XC6802A42XMR-G

XC6802_12 TOREX | Alldatasheet

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800mA Single Cell Li-ion Battery Linear Charger IC ˙GENERAL DESCRIPTION The XC6802 series is a constant-current/constant-voltage linear charger IC for single cell lithium-ion batteries. The XC6802 includes a reference voltage source, battery voltage monitor, driver transistor, constant-current/constant-voltage charge circuit, over heat protection circuit, phase compensation circuit. The ba ttery charge termination voltage is internally set to 4.2V ʶ 0.7% and the trickle charge voltage and accuracy is 2.9V ʶ3%. In trickle charge mode, a safe charge to a battery is possible because approximately 1/10 out of setting charge current is supplied to the battery. With an external R SEN resistor, the charge current can be set freely up to 800mA (MAX.), therefore, the series is ideal for various battery charge applications. The seri es’ charge status output pin, /CHG pin, is capable of checking the IC’s charging state while connecting with an external LED. ˙APPLICATIONS ˔ç Charging docks, charging cradles ˔ç MP3 players, portable audio players ˔ç Cellular phones, PDAs ˔ç Bluetooth headsets ˙çFEATURES Operating Voltage Range : 4.25V ~ 6.0V Charge Current : External ly set up to 800mA (MAX.) Charge Termination Voltage : 4.2V ʶ0.7% Trickle Charge Voltage : 2.9V ʶ3% Supply Current (Stand-by) : 15 ЖA (TYP.) Function : Constant-current/constant-voltage Operation Thermal Shutdown Automatic Recharge Charge Status Output Pin Soft-start Function (Inrush Limit Current) Operating Ambient Temperature : -40ˆʙ+85ˆ Packages : SOT-89-5, SOT-25, USP-6C, USP-6EL Environmentally Friendly : EU RoHS Compliant, Pb Free ˙TYPICAL APPLICATION CIRCUIT ETR2501-006 ˙TYPICAL PERFORMANCE CHARACTERISTICS ˔Battery Charge Cycle Li-ion Battery Charge Cycle 100 200 300 400 500 600 700 Time (hours) Charge Current I BAT (mA) 3.00 3.20 3.40 3.60 3.80 4.00 4.20 4.40 Battery Voltage VBAT(V) VIN=5.0V, CIN=1uF RSEN=2kohm , 830mAh Batter y Charge Current Battery Voltage VIN=5.0V, CIN=1ЖF RSEN=2kΩ, 830mAh Battery Li-ion Battery Charge Cycle Battery Voltage Charge Current Charge Current : IBAT (mA) Battery Voltage : VBAT (V) Time (hour)

PIN NAME CONDITIONS IC OPERATION H Level (1.4V≦VSEN≦VIN) or Open OFF (Shutdown Mode) ISEN Pull-down by external components ON, Charge Current I BAT=1000 / RSEN * * For SOT-25, SOT-89-5, and USP-6C, charge current should be set to become IBAT≦800mA. For USP-6EL, charge current should be set to become IBAT≦500mA. PIN NUMBER SOT-25 SOT-89-5 USP-6C USP-6EL PIN NAME FUNCTIONS 1 5 3 3 /CHG Charge Status Output Pin 2 2 2 2 VSS Ground 3 4 1 1 BAT Charge Current Output Pin 4 3 6 6 VIN Input Voltage Pin 5 1 4 4 ISEN Charge Current Setup Pin - - 5 5 NC No Connection DESIGNATOR ITEM SYMBOL DESCRIPTION PR SOT-89-5 (1,000/Reel) PR-G SOT-89-5 (1,000/Reel) MR SOT-25 (3,000/Reel) MR-G SOT-25 (3,000/Reel) ER USP-6C (3,000/Reel) ER-G USP-6C (3,000/Reel) ᶃᶄ-③ (*1) Packages (Order Unit) 4R-G USP-6EL (3,000/Reel) ˙PIN CONFIGURATION ˙PIN ASSIGNMENT ˙çPRODUCT CLASSIFICATION ˔Ordering Information XC6802A42Xᶃᶄ-③ * The dissipation pad for the USP-6C / USP-6EL package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat releas e. If the pad needs to be connected to other pins, it should be connected to the VSS (No. 2) pin. (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. ˙FUNCTIONS

• Diodes inside the circuits are ESD protection diodes and parasitic diodes. PARAMETER SYMBOL RATINGS UNIT VIN Pin Voltage V IN -0.3 ~ + 6.5 V ISEN Pin Voltage V SEN -0.3 ~ V IN + 0.3 or +6.5 (*2) V BAT Pin Voltage V BAT -0.3 ~ + 6.5 V /CHG Pin Voltage V /CHG -0.3 ~ + 6.5 V SOT-89-5 SOT-25 USP-6C 900 BAT Pin Current (*1) USP-6EL IBAT 550 mA

500 SOT-89-5

1300 (PCB mounted) (*3)

250 SOT-25

600 (PCB mounted) (*3)

120 USP-6C

1000 (PCB mounted) (*3) 120 Power Dissipation USP-6EL Pd 1000 (PCB mounted) (*3) mW Operating Temperature Range Topr - 40 ~ + 85 ˆ Storage Temperature Range Tstg - 55 ~ + 125 ˆ ˙BLOCK DIAGRAM ˙ABSOLUTE MAXIMUM RATINGS Ta=25ˆ All voltages are described based on the VSS pin. (*1) Please use within the range of IBAT≦Pd/(VIN-VBAT). (*2) The maximum rating corresponds to the lowest value between VIN+0.3 or +6.5. (*3) This is a reference data taken by using the test board. Please refer to page 17 to 20 for details.

Ta=25ˆ PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT CIRCUIT Input Voltage V IN 4.25 - 6.0 V - Supply Current I SS Charge mode, R SEN=10kΩ - 15 35 ЖA ᶅ Stand-by Current I STBY Stand-by mode - 15 35 ЖA ᶅ Shut-down Current I SHUT Shut-down mode (RSEN=NC, VIN<VBAT or VIN<VUVLOʣ - 10 23 ЖA ᶅ Float Voltage 1 V FLOAT1 Ta=25ˆ, IBAT=40mA ×0.993 4.2 ×1.007 V ᶄ Float Voltage 2 (*1) V FLOAT2 0ˆʽTaʽ50ˆ, IBAT=40mA ×0.99 4.2 ×1.01 V - SOT-25 / SOT-89-5 / USP-6C - - 800 Maximum Battery Current (*2) I BATMAX USP-6EL - - 500 mA - Battery Current 1 I BAT1 R SEN=10kΩ, CC mode 93 100 107 mA ᶅ Battery Current 2 I BAT2 R SEN=2kΩ, CC mode 465 500 523 mA ᶅ Battery Current 3 I BAT3 Stand-by mode, V BAT=4.2V - - 2 ЖA ᶅ Battery Current 4 I BAT4 Shut-down mode (RSEN=NC) - - 1 ЖA ᶇ Battery Current 5 I BAT5 Sleep mode, V IN=0V - - 1 ЖA ᶅ Trickle Charge Current 1 I TRIKL1 V BAT<VTRIKL, RSEN=10kΩ 6 10 14 mA ᶅ Trickle Charge Current 2 I TRIKL2 V BAT<VTRIKL, RSEN=2kΩ 30 50 70 mA ᶅ Trickle Voltage V TRIKL R SEN=10kΩ, VBAT Rising 2.913 2.9 2.987 V ᶅ Trickle Voltage Hysteresis Width VTRIKL_HYS - 58 90 116 mV ᶅ UVLO Voltage V UVLO ̫IN: L → H 3.686 3.8 3.914 V ᶅ UVLO Hysteresis Width V UVLO_HYS - 150 190 280 mV ᶅ Manual Shut-down Voltage V SD I SEN: L → H 1.4 - - V ᶃ Manual Shut-down Voltage Hysteresis Width VSD_HYS - - 100 - mV ᶃ VIN-VBAT Shut-down Release Voltage VASD ̫IN: L → H 70 100 140 mV ᶅ VIN-VBAT Shut-down Voltage Hysteresis Width VASD_HYS - - 70 - mV ᶅ C/10 Charge Termination Current Threshold 1 ITERM1 R SEN=10kΩ 0.07 0.10 0.13 mA/mA ᶄ C/10 Charge Termination Current Threshold 2 ITERM2 R SEN=2kΩ 0.07 0.10 0.13 mA/mA ᶄ ISEN Pin Voltage V ISEN R SEN=10kΩ, CC mode - 1.0 - V ᶅ /CHG Pin Weak Pull-down Current I/CHG1 V BAT=4.3, V/CHG=5V 8 20 50 ЖA ᶅ /CHG Pin Strong Pull-down Current I/CHG2 V BAT=4.0V, V/CHG=1V 4 10 20 mA ᶅ /CHG Pin Output Low Voltage V/CHG I/CHGʹ5mA - 0.35 0.7 V ᶆ Recharge Battery Threshold Voltage ΔVRECHRG V FLOAT1-VRECHRG 100 150 200 mV ᶅ ON Resistance R ON I BAT=100mA - 450 900 m Ω ᶃ Soft-start Time t SS 100 150 200 Жs ᶈ Recharge Battery Time t RECHRG 0.4 2 4 ms ᶄ Battery Termination Detect Time tTERM IBAT falling (less than charge current /10) 0.3 1 3.5 ms ᶄ ISEN Pin Pull-up Current I SEN_pull_up - - 1.3 - ЖA ᶃ Thermal Shut-down Detect Temperature TTSD Junction temperature - 115 - ˆ - Thermal Shut-down Release Temperature TTSR Junction temperature - 95 - ˆ - * Unless otherwise stated, VIN=5.0V. (*1) The figures under the condition of 0 O CʽTaʽ50 O C are guaranteed by design calculation. (*2) The RSEN resistance set: The battery current shall not be exceeded to 800mA. (SOT-25, SOT-89-5, and USP-6C) The battery current shall not be exceeded to 500mA. (USP-6EL) ˙ELECTRICAL CHARACTERISTICS XC6802A42x

˙OPERATIONAL EXPLANATION <Charge Cycle> If the BAT pin voltage is less than trickle voltage (TYP. 2.9V), t he charger enters trickle charge mode. In this mode, a safe battery charge is possible because approximately only 1/10 of the charge current which was set by the I SEN pin, is supplied to the battery. When the BAT pin voltage rises above the trickle voltage, the charger enters constant-current mode (CC mode) and the battery is charged by the programmed charge curren t. When the BAT pin voltage reaches 4.2V, the charger enters constant-voltage mode (CV mode) automatically. After this, t he charge current starts to drop and when it reaches a level which is 1/10 of the programmed charge current, the charge terminates. <Setting Charge Current> The charge current can be set by connecting a resistor between the ISEN pin and the VSS pin. The battery charge current, I BAT, is 1000 times the current out of the ISEN pin. Therefore, the charge current, IBAT, is calculated by the following equations: IBAT = (VISEN / RSEN) x 1000 (VISEN = 1.0V (TYP.): Current sense pin voltage) However IBATʽ800mA (SOT-25, SOT-89-5, and USP-6C), IBATʽ500mA (USP-6EL) <Charge Termination> The battery charge is terminated when the charge current decreases to 1/10 of the full charging level after the battery pin voltage reaches a float voltage. An internal comparator monitors the ISEN pin voltage to detect the charge termination. When the comparator monitors the I SEN pin voltage is less than 100mV (charge termination detect) (*1) for 1ms TYP. (charge termination detect time), the IC enters stand-by mode. A driver transistor turns off during the stand-by mode. In this state, a failure detection circuit and a monitoring circuit of the battery pin voltage operates. (*1) The detect after charging completed: ISEN pin voltage should be less than 100mV. <Automatic Recharge> In stand-by mode battery voltage falls. When the voltage level at the battery pin drops to recharge battery threshold voltage (TYP. 4.05V) or less, the charge cycle automatically re-starts a fter a delay of (TYP. 2ms). As such, no external activation control is needed. Charge Cycle (Charge Main Routine) Trickle Charge Constant-Current Charge (CC) Constant-Voltage Charge (CV) Yes Keeping the charge state during a charge termination detect time (1ms) Charge Termination (Stand-by Mode) Yes Keeping the stand-by mode during a recharge time (2ms) Failure Detection Input Voltage Monitor (UVLO) Manual Shut-down VIN-BAT Voltage Monitor Charge Cycle Charge Cycle Charge Cycle Shut-down Shut-down Shut-down

˙OPERATIONAL EXPLANATION (Continued) <Charge Condition Status> The /CHG pin constantly monitors the charge states classified as below: ˔Strong pull-down: I/CHG=10mA (TYP .) in a charge cycle, ˔Weak pull-down: I/CHG=20ЖA (TYP .) in a stand-by mode, ˔High impedance: in shutdown mode. <Connection of Shorted BAT Pin> Even if the BAT pin is shorted to the V SS, a trickle charge mode starts to operate for protecting the IC from destruction caused by over current. <Under-voltage Lockout (UVLO)> The UVLO circuit keeps the charger in shut-down mode until the input voltage, V IN, rises more than the UVLO voltage. Moreover, in order to protect the battery charger, the UVLO circuit keeps the charger in shut-down mode when a voltage between the input pin voltage and BAT pin voltage falls to less than 30mV (TYP.). The charge will not restart until the voltag e between the input pin voltage and BAT pin voltage rises more t han 100mV (TYP.). During the shut-down mode, the driver transistor turns off but a failure detection circuit operates, and supply current is reduced to 10ЖA (TYP.). <Soft-start Function> To protect against inrush current from the input to the battery, soft-start time is set in the circuit optimally (150Жs, TYP.). <Manual Shut-down> During the charge cycle, the IC can be shif ted to the shut-down mode by floating the I SEN pin. For this, a drain current to the battery is reduced to less than 2 ЖA and a shut-down current of the IC is reduced to less than 10 ЖA (TYP.). A new charge cycle starts when reconnecting the current sense resistor. <Opened BAT Pin> When the BAT pin is left open, the IC needs to be shut-down once after monitoring the CHG pin by a microprocessor etc and keeping the I SEN pin in H level. <Backflow Prevention Between the BAT Pin and the V IN Pin> A backflow prevention circuit protects against current flowing from the BAT pin to the VIN pin even the BAT pin voltage is higher than the VIN pin voltage. 4.20V 4.05V 2.9V CC CVTrickle Standby Recharge Battery Time (2ms, Typ) Recharge Battery Voltage IBAT/10 Charge Current IBAT Battery Termination Detect Time (1ms, Typ) /CHG Pin Status Weak Pull Down (20uA, Typ) Strong Pull Down (10mA, Typ) Strong Pull Down (10mA, Typ)

1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please wire the CIN as close to the IC as possible. 3. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. ■NOTES ON USE

˙TEST CIRCUITS 1. ON Resistance, Shut-down Voltage, ISEN Pull-up current 2. Battery Termination Detect Time, Recharge Battery Time C/10 Charge Termination Current Threshold1ʙ2, Battery Termination Voltage1 3. Trickle Charge Current1ʙ2, Battery Current1ʙ3, Battery Current5 ISEN Pin Voltage, Trickle Charge Voltage, UVLO, Recharge Battery Threshold Voltage V IN-VBAT Shut-down Release Voltage, /CHG Pin Weak Pull-down Current /CHG Pin Strong Pull-down Current, Stand-by Current, Shut-down Current 5. Battery Current 4 6. Soft-start 4. /CHG Pin, Output Low Voltage

˙TYPICAL PERFORMANCE CHARACTERISTICS （1）充電サイクル特性例 （2）定電流モード特性例 XC6802A42X 100 120 バッテリー電圧 V BAT(V) バッテリー電流 IBAT(mA) -40℃ 25℃ 85℃ VIN=5V, RSEN=10kΩ XC6802A42X 100 200 300 400 500 600 バッテリー電圧 V BAT(V) バッテリー電流 IBAT(mA) -40℃ 25℃ 85℃ VIN=5V, RSEN=2kΩ XC6802A42X 100 120 バッテリー電圧 V BAT(V) バッテリー電流 IBAT(mA) VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V RSEN=10kΩ XC6802A42X 100 200 300 400 500 600 バッテリー電圧 V BAT(V) バッテリー電流 IBAT(mA) VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V RSEN=2kΩ XC6802A42X 200 400 600 800 1000 充電時間 Time (hour) バッテリー電流 IBAT (mA) 3.00 3.30 3.60 3.90 4.20 4.50 バッテリー電圧 VBAT (V) バッテリー電圧 バッテリー電流 VIN=5V, CIN=1.0μF RSEN=1.25kΩ, 420mAh Battery XC6802A42X 200 400 600 800 1000 充電時間 Time (hour) バッテリー電流 IBAT (mA) 3.00 3.30 3.60 3.90 4.20 4.50 バッテリー電圧 VBAT (V) バッテリー電圧 バッテリー電流 VIN=5V, CIN=1.0μF RSEN=1.25kΩ, 850mAh Battery (1) Charge Cycle (2) Battery Current vs. Battery Voltage Battery Voltage Battery Current Battery Voltage Battery Current Charge Time (hour) Charge Time (hour) Battery Current: IBAT (mA) Battery Current: IBAT (mA) Battery Voltage: VBAT (V) Battery Voltage: VBAT (V) Battery Current: IBAT (mA) Battery Current: IBAT (mA) Battery Voltage: VBAT (V) Battery Voltage: VBAT (V) Battery Voltage: VBAT (V) Battery Voltage: VBAT (V) Battery Current: IBAT (mA) Battery Current: IBAT (mA)

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （3）定電圧モード特性例 （4）充電完了電圧 - 周囲温度特性例 XC6802A42X 4.16 4.17 4.18 4.19 4.20 4.21 4.22 4.23 4.24 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） 充電完了電圧1 VFLOAT1（V） VIN=5V, IBAT=40mA, RSEN=10kΩ XC6802A42X 4.16 4.17 4.18 4.19 4.20 4.21 4.22 4.23 4.24 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） 充電完了電圧1 VFLOAT1（V） VIN=5V, IBAT=200mA, RSEN=2kΩ XC6802A42X 4.00 4.05 4.10 4.15 4.20 4.25 50 60 70 80 90 100 110 バッテリー電流 IBAT(mA) バッテリー電圧 VBAT(V) -40℃ 25℃ 85℃ VIN=5V, RSEN=10kΩ XC6802A42X 4.00 4.05 4.10 4.15 4.20 4.25 250 300 350 400 450 500 550 バッテリー電流 I BAT(mA) バッテリー電圧 VBAT(V) -40℃ 25℃ 85℃ VIN=5V, RSEN=2kΩ XC6802A42X 4.00 4.05 4.10 4.15 4.20 4.25 50 60 70 80 90 100 110 バッテリー電流 I BAT(mA) バッテリー電圧 VBAT(V) VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V RSEN=10kΩ XC6802A42X 4.00 4.05 4.10 4.15 4.20 4.25 250 300 350 400 450 500 550 バッテリー電流 I BAT(mA) バッテリー電圧 VBAT(V) VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V RSEN=2kΩ (3) Battery Voltage vs. Battery Current Battery Voltage: VBAT (V) Battery Voltage: VBAT (V) Battery Current: IBAT (mA) Battery Current: IBAT (mA) Battery Current: IBAT (mA) Battery Current: IBAT (mA) Battery Voltage: VBAT (V) Battery Voltage: VBAT (V) (4) Charge Termination Voltage vs. Ambient Temperature Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) Charge Termination Voltage: VFLOAT1 (V) Charge Termination Voltage: VFLOAT1 (V)

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （5）バッテリー電流 - 周囲温度特性例 （6）トリクル充電電流 - 周囲温度特性例 （7）トリクル電圧 - 周囲温度特性例 （8）マニュアルシャットダウン電圧 - 周囲温度特性例 XC6802A42X -50 -25 0 25 50 75 100 周囲温度 Ta（℃） トリクル充電電流1 ITRIKL1（mA） XC6802A42X -50 -25 0 25 50 75 100 周囲温度 Ta（℃） トリクル充電電流2 ITRIKL2（mA） VIN=5V, VBAT=2.5V, RSEN=10kΩ V IN=5V, VBAT=2.5V, RSEN=2kΩ XC6802A42X 120 110 100 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） バッテリー電流1 IBAT1（mA） XC6802A42X 540 520 500 480 460 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） バッテリー電流2 IBAT2（mA） VIN=5V, VBAT=3.8V, RSEN=10kΩ VIN=5V, VBAT=3.8V, RSEN=2kΩ XC6802A42X 2.65 2.70 2.75 2.80 2.85 2.90 2.95 3.00 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） トリクル電圧 VTRIKL（V） トリクル電圧（解 トリクル電圧（検 VIN=5V XC6802A42X 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） マニュアルシャットダウン電圧 VSD （V） マニュアルシャットダウン電圧（検出） マニュアルシャットダウン電圧（解除） (5) Battery Current vs. Ambient Temperature Battery Current1: IBAT1 (mA) Battery Current2: IBAT2 (mA) Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) (6) Trickle Charge Current vs. Ambient Temperature Trickle Charge Current1: ITRIKL1 (mA) Trickle Charge Current2: ITRIKL2 (mA) (7) Trickle Voltage vs. Ambient Temperature (8) Manual Shutdown Voltage vs. Ambient Temperature Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) Trickle Voltage: VTRIKL (V) Manual Shutdown Voltage: VSD (V) Trickle Voltage (Release) Trickle Voltage (Detect) Manual Shutdown Voltage (Detect) Manual Shutdown Voltage (Release)

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （9）UVLO電圧 - 周囲温度特性例 （11）充電完了検出時間 - 周囲温度特性例 （12）再充電時間 - 周囲温度特性例 （13）再充電しきい値電圧 - 周囲温度特性例 （14）ソフトスタート時間 - 周囲温度特性例 （10）VIN-VBAT間シャットダウン電圧 - 周囲温度特性例 XC6802A42X 0.0 0.5 1.0 1.5 2.0 2.5 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） 充電完了検出時間 TTERM（ms） VIN=5V XC6802A42X 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） 再充電時間 TRECHRG（ms） VIN=5V XC6802A42X 3.35 3.45 3.55 3.65 3.75 3.85 3.95 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） UVLO電圧 VUVLO（V） UVLO電圧（検出） UVLO電圧（解除） XC6802A42X 120 160 200 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） VIN-VBAT間シャットダウン解除電圧 VASD （V） VIN-VBAT間シャットダウン電圧（検出） VIN-VBAT間シャットダウン電圧（解除） XC6802A42X 100 120 140 160 180 200 220 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） 再充電しきい値電圧 △VRECHRG（mV） VIN=5V XC6802A42X 100 120 140 160 180 200 220 - 5 0 - 2 50 2 55 07 5 1 0 0 周囲温度 Ta（℃） ソフトスタート時間 TSS（μs） VIN=5V (9) UVLO Voltage vs. Ambient Temperature (10) VIN – VBAT Shutdown Voltage vs. Ambient Temperature Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) UVLO Voltage: VUVLO (V) VIN – VBAT Shutdown Release Voltage: VASD (V) (11) Charge Termination Detect Time vs. Ambient Temperature (12) Recharge Time vs. Ambient Temperature Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) (13) Recharge Threshold Voltage vs. Ambient Temperature (14) Soft Start Time vs. Ambient Temperature Charge Termination Detect Time: tTERM (ms) Recharge Time: tRECHRG (ms) Recharge Threshold Voltage: △VRECHRG (mV) Soft Start Time: ｔss (μs) UVLO Voltage (Detect) UVLO Voltage (Release) VIN-VBAT Shutdown Voltage (Detect) VIN-VBAT Shutdown Voltage (Release)

˙TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （15）ON抵抗 - 周囲温度特性例 （16）シャットダウン電流 - 周囲温度特性例 （17）スタンバイ電流 - 周囲温度特性例 （18）/CHG Weak Pull Down電流特性例 （19）/CHG Strong Pull Down電流特性例 （20）/CHG端子出力LOW電圧 - 周囲温度特性例 XC6802A42X 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） ON抵抗 RON（Ω） VIN=4.15V, IBAT=100mA, VISEN=0.5V XC6802A42X -50 -25 0 25 50 75 100 周囲温度 Ta（℃） シャットダウン電流 IShut（μA） VIN=5V, RSEN=NC XC6802A42X -50 -25 0 25 50 75 100 周囲温度 Ta（℃） スタンバイ電流 IStby（μA） VIN=5V, VBAT=4.3V XC6802A42X /CHG端子電圧 V CHG(V) /CHG Weak_Pull_Down電流 Ichg1（μA) -40℃ 25℃ 85℃ VIN=5V, VBAT=4.3V XC6802A42X 0123456 /CHG端子電圧 VCHG(V) /CHG Strong_Pull_Down電流 Ichg2(mA) -40℃ 25℃ 85℃ VIN=5V, VBAT=4.0V XC6802A42X 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 周囲温度 Ta（℃） /CHG端子 出力LOW電圧 V/CHG（V） I/CHG=5mA, VIN=5V, VBAT=2.5V (15) ON Resistance vs. Ambient Temperature (16) Shutdown Current vs. Ambient Temperature (17) Stand-by Current vs. Ambient Temperature (18) /CHG Weak Pull Down Current vs. /CHG Pin Voltage Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) Ambient Temperature: Ta (ˆ) /CHG Pin Voltage: VCHG (V) ON Resistance: RON (Њ) Shutdown Current: ISHUT (ЖA) Stand-by Current: ISTBY (ЖA) /CHG Weak Pull Down Current: ICHG1 (ЖA) /CHG Pin Voltage: VCHG (V) Ambient Temperature: Ta (ˆ) /CHG Pin Output Low Voltage: V/CHG (V) /CHG Strong Pull Down Current: ICHG2 (mA) (19) /CHG Strong Pull Down Current vs. /CHG Pin Voltage (20) /CHG Pin Output Low Voltage vs. Ambient Temperature

˙PACKAGING INFORMATION ˔SOT-25 ˔SOT-89-5 ˔USP-6C ˔USP-6C Reference Pattern Layout ˔USP-6C Reference Metal Mask Design (unit : mm) 1.8±0.05 0.50 (0.10) 1.4±0.1 0.20±0.05 0.30±0.05 0.10±0.05 1pin INDENT 0.225 0.50.5 0.25 1.8 0.250.25 1.4 1.2 0.6 0.250.250.25 0.225 0.50.5 (unit : mm) Φ1.0 1.6 +0.15 -0.2 4.5±0.1 2.5±0.10.8 MIN

4.35 MAX

8° 8° (0.1) 1.5±0.1 1.5±0.1 1.5±0.1 5°5° 0.4 +0.03 -0.02 0.4 +0.03 -0.02 123 (0.4)

0.8 MIN

ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ■PACKAGING INFORMATION (Continued) 213 654 1.8±0.05 0.3±0.05 (0.55） 1.5±0.05 1PIN INDENT ˔USP-6EL (unit: mm) ＜USP-6EL Reference Metal Mask Design＞ ＜USP-6EL Reference Pattern Layout＞ 0.30.3 0.9 2.2

ᶃ Represents product series MARK PRODUCT SERIES ᶄ Standard product, Represent the 7 th digits MARK PRODUCT SERIES ᶅ Standard product, Represents the 8th digits MARK PRODUCT SERIES ᶆᶇ Represents production lot number 01 to 09, 0A to 0Z, 11 to 9Z , A1 to A9, AA to AZ, B1 to ZZ in order. (G, I, J, O, Q, W excepted) * N o c h a r a c t e r i n v e r s i o n u s e d . ˙MARKING RULE ②③ ① 1pin→ USPxx(5文字ﾏｰｸ) ① ② ③ ④ ⑤ 123 SOT-25 SOT89-5 524 123 USP-6C / USP-6EL SOT-25 SOT-89-5 1 pin →

˔ç SOT-89-5 Power Dissipation Board Mount (Tj max = 125ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1300 85 520 76.92 Pd-Ta特性グラフ 200 400 600 800 1000 1200 1400 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Pd vs. Ta Ambient Temperature Ta (ˆ) Power Dissipation Pd (mW) て ˙PACKAGING INFORMATION (Continued)

˔ç SOT-25 Power Dissipation Board Mount (Tj max = 125ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 600 85 240 166.67 Pd-Ta特性グラフ 100 200 300 400 500 600 700 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） ˙PACKAGING INFORMATION (Continued) Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Pd vs. Ta Ambient Temperature Ta (ˆ) Power Dissipation Pd (mW)

Pd vs. Ta 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient Temperature Ta（℃） Power Dissipation Pd（mW） ˔ç USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100 ˙PACKAGING INFORMATION (Continued)

• USP-6EL Power Dissipation ç Power dissipation data for the USP-6EL is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. ç 1. Measurement Condit ion (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter ç ç ç ç ç ç ç ç Evaluation Board (Unit: mm) ç 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125ˆ) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100.00 ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç Pd-Ta特性グラフ 200 400 600 800 1000 1200 25 45 65 85 105 125 周囲温度Ta（℃） 許容損失Pd（mW） ˙PACKAGING INFORMATION (Continued) Pd vs. Ta Ambient Temperature Ta (ˆ) Power Dissipation Pd (mW)

ç ç ç 1. The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.