin＞ The XC6901 Series is able to shut down the regulator circuit using the CE pin signal. CE pin can be controlled with positive v oltage due to P-channel transistor source input (Gate is grounded). A current flow of a few micro amperes. The regulator is turned on when CE input voltage is positive, the regulator is turned off when CE input is GND. When CE pin is open, IC is turned OFF, due to the built-in Pull-down resistor. When the IC is turned OFF with low input voltage to the CE pin,-V OUT pin voltage goes into GND level by R1,R2 and CL discharge resistance(RDCHG). The voltage divided by resisters R1 and R2 is compared with the internal reference voltage based on ground by the error amplifier. The driver transistor tied to the –V IN pin is then driven by the subsequent output signal. The output voltage at the –VOUT pin is controlled and stabilized by a system of negative feedback. XC6901 Series includes soft-start circuit. During power start-up, the inrush current from -V IN pin to V OUT pin to charge CL capacitor can be reduced and it makes the VIN stable. Soft-start time (tSS) is optimized internally.

■OPERATIONAL EXPLANATION(Continued) OUTPUT VOLTAGE RANGE INPUT CAPACITOR OUTPUT CAPACITOR VOUT(T) CIN CL -0.9V～-12V 1.0μF～ 1.0μF～100μF ＜CL High Speed Discharge＞ The XC6901D type is capable of high-speed discharge of the charge that collects on the output capacitor (C L below). This is accomplished by the P-channel MOSFET and C L discharge resistance connected between the -V OUT and GND pins in the block diagram, and takes place when the L-level signal (IC internal circuit shutdown signal) of the CE pin is input so that it could avoids malfunction. The CL discharge time is determined by this C L discharge resistance and C L. Letting the time constant of the C L discharge resistance RDCHG and CL be τ (τ = C × R), the output voltage after discharge by the P-channel MOSFET can be obtained from the CR discharge equation below. Please be noted that R DCHG various with supply voltage and VDS(drain-source voltage) since it consists of P-channel MOSFET. ｔ = τln（V OUT(E) / V） V：Output voltage during discharge VOUT(E)：Output voltage t：Discharge time τ：CL auto-discharge resistance RDCHG × CL Output capacitor value CL ＜Low ESR Capacitor＞ With the XC6901 series, a stable output voltage is achievable even if used with low ESR capacitors, as a phase compensation circuit is built-in. The output capacitor (C L) should be connected as close to -V OUT pin and GND pin to obtain stable phase compensation. Values required for the phase compensation are as the table below. For a stable power input, please connect an input capacitor (C IN) near power supply. In order to ensure the stable phase compensation while avoiding run-out of values, please use the capacitor (C IN, C L) which does not depend on bias or temperature too much. The table below shows recommended values of CIN, CL for all environment conditions. CHART 1：Recommended Values of CIN, CL (MIN.)

■NOTE ON USE 1) For temporary, transitional voltage drop or voltage rising phenomenon. The IC is liable to malfunction should the ratings be exceeded. 2) Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please enforce wiring –VIN and GND. 3) Please wire the C IN and CL as close to the IC as possible. 4) Capacitances of these capacitors (CIN, CL) are decreased by the influences of bias voltage and ambient temperature. Care shall be taken for capacitor selection to ensure stability of phase compensation from the point of ESR influence. 5) Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.

■TYPICAL PERFORMANCE CHARACTERISTICS XC6901x331 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0 50 100 150 200 250 300 350 400 450 Output Current: I OUT [mA] Output Voltage: VOUT [V] Ta=-40℃ Ta=25℃ Ta=85℃ VIN = -5.3V,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x331 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0 50 100 150 200 250 300 350 400 450 Output Current: I OUT [mA] Output Voltage: VOUT [V] VIN=-4.3V VIN=-5.3V VIN=-6.3V Ta=25℃,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x501 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 0 50 100 150 200 250 300 350 400 450 Output Current: I OUT [mA] Output Voltage: VOUT [V] Ta=-40℃ Ta=25℃ Ta=85℃ VIN = -7.0V,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x501 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 0 50 100 150 200 250 300 350 400 450 Output Current: I OUT [mA] Output Voltage: VOUT [V] VIN=-6V VIN=-7V VIN=-8V Ta=25℃,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901xC01 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 0 50 100 150 200 250 300 350 400 450 Output Current: I OUT [mA] Output Voltage: VOUT [V] Ta=-40℃ Ta=25℃ Ta=85℃ VIN = -14V,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901xC01 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 0 50 100 150 200 250 300 350 400 450 Output Current: I OUT [mA] Output Voltage: VOUT [V] VIN=-14V VIN=-14.5V Ta=25℃,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) (1) Output Voltage vs. Output Current

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) Output Voltage vs. Input Voltage XC6901x331 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 Input Voltage: V IN [V] Output Voltage: VOUT [V] Ta=-40℃ Ta=25℃ Ta=85℃ IOU T=20mA,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x501 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 Input Voltage: V IN [V] Output Voltage: VOUT [V] Ta=-40℃ Ta=25℃ Ta=85℃ IOUT=20mA,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901xC01 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 Input Voltage: VIN [V] Output Voltage: VOUT [V] Ta=-40℃ Ta=25℃ Ta=85℃ IOU T=20mA,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901xC01 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 Input Voltage: V IN [V] Output Voltage: VOUT [V] IOUT=1mA IOUT=20mA IOUT=100mA Ta=25℃,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x331 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 Input Voltage: V IN [V] Output Voltage: VOUT [V] IOUT=1mA IOUT=20mA IOUT=50mA Ta=25℃,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x501 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 Input Voltage: V IN [V] Output Voltage: VOUT [V] IOUT=1mA IOUT=20mA IOUT=100mA Ta=25℃,VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic)

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Dropout Voltage vs. Output Current XC6901x331 200 400 600 800 1000 1200 1400 1600 1800 2000 0 50 100 150 200 Output Current: I OUT [mA] Dropout Voltage: Vdif [mV] Ta=-40℃ Ta=25℃ Ta=85℃ VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x501 200 400 600 800 1000 1200 1400 1600 1800 2000 0 50 100 150 200 Output Current: I OUT [mA] Dropout Voltage: Vdif [mV] Ta=-40℃ Ta=25℃ Ta=85℃ VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901xC01 200 400 600 800 1000 1200 1400 1600 1800 2000 0 50 100 150 200 Output Current: I OUT [mA] Dropout Voltage: Vdif [mV] Ta=-40℃ Ta=25℃ Ta=85℃ VCE=1.5V CIN = 1.0μF (ceramic), CL = 1.0μF (ceramic) XC6901x331 -160 -140 -120 -100 -80 -60 -40 -20 Input Voltage: V IN [V] Supply Current: ISS [μA] Ta=-40℃ Ta=25℃ Ta=85℃ XC6901x501 -160 -140 -120 -100 -80 -60 -40 -20 Input Voltage: V IN [V] Supply Current: ISS [μA] Ta=-40℃ Ta=25℃ Ta=85℃ VCE=1.5V (4) Supply Current vs. Input Voltage

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Supply Current vs. Input Voltage (Continued) XC6901xC01 -160 -140 -120 -100 -80 -60 -40 -20 Input Voltage: VIN [V] Supply Current: ISS [μA] Ta=-40℃ Ta=25℃ Ta=85℃ VCE=1.5V XC6901x331 -3.33 -3.32 -3.31 -3.30 -3.29 -3.28 -3.27 -50 -25 0 25 50 75 100 Ambient Temperature: Ta [℃] Output Voltage: VOUT [V] VIN =-4.3V,IOU T=20mA,VCE=1.5V CIN=1μF(ceramic),CL=1μF(ceramic) XC6901x501 -5.05 -5.03 -5.00 -4.98 -4.95 -50 -25 0 25 50 75 100 Ambient Temperature: Ta [℃] Output Voltage: VOUT [V] VIN =-6.0V,IOUT=20mA,VCE=1.5V CIN=1μF(ceramic),CL=1μF(ceramic) XC6901xC01 -12.12 -12.08 -12.04 -12.00 -11.96 -11.92 -11.88 -50 -25 0 25 50 75 100 Ambient Temperature: Ta [℃] Output Voltage: VOUT [V] VIN =-13V,IOUT=20mA,VCE=1.5V CIN=1μF(ceramic),CL=1μF(ceramic) (5) Output Voltage vs. Ambient Temperature

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) CE Pin Threshold Voltage vs Ambient Temperature XC6901 Series 0.70 0.75 0.80 0.85 0.90 0.95 -50 -25 0 25 50 75 100 Ambient Temperature: Ta [℃] CE Threshold Voltage: VCE [V] CE"H" CE"L" VIN =-14.5V XC6901 Series 0.7 1.2 1.7 2.2 2.7 3.2 3.7 4.2 4.7 -50 -25 0 25 50 75 100 Ambient Temperature: Ta [℃] CE Input Current: ICE [uA] A/B TYPE C/D TYPE VIN =-12.4V, VCE=3.6V XC6901 Series,Type C/D (With CE Pull-down) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 CE Voltage: VCE [V] CE Input Current: ICE [μA] Ta=-40℃ Ta=25℃ Ta=85℃ VIN =-12.4V XC6901 Series,Type A/B (Without CE Pull-down) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 CE Voltage: VCE [V] CE Input Current: ICE [μA] Ta=-40℃ Ta=25℃ Ta=85℃ VIN =-12.4V (7) CE Input Current vs CE Voltage (8) CE Input Current vs Ambient Temperature

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Input Rising Response Time XC6901x331 -10.0 -9.0 -8.0 -7.0 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 Time(200μs/div) Output Voltage: VOUT [V] -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 Input Voltage: VIN [V] Input Voltage Output Voltage VIN=0⇒-4.3V,tr=5μs,Ta=25℃ VCE=1.5V,IOU T=20mA,CL=1μF(ceramic) XC6901x501 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 Time(200μs/div) Output Voltage: VOUT [V] -7.0 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 Input Voltage: VIN [V]Output Voltage Input Voltage VIN=0⇒-6.0V,tr=5μs,Ta=25℃ VCE=1.5V,IOU T=20mA,CL=1μF(ceramic) XC6901xC01 -30.0 -24.0 -18.0 -12.0 -6.0 0.0 Time(200μs/div) Output Voltage: VOUT [V] -15.0 -12.0 -9.0 -6.0 -3.0 0.0 Input Voltage: VIN [V] Output Voltage VIN=0⇒-13V,tr=5μs,Ta=25℃ VCE=1.5V,IOUT=20mA,CL=1μF(ceramic) Input Voltage XC6901x331 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 Time(200μs/div) CE Voltage: VCE [V] Output Voltage: VOUT [V] Output Voltage CE Voltage VIN=-4.3V,IOU T=20mA,Ta=25℃ VCE=0⇒1.5V,tr=5μs,CL=1μF(ceramic) XC6901x501 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 Time(200μs/div) CE Voltage: VCE [V] Output Voltage: VOUT [V] VIN=-6.0V,IOUT=20mA,Ta=25℃ VCE=0⇒1.5V,tr=5μs,CL=1μF(ceramic) Output Voltage CE Voltage (10) CE Rising Response Time

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) CE Rising Response Time (Continued) XC6901xC01 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 Time(200μs/div) CE Voltage: VCE [V] Output Voltage: VOUT [V] VIN=-13V,IOUT=20mA,Ta=25℃ VCE=0⇒1.5V,tr=5μs,C L=1μF(ceramic) Output Voltage CE Voltage XC6901x331 -3.60 -3.55 -3.50 -3.45 -3.40 -3.35 -3.30 -3.25 -3.20 Time(100μs/div) Output Voltage: VOUT [V] -8.0 -7.0 -6.0 -5.0 -4.0 -3.0 -2.0 -1.0 0.0 Input Voltage: VIN [V] Output Voltage Input Voltage VIN =-4.3V⇔-5.3V,tr=tf=5μs,Ta=25℃,V CE=1.5V IOU T=20mA,CL=1μF(ceramic) XC6901x501 -5.30 -5.25 -5.20 -5.15 -5.10 -5.05 -5.00 -4.95 -4.90 Time(100μs/div) Output Voltage: VOUT [V] -7.5 -7.0 -6.5 -6.0 -5.5 -5.0 -4.5 -4.0 -3.5 Input Voltage: VIN [V] Output Voltage Input Voltage VIN =-6V⇔-7V,tr=tf=5μs,Ta=25℃,V CE=1.5V IOU T=20mA,CL=1μF(ceramic) XC6901xC01 -12.25 -12.20 -12.15 -12.10 -12.05 -12.00 -11.95 -11.90 Time(100μs/div) Output Voltage: VOUT [V] -14.5 -14.0 -13.5 -13.0 -12.5 -12.0 -11.5 -11.0 Input Voltage: VIN [V]Output Voltage Input Voltage VIN =-13V⇔-14V,tr=tf=5μs,Ta=25℃,V CE=1.5V IOUT=20mA,CL=1μF(ceramic) (11) Input Transient Response

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (12) Load Transient Response XC6901x331 -4.5 -4.2 -3.9 -3.6 -3.3 -3.0 -2.7 Time(100μs/div) Output Voltage: VOUT [V] 100 150 200 250 300 Output Current: I OUT [mA]Output Voltage Output Current 1mA 100mA IOUT =1⇔100mA,tr=tf=5μs,Ta=25℃,V CE=1.5V VIN=-4.3V,CIN=1μF(ceramic),CL=1μF(ceramic) XC6901x501 -5.8 -5.6 -5.4 -5.2 -5.0 -4.8 -4.6 Time(100μs/div) Output Voltage: VOUT [V] 100 150 200 250 300 Output Current: I OUT [mA] Output Current Output Voltage 1mA 100mA IOU T =1⇔100mA,tr=tf=5μs,Ta=25℃,V CE=1.5V VIN=-6V,CIN=1μF(ceramic),CL=1μF(ceramic) XC6901xC01 -12.8 -12.6 -12.4 -12.2 -12.0 -11.8 -11.6 Time(200μs/div) Output Voltage: VOUT [V] 100 150 200 250 300 Output Current: I OUT [mA]Output Voltage Output Current 1mA 100mA IOU T =1⇔100mA,tr=tf=5μs,Ta=25℃,V CE=1.5V VIN=-13V,CIN=1μF(ceramic),CL=1μF(ceramic) XC6901x331 10 100 1k 10k 100k Ripple Frequency: f [Hz] Ripple Rejection Rate: RR [dB] Iout=1mA Iout=20mA Ta=25℃,VIN=-4.3V+0.5Vp- pAC VCE=1.5V,CL=1μF(ceramic) XC6901x501 10 100 1k 10k 100k Ripple Frequency: f [Hz] Ripple Rejection Rate: RR [dB] Iout=1mA Iout=20mA Ta=25℃,VIN=-6V+0.5Vp- pAC VCE=1.5V,CL=1μF(ceramic) (13) Ripple Rejection Rate

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) Ripple Rejection Rate (Continued) XC6901xC01 10 100 1k 10k 100k Ripple Frequency: f [Hz] Ripple Rejection Rate: RR [dB] Iout=1mA Iout=20mA Ta=25℃,VIN=-13V+0.5Vp- pAC VCE=1.5V,CL=1μF(ceramic)

■PACKAGING INFORMATION Φ1.0 1.6 +0.15 -0.2 4.5±0.1 8° 8° 1.5±0.1 1.5±0.1 0.4 +0.03 -0.02 0.4 +0.03 -0.02 123

• USP-6C
• SOT-25
• SOT-89-5

• USP-6C Reference Pattern Layout ●USP-6C Reference Metal Mask Design 0.225 2.4 0.50.5 0.25 1.82 3 4 0.45 1.0 0.050.05 0.45 0.250.25
• S O T - 2 5 R e f e r e n c e P a t t e r n L a y o u t ●SOT-89-5 Reference Pattern Layout ■PACKAGING INFORMATION (Continued) 2.0 1.5 1.5 1.0 0.7

• SOT-25 Power Dissipation Board Mount (Tj max = 125 ℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 600 85 240 166.67 ■PACKAGING INFORMATION (Continued) Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd-Ta特性グラフ 100 200 300 400 500 600 700 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） Pd vs. Ta Ambient Temperature Ta (℃) Power Dissipation Pd (mW)

• SOT-89-5 Power Dissipation Board Mount (Tj max = 125 ℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1300 85 520 76.92 ■PACKAGING INFORMATION (Continued) Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd-Ta特性グラフ 200 400 600 800 1000 1200 1400 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） Pd vs. Ta Ambient Temperature Ta (℃) て Power Dissipation Pd (mW)

• USP-6C Power Dissipation Board Mount (Tj max = 125 ℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100.00 ■PACKAGING INFORMATION (Continued) Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 3. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature て Pd-Ta特性グラフ 200 400 600 800 1000 1200 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） Pd vs. Ta Ambient Temperature Ta (℃) Power Dissipation Pd (mW)

VOLTAGE (V) TYPE PRODUCT SERIES U -9.9 ～ -12.0 D XC6901D991-G ～ XC6901DC01-G MARK OUTPUT VOLTAGE（V） MARK OUTPUT VOLTAGE（V） MARK OUTPUT VOLTAGE（V） ■MARKING RULE 12 3 ① ② ③ ④ ⑤ SOT89-5 5 2 4 1 2 3 ⑤ ②③ ①1 USP-6CSOT-25(Under dot) ① represents product series ② represents output voltage range and product types ③ represents output voltage ④,⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ repeated *No character inversion used. ※A dot is marked below the mark of ①

1. The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.