XC6701B502ER-G

XC6701_2 TOREX | Alldatasheet

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28V Operation High Speed Voltage Regulators with Stand-by Function ■FEATURES Max Output Current : More than 150mA (200mA limit) (VIN=VOUT+3.0V) Dropout Voltage : 300mV@IOUT=20mA Input Voltage Range : 2.0V~28.0V Output Voltage Range : 1.8V~18.0V (0.1V increments) High Accuracy :±2% Low Power Consumption : 50μA (VOUT=5.0Ｖ） Stand-by Current : Less than 0.1μA High Ripple Rejection : 50dB@1kHz Operating Temperature : -40℃~+85℃ Low ESR Capacitor : Ceramic Capacitor Compatible (Internal Phase Compensation) Packages : SOT-25, SOT-89, SOT-89-5, Environmentally Friendly USP-6C, SOT-223, TO-252 : EU RoHS Compliant, Pb Free ■GENERAL DESCRIPTION The XC6701 series are positive voltage regulator ICs manufact ured using CMOS process with 28V of operation voltage. The series consists of a voltage reference, an error amplifie r, a current limiter, a thermal protection circuit and a phase compensation circuit plus a driver transistor. The output voltage is selectable in 0.1V increments within the range of 1.8V to 18V which fixed by laser trimming technologies. The output stabilization capacitor (C L) is also compatible with low ESR ceramic capacitors. The over current protection circuit and the thermal shutdown circ uit are built-in. These two protection circuits will operate when the output current reaches current limit level or the junction temperature reaches temperature limit level. The CE function enables the output to be turned off and the IC becomes a stand-by mode resulting in greatly reduced power consumption. Packages are selectable depending on the app lications from SOT-25, SOT-89, SOT-89-5, USP-6C, SOT-223, and TO-252. ■APPLICATIONS

• Car audio, Car navigation systems
• Note book computers, PDAs
• Home appliances
• Audio visuals, Digital cameras, Video cameras
• Cordless phones, Wireless communication ■ TYPICAL APPLICATION CIRCUITS ■TYPICAL PERFORMANCE CHARACTERISTICS XC6701B/D 502 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 Time (1ms/div) Output Voltage: VOUT (V) 120 150 Output Current: I OUT (mA) Output Current VIN=7.0V, tr=tf=5μs CIN=CL=1.0μF (ceramic), Ta=25℃ Output Voltage ETR0334-008a XC6701B Series With CE function

SOT-25 SOT-89-5 USP-6C PIN NAME FUNCTIONS 1 5 6 V IN Power Input 2 2 5 V SS Ground 3 4 2, 4 NC No connection 4 3 3 CE ON/OFF Control 5 1 1 V OUT Output PIN NUMBER SOT-89 SOT-223 TO-252 PIN NAME FUNCTIONS 3 3 1 V IN Power Input 2 2 2 V SS Ground 1 1 3 V OUT Output CE(Chip Enable) IC Operation State ON/OFF CE"H" Level Operation ON CE"L" Level Operation OFF CE"OPEN" Operation Undefined ■PIN CONFIGURATION ■PIN ASSIGNMENT * The dissipation pad for the USP-6C package should be solder-plated in reference mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS (No. 5) pin.

• XC6701B Series
• XC6701D Series SOT-25 (TOP VIEW) SOT-89 (TOP VIEW) SOT-89-5 (TOP VIEW) USP-6C (BOTTOM VIEW) SOT-223 (TOP VIEW) TO-252 (TOP VIEW) ■PIN FUNCTION ASSIGNMENT
• XC6701B Series

DESIGNATOR ITEM SYMBOL DESCRIPTION ①② Output Voltage 18~J0 For the voltage within 1.8V ~9.9V; e.g. 2.5V ⇒ 25 5 . 0 V ⇒ 50 For the voltage above 10.0V; e.g. 11.6V ⇒ B6 15.2V ⇒ F2 18.0V ⇒ J0 ③ Output Voltage Accuracy 2 ±2% accuracy MR SOT-25 (3,000/Reel) MR-G SOT-25 (3,000/Reel) PR SOT-89-5 (1,000/Reel) PR-G SOT-89-5 (1,000/Reel) ER USP-6C (3,000/Reel) ④⑤-⑥ Packages (Order Unit) ER-G USP-6C (3,000/Reel) DESIGNATOR ITEM SYMBOL DESCRIPTION ①② Output Voltage 18~J0 For the voltage within 1.8V ~9.9V; e.g. 2.5V ⇒ 25 5 . 0 V ⇒ 50 For the voltage above 10.0V; e.g. 11.6V ⇒ B6 15.2V ⇒ F2 18.0V ⇒ J0 ③ Output Voltage Accuracy 2 ±2% accuracy PR SOT-89 (1,000/Reel) PR-G SOT-89 (1,000/Reel) FR SOT-223 (1,000/Reel) FR-G SOT-223 (1,000/Reel) JR TO-252 (2,500/Reel) ④⑤-⑥ Packages (Order Unit) JR-G TO-252 (2,500/Reel) XC6701B①②③④⑤-⑥(*1) :CE function (Active High) ■ PRODUCT CLASSIFICATION

• Ordering Information (*1) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. XC6701D①②③④⑤-⑥(*1) : No CE function (3 pin regulator) (*1) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.

PARAMETER SYMBOL RATINGS UNIT Input Voltage V IN V SS-0.3~30 V Output Current I OUT 300 (*1) mA Output Voltage V OUT V SS-0.3~VIN+0.3 V CE Input Voltage V CE V SS-0.3~30 V

250 SOT-25 600 (PCB mounted) (*2)

500 SOT-89-5 1300 (PCB mounted) (*2)

1000 (PCB mounted) (*2) mW (Ta=25℃) Operating Temperature Range Topr -40~+85 ℃ Storage Temperature Range Tstg -55~+125 ℃ PARAMETER SYMBOL RATINGS UNIT Input Voltage V IN V SS-0.3~30 V Output Current I OUT 300 (*1) mA Output Voltage V OUT V SS-0.3~VIN+0.3 V

500 SOT-89 1000 (PCB mounted) (*2)

300 SOT-223 1500 (PCB mounted) (*2)

1800 (PCB mounted) (*2) mW (Ta=25℃) Operating Temperature Range Topr -40~+85 ℃ Storage Temperature Range Tstg -55~+125 ℃ ■ABSOLUTE MAXIMUM RATINGS

• XC6701B Series (SOT-25, SOT-89-5, USP-6C)
• XC6701D Series (SOT-89, SOT-223, TO-252)
• XC6701B Series
• XC6701D Series *1: IOUT≦Pd / (VIN-VOUT) *2: The power dissipation figure shown is PCB mounted. Please refer to page 27 for details. ■ BLOCK DIAGRAMS *1: IOUT≦Pd / (VIN-VOUT) *2: The power dissipation figure shown is PCB mounted. Please refer to page 27 for details.

Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNIT CIRCUIT Output Voltage VOUT(E) I OUT=10mA, VCE=VIN E-0 V ① VIN= VOUT(T)+3.0V , VCE=VIN （VOUT(T)≧3.0Ｖ） 150 - - mA ① Maximum Output Current IOUTMAX VIN=VOUT(T)+3.0V, VCE=VIN (VOUT(T)＜3.0V) 100 - - mA ① 1mA≦IOUT≦50mA , VCE=VIN 1.8V≦VOUT(T)≦5.0V - 50 90 1mA≦IOUT≦50mA , VCE=VIN 5.1V≦VOUT(T)≦12.0V - 110 175 Load Regulation △VOUT 1mA≦IOUT≦50mA , VCE=VIN 12.1V≦VOUT(T)≦18.0V - 180 275 mV ① Dropout Voltage 1 Vdif1 I OUT=20mA, VCE=VIN E-2 mV ① Dropout Voltage 2 Vdif2 I OUT=100mA ,VCE=VIN E-3 mV ① 1.8V≦VOUT(T)≦5.0V 11 50 105 5.1V≦VOUT(T)≦12.0V 11 60 115 Supply Current I SS 12.1V≦VOUT(T)≦18.0V 11 65 125 μA ② Stand-by Current I STB V CE=VSS - 0.01 0.10 μA ② Line Regulation 1 △VOUT △VIN・VOUT(T) VOUT(T)+2.0V≦VIN≦28.0V IOUT=5mA , VCE=VIN - 0.05 0.10 %/V ① Line Regulation 2 △VOUT △VIN・VOUT(T) VOUT(T)+2.0V≦VIN≦28.0V IOUT=13mA , VCE=VIN - 0.15 0.30 %/V ① Input Voltage V IN 2.0 - 28.0 V - Output Voltage Temperature Characteristics △VOUT △Ta・VOUT(T) IOUT=20mA, VCE=VIN Ripple Rejection Rate PSRR VIN=[VOUT(T)+2.0V]VDC+0.5VP-PAC IOUT=20mA , f=1kHz , VCE=VIN - 50 - dB ③ Short Current I SHORT V IN=VOUT(T)+2.0V , VCE=VIN - 40 - mA ① CE ”H” Level Voltage V CEH V IN=28.0V 1.1 - 28.0 V ① CE ”L” Level Voltage V CEL V IN=28.0V 0 - 0.35 V ① CE ”H” Level Current I CEH V IN=VCE=28.0V -0.1 - 0.1 μA ① CE ”L” Level Current I CEL V IN=28.0V, VCE=VSS -0.1 - 0.1 μA ① Thermal Shutdown Detect Temperature TTSD Junction Temperature - 150 - ℃ ① Thermal Shutdown Release Temperature TTSR Junction Temperature - 125 - ℃ ① Hysteresis Width T TSD-TTSR Junction Temperature - 25 - ℃ - NOTE: *1: V OUT(T): Nominal output voltage *2: VOUT(E): Effective output voltage (i.e. the output voltage when “V OUT(T)+2.0V” is provided at the VIN pin while maintaining a certain IOUT value.) *3: Vdif={VIN1 {Note 5} - VOUT1 {Note 4} *4: VOUT1: In case of VOUT(T) < 3.0V, the VOUT1 is equal to 98% of the VOUT(T) when a stabilized input voltage is applied in VOUT(T)+3.0V. : In case of V OUT(T)≧3.0V, the VOUT1 is equal to 98% of the VOUT(T) when a stabilized input voltage is applied in VOUT(T)+2.0V. *5: VIN1: The input voltage when VOUT1 appears as input voltage is gradually decreased. *6: Unless otherwise stated, VIN=VOUT(T)+2.0V.

• XC6701B Series ■ELECTRICAL CHARACTERISTICS

Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNIT CIRCUIT Output Voltage V OUT(E) I OUT=10mA E-0 V ① VIN= VOUT(T)+3.0V （VOUT(T)≧3.0Ｖ） 150 - - mA ① Maximum Output Current I OUTMAX VIN=VOUT(T)+3.0V (VOUT(T)＜3.0V ) 100 - - mA ① 1mA≦IOUT≦50mA 1.8V≦VOUT(T)≦5.0V - 50 90 1mA≦IOUT≦50mA 5.1V≦VOUT(T)≦12.0V - 110 175 Load Regulation △VOUT 1mA≦IOUT≦50mA 12.1V≦VOUT(T)≦18.0V - 180 275 mV ① Dropout Voltage1 Vdif1 I OUT=20mA E-2 mV ① Dropout Voltage2 Vdif2 I OUT =100mA E-3 mV ① 1.8V≦VOUT(T)≦5.0V 11 50 105 5.1V≦VOUT(T)≦12.0V 11 60 115 Supply Current I SS 12.1V≦VOUT(T)≦18.0V 11 65 125 μA ② Line Regulation1 △VOUT △VIN・VOUT(T) VOUT(T)+2.0V≦VIN≦28.0V IOUT=5mA - 0.05 0.10 %/V ① Line Regulation2 △VOUT △VIN・VOUT(T) VOUT(T)+2.0V≦VIN≦28.0V IOUT=13mA - 0.15 0.30 %/V ① Input Voltage V IN 2.0 - 28.0 V - Output Voltage Temperature Characteristics △VOUT △Ta・VOUT(T) IOUT=20mA Ripple Rejection Rate PSRR VIN=[VOUT(T)+2.0V]+0.5VP-PAC IOUT=20mA , f=1kHz - 50 - dB ③ Short Current I SHORT V IN=VOUT(T)+2.0V - 40 - mA ① Thermal Shutdown Detect Temperature TTSD Junction Temperature - 150 - ℃ ① Thermal Shutdown Release Temperature TTSR Junction Temperature - 125 - ℃ ① Hysteresis Width T TSD-TTSR Junction Temperature - 25 - ℃ - ■ELECTRICAL CHARACTERISTICS (Continued)

• XC6701D Series NOTE: *1: VOUT(T): Nominal output voltage *2: VOUT(E): Effective output voltage (i.e. the output voltage when “V OUT(T)+2.0V” is provided at the VIN pin while maintaining a certain IOUT value.) *3: Vdif={VIN1 {Note 5} - VOUT1 {Note 4} *4: VOUT1: In case of VOUT(T) < 3.0V, the VOUT1 is equal to 98% of the VOUT(T) when a stabilized input voltage is applied in VOUT(T)+3.0V. : In case of V OUT(T)≧3.0V, the VOUT1 is equal to 98% of the VOUT(T) when a stabilized input voltage is applied in VOUT(T)+2.0V. *5: VIN1: The input voltage when VOUT1 appears as input voltage is gradually decreased. *6: Unless otherwise stated, VIN=VOUT(T)+2.0V.

VOLTAGE (V) OUTPUT VOLTAGE（V） (2% products) DROPOUT VOLTAGE 1 (mV) IOUT=20mA DROPOUT VOLTAGE 2 (mV) IOUT=100mA VOUT Vdif1 Vdif2 VOUT(T) 1.8 1.764 1.836 550 710 2200 2700 1.9 1.862 1.938 550 710 2200 2700 2.0 1.960 2.040 450 600 1900 2600 2.1 2.058 2.142 450 600 1900 2600 2.2 2.156 2.244 390 520 1700 2200 2.3 2.254 2.346 390 520 1700 2200 2.4 2.352 2.448 390 520 1700 2200 2.5 2.450 2.550 310 450 1500 1900 2.6 2.548 2.652 310 450 1500 1900 2.7 2.646 2.754 310 450 1500 1900 2.8 2.744 2.856 310 450 1500 1900 2.9 2.842 2.958 310 450 1500 1900 3.0 2.940 3.060 260 360 1300 1700 3.1 3.038 3.162 260 360 1300 1700 3.2 3.136 3.264 260 360 1300 1700 3.3 3.234 3.366 260 360 1300 1700 3.4 3.332 3.468 260 360 1300 1700 3.5 3.430 3.570 260 360 1300 1700 3.6 3.528 3.672 260 360 1300 1700 3.7 3.626 3.774 260 360 1300 1700 3.8 3.724 3.876 260 360 1300 1700 3.9 3.822 3.978 260 360 1300 1700 4.0 3.920 4.080 220 320 1100 1500 4.1 4.018 4.182 220 320 1100 1500 4.2 4.116 4.284 220 320 1100 1500 4.3 4.214 4.386 220 320 1100 1500 4.4 4.312 4.488 220 320 1100 1500 4.5 4.410 4.590 220 320 1100 1500 4.6 4.508 4.692 220 320 1100 1500 4.7 4.606 4.794 220 320 1100 1500 4.8 4.704 4.896 220 320 1100 1500 4.9 4.802 4.998 220 320 1100 1500 5.0 4.900 5.100 190 280 1000 1300 5.1 4.998 5.202 190 280 1000 1300 5.2 5.096 5.304 190 280 1000 1300 5.3 5.194 5.406 190 280 1000 1300 5.4 5.292 5.508 190 280 1000 1300 5.5 5.390 5.610 190 280 1000 1300 5.6 5.488 5.712 190 280 1000 1300 5.7 5.586 5.814 190 280 1000 1300 5.8 5.684 5.916 190 280 1000 1300 5.9 5.782 6.018 190 280 1000 1300 6.0 5.880 6.120 190 280 1000 1300

• Voltage Chart ■ELECTRICAL CHARACTERISTICS (Continued)

VOLTAGE (V) OUTPUT VOLTAGE（V） (2% products) DROPOUT VOLTAGE 1 (mV) IOUT=20mA DROPOUT VOLTAGE 2 (mV) IOUT=100mA VOUT Vdif1 Vdif2 VOUT(T) 6.1 5.978 6.222 190 280 1000 1300 6.2 6.076 6.324 190 280 1000 1300 6.3 6.174 6.426 190 280 1000 1300 6.4 6.272 6.528 190 280 1000 1300 6.5 6.370 6.630 170 230 800 1150 6.6 6.468 6.732 170 230 800 1150 6.7 6.566 6.834 170 230 800 1150 6.8 6.664 6.936 170 230 800 1150 6.9 6.762 7.038 170 230 800 1150 7.0 6.860 7.140 170 230 800 1150 7.1 6.958 7.242 170 230 800 1150 7.2 7.056 7.344 170 230 800 1150 7.3 7.154 7.446 170 230 800 1150 7.4 7.252 7.548 170 230 800 1150 7.5 7.350 7.650 170 230 800 1150 7.6 7.448 7.752 170 230 800 1150 7.7 7.546 7.854 170 230 800 1150 7.8 7.644 7.956 170 230 800 1150 7.9 7.742 8.058 170 230 800 1150 8.0 7.840 8.160 170 230 800 1150 8.1 7.938 8.262 130 190 700 950 8.2 8.036 8.364 130 190 700 950 8.3 8.134 8.466 130 190 700 950 8.4 8.232 8.568 130 190 700 950 8.5 8.330 8.670 130 190 700 950 8.6 8.428 8.772 130 190 700 950 8.7 8.526 8.874 130 190 700 950 8.8 8.624 8.976 130 190 700 950 8.9 8.722 9.078 130 190 700 950 9.0 8.820 9.180 130 190 700 950 9.1 8.918 9.282 130 190 700 950 9.2 9.016 9.384 130 190 700 950 9.3 9.114 9.486 130 190 700 950 9.4 9.212 9.588 130 190 700 950 9.5 9.310 9.690 130 190 700 950 9.6 9.408 9.792 130 190 700 950 9.7 9.506 9.894 130 190 700 950 9.8 9.604 9.996 130 190 700 950 9.9 9.702 10.098 130 190 700 950 10.0 9.800 10.200 130 190 700 950 ■ELECTRICAL CHARACTERISTICS (Continued)

• Voltage Chart (Continued)

VOLTAGE (V) OUTPUT VOLTAGE（V） (2% products) DROPOUT VOLTAGE 1 (mV) IOUT=20mA DROPOUT VOLTAGE 2 (mV) IOUT=100mA VOUT Vdif1 Vdif2 VOUT(T) 10.1 9.898 10.302 120 170 650 850 10.2 9.996 10.404 120 170 650 850 10.3 10.094 10.506 120 170 650 850 10.4 10.192 10.608 120 170 650 850 10.5 10.290 10.710 120 170 650 850 10.6 10.388 10.812 120 170 650 850 10.7 10.486 10.914 120 170 650 850 10.8 10.584 11.016 120 170 650 850 10.9 10.682 11.118 120 170 650 850 11.0 10.780 11.220 120 170 650 850 11.1 10.878 11.322 120 170 650 850 11.2 10.976 11.424 120 170 650 850 11.3 11.074 11.526 120 170 650 850 11.4 11.172 11.628 120 170 650 850 11.5 11.270 11.730 120 170 650 850 11.6 11.368 11.832 120 170 650 850 11.7 11.466 11.934 120 170 650 850 11.8 11.564 12.036 120 170 650 850 11.9 11.662 12.138 120 170 650 850 12.0 11.760 12.240 120 170 650 850 12.1 11.858 12.342 120 170 650 850 12.2 11.956 12.444 120 170 650 850 12.3 12.054 12.546 120 170 650 850 12.4 12.152 12.648 120 170 650 850 12.5 12.250 12.750 120 170 650 850 12.6 12.348 12.852 120 170 650 850 12.7 12.446 12.954 120 170 650 850 12.8 12.544 13.056 120 170 650 850 12.9 12.642 13.158 120 170 650 850 13.0 12.740 13.260 120 170 650 850 13.1 12.838 13.362 120 170 650 850 13.2 12.936 13.464 120 170 650 850 13.3 13.034 13.566 120 170 650 850 13.4 13.132 13.668 120 170 650 850 13.5 13.230 13.770 120 170 650 850 13.6 13.328 13.872 120 170 650 850 13.7 13.426 13.974 120 170 650 850 13.8 13.524 14.076 120 170 650 850 13.9 13.622 14.178 120 170 650 850 14.0 13.720 14.280 120 170 650 850

• Voltage Chart (Continued) ■ELECTRICAL CHARACTERISTICS (Continued)

VOLTAGE (V) OUTPUT VOLTAGE（V） (2% products) DROPOUT VOLTAGE 1 (mV) IOUT=20mA DROPOUT VOLTAGE 2 (mV) IOUT=100mA VOUT Vdif1 Vdif2 VOUT(T) 14.1 13.818 14.382 120 170 650 850 14.2 13.916 14.484 120 170 650 850 14.3 14.014 14.586 120 170 650 850 14.4 14.112 14.688 120 170 650 850 14.5 14.210 14.790 120 170 650 850 14.6 14.308 14.892 120 170 650 850 14.7 14.406 14.994 120 170 650 850 14.8 14.504 15.096 120 170 650 850 14.9 14.602 15.198 120 170 650 850 15.0 14.700 15.300 120 170 650 850 15.1 14.798 15.402 120 170 650 850 15.2 14.896 15.504 120 170 650 850 15.3 14.994 15.606 120 170 650 850 15.4 15.092 15.708 120 170 650 850 15.5 15.190 15.810 120 170 650 850 15.6 15.288 15.912 120 170 650 850 15.7 15.386 16.014 120 170 650 850 15.8 15.484 16.116 120 170 650 850 15.9 15.582 16.218 120 170 650 850 16.0 15.680 16.320 120 170 650 850 16.1 15.778 16.422 120 170 650 850 16.2 15.876 16.524 120 170 650 850 16.3 15.974 16.626 120 170 650 850 16.4 16.072 16.728 120 170 650 850 16.5 16.170 16.830 120 170 650 850 16.6 16.268 16.932 120 170 650 850 16.7 16.366 17.034 120 170 650 850 16.8 16.464 17.136 120 170 650 850 16.9 16.562 17.238 120 170 650 850 17.0 16.660 17.340 120 170 650 850 17.1 16.758 17.442 120 170 650 850 17.2 16.856 17.544 120 170 650 850 17.3 16.954 17.646 120 170 650 850 17.4 17.052 17.748 120 170 650 850 17.5 17.150 17.850 120 170 650 850 17.6 17.248 17.952 120 170 650 850 17.7 17.346 18.054 120 170 650 850 17.8 17.444 18.156 120 170 650 850 17.9 17.542 18.258 120 170 650 850 18.0 17.640 18.360 120 170 650 850 ■OUTPUT VOLTAGE CHART (Continued)

• Voltage Chart (Continued)

■ OPERATIONAL EXPLANATION <Output Voltage Control> The voltage divided by resistors R1 & R2 is compared with the internal reference voltage by the error amplifier. The P-channel MOSFET, which is connected to the V OUT pin, is then driven by the subs equent output signal. The output voltage at the VOUT pin is controlled and stabilized by a system of negative feedback. The current limit circuit, short protect circuit and thermal protection circuit operate in relation to the level of output current and heat generation. Further, the IC ’s internal circuitry can be shutdown via the CE pin’s signal. <Short-Circuit Protection> The XC6701 series includes a current fold-back circuit as a short circuit protection. When the load current reaches the current limit level, the current fold-ba ck circuit operates and output voltage drops. The output voltage drops further and output current decreases. When the output pin is shorted, a current of about 30mA flows. <CE Pin> The IC’s internal circuitry can be shutdown via the signal from the CE pin with the XC6701B series. In shutdown mode, output at the VOUT pin will be pulled down by R1 and R2 to the VSS level. Note that as the XC6701B series’ operations will become unstable with the CE pin open. We s uggest that you use this IC with either a VIN voltage or a VSS voltage input at the CE pin. If this IC is used with the correct specifications for the CE pin, the operational logi c is fixed and the IC will operate normally. However, supply current may increase as a re sult of through current in the IC’s internal circuitry if a medium voltage is applied. <Thermal Shutdown> When the junction temperature of the built-in driver transistor reaches the temperature limit level (150℃ TYP.), the thermal protection circuit operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release voltage. <Minimum Operating Voltage> For the stable operation of the IC, over 2.0V of input voltage is necessary. The output voltage may not be generated normally if the input voltage is less than 2.0V. 1． For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2． Where wiring impedance is high, operations may become unstable due to the noise and/or phase lag depending on output current. Please strengthen V IN and VSS wiring in particular. 3. Phase compensation inside the IC is performed in the XC 6701 series. Therefore, an abnormal oscillation does not occur even if there is no output capacitor CL. An input capacitor C IN around 0.1μF~1.0μF between the VIN pin and the VSS pin is required for input stability. Also, the output voltage fluc tuation such as under shoot or over shoot, which occurs because of the load change can be controlled by placing the output capacitor C L around 0.1μF~1.0μF between the VOUT pin and VSS pin. The input capacitor (C IN) and the output capacitor (C L) should be placed to the IC as close as possible with a shorter wiring. 4. When the IC is operated with no load, the output voltage may increase in the high temperature beyond operating range. 5. Torex places an importance on impr oving our products and its reliability. However, by any possibility, we would request user fa il-safe design and post-aging treatment on system or equipment. ■ NOTES ON USE

• XC6701B Series ●XC6701D Series Circuit ③ Circuit ① Circuit ②
• XC6701B Series ●XC6701D Series
• XC6701B Series ●XC6701D Series ■ TEST CIRCUITS

■ TYPICAL PERFORMANCE CHARACTERISTICS （1） Output Voltage vs. Output Current XC6701B/D 182 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) VIN=2.8V VIN=3.8V VIN=4.8V VIN=VCE, CIN=CL=1.0μF (ceramic), Ta=25℃ XC6701B/D 182 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) Ta=-40℃ Ta=25℃ Ta=85℃ VIN=VCE=4.8V, CIN=CL=1.0μF (ceramic) XC6701B/D 502 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) Ta=-40℃ Ta=25℃ Ta=85℃ VIN=VCE=8.0V, CIN=CL=1.0μF (ceramic) XC6701B/D C02 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) Ta=-40℃ Ta=25℃ Ta=85℃ VIN=VCE=15.0V, CIN=CL=1.0μF (ceramic) XC6701B/D 502 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) VIN=6V VIN=7V VIN=8V VIN=VCE, CIN=CL=1.0μF (ceramic), Ta=25℃ XC6701B/D C02 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) VIN=13V VIN=14V VIN=15V VIN=VCE, CIN=CL=1.0μF (ceramic), Ta=25℃

■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （1） Output Voltage vs. Output Current (Continued) （2） Output Voltage vs. Input Voltage XC6701B/D J02 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) Ta=-40℃ Ta=25℃ Ta=85℃ VIN=VCE=21.0, CIN=CL=1.0μF (ceramic) XC6701B/D J02 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 0 50 100 150 200 250 300 Output Current : I OUT (mA) Output Voltage : VOUT (V) VIN=19V VIN=20V VIN=21V VIN=VCE, CIN=CL=1.0μF (ceramic), Ta=25℃ XC6701B/D 182 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.8 1.8 2.8 3.8 Input Voltage : VIN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic), Ta=25℃ XC6701B/D 182 1.5 1.6 1.7 1.8 1.9 2.0 2.1 4 8 12 16 20 24 28 Input Voltage : VIN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic),Ta=25℃ XC6701B/D 502 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 Input Voltage : V IN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic), Ta=25℃ XC6701B/D 502 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 8 1 21 62 02 42 8 Input Voltage : V IN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic), Ta=25℃

（3） Dropout Voltage vs. Output Current ■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （2） Output Voltage vs. Input Voltage (Continued) XC6701B/D 182 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 Output Current : IOUT (mA) Dropout Voltage : VDIF (V) Ta=85℃ Ta=25℃ Ta=-40℃ VIN=VCE, CIN=CL=1.0μF(ceramic) XC6701B/D 502 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 Output Current : IOUT (mA) Dropout Voltage : VDIF (V) Ta=85℃ Ta=25℃ Ta=-40℃ VIN=VCE, CIN=CL=1.0μF(ceramic) XC6701B/D C02 9.0 10.0 11.0 12.0 13.0 14.0 15.0 10 11 12 13 14 Input Voltage : V IN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic), Ta=25℃ XC6701B/D C02 9.0 10.0 11.0 12.0 13.0 14.0 15.0 14 16 18 20 22 24 26 28 Input Voltage : V IN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic), Ta=25℃ XC6701B/D J02 15.0 16.0 17.0 18.0 19.0 20.0 21.0 16 17 18 19 20 Input Voltage : V IN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic), Ta=25℃ XC6701B/D J02 15.0 16.0 17.0 18.0 19.0 20.0 21.0 20 22 24 26 28 Input Voltage : V IN (V) Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=30mA VIN=VCE, CIN=CL=1.0μF(ceramic), Ta=25℃

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 Output Current : I OUT (mA) Dropout Voltage : VDIF (V) Ta=85℃ Ta=25℃ Ta=-40℃ VIN=VCE, CIN=CL=1.0μF(ceramic) XC6701B/D C02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 Output Current : IOUT (mA) Dropout Voltage : VDIF (V) Ta=85℃ Ta=25℃ Ta=-40℃ VIN=VCE, CIN=CL=1.0μF(ceramic) XC6701B/D 182 0 4 8 1 21 62 02 42 8 Input Voltage : VIN (V) Supply Current : ISS (uA) Ta=85℃ Ta=25℃ Ta=-40℃ XC6701B/D 502 0 4 8 1 21 62 02 42 8 Input Voltage : VIN (V) Supply Current : ISS (uA) Ta=85℃ Ta=25℃ Ta=-40℃ XC6701B/D 182 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) Supply Current : ISS (uA) VIN=3.8V XC6701B/D 502 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) Supply Current : ISS (uA) VIN=7.0V ■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （3） Dropout Voltage vs. Output Current (Continued) （4） Supply Current vs. Input Voltage

Input Voltage : VIN (V) Supply Current : ISS (uA) Ta=85℃ Ta=25℃ Ta=-40℃ XC6701B/D J02 0 4 8 1 21 62 02 42 8 Input Voltage : VIN (V) Supply Current : ISS (uA) Ta=85℃ Ta=25℃ Ta=-40℃ XC6701B/D C02 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) Supply Current : ISS (uA) VIN=14.0V XC6701B/D J02 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) Supply Current : ISS (uA) VIN=20.0V （4） Supply Current vs. Input Voltage (Continued) ■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6701B/D 182 1.60 1.65 1.70 1.75 1.80 1.85 1.90 1.95 2.00 -50 -25 0 25 50 75 100 Ambient Temperature : Ta (℃） Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=20mA VIN=VCE, CIN=CL=1.0μF(ceramic) XC6701B/D 502 4.80 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 -50 -25 0 25 50 75 100 Ambient Temperature : Ta (℃） Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=20mA VIN=VCE, CIN=CL=1.0μF(ceramic) （5） Out put Voltage vs. Ambient Temperature

■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （5）Output Voltage vs. Ambient Temperature (Continued) XC6701B/D C02 11.5 11.6 11.7 11.8 11.9 12.0 12.1 12.2 12.3 12.4 12.5 -50 -25 0 25 50 75 100 Ambient Temperature : Ta (℃） Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=20mA VIN=VCE, CIN=CL=1.0μF(ceramic) XC6701B/D J02 17.0 17.2 17.4 17.6 17.8 18.0 18.2 18.4 18.6 18.8 19.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta (℃） Output Voltage : VOUT (V) IOUT=1mA IOUT=10mA IOUT=20mA VIN=VCE, CIN=CL=1.0μF(ceramic) XC6701B/D 332 1.3 2.3 3.3 4.3 5.3 6.3 7.3 Time (1ms/div) Input Voltage: VIN (V) 3.26 3.28 3.30 3.32 3.34 3.36 3.38 Output Voltage: VOUT (V) Input Voltage IOUT=1mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D 332 1.3 2.3 3.3 4.3 5.3 6.3 7.3 Time (1ms/div) Input Voltage: VIN (V) 3.26 3.28 3.30 3.32 3.34 3.36 3.38 Output Voltage: VOUT (V) Input Voltage IOUT=30mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D 502 Time (1ms/div) Input Voltage: VIN (V) 4.96 4.98 5.00 5.02 5.04 5.06 5.08 Output Voltage: VOUT (V) Input Voltage IOUT=1mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D 502 Time (1ms/div) Input Voltage: VIN (V) 4.96 4.98 5.00 5.02 5.04 5.06 5.08 Output Voltage: VOUT (V) Input Voltage IOUT=30mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage （6） Input Transient Response

■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （6） Input Transient Response (Continued) （7） Load Transient Response XC6701B/D C02 Time (1ms/div) Input Voltage: VIN (V) 11.96 11.98 12.00 12.02 12.04 12.06 12.08 Output Voltage: VOUT (V) Input Voltage IOUT=1mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D C02 Time (1ms/div) Input Voltage: VIN (V) 11.96 11.98 12.00 12.02 12.04 12.06 12.08 Output Voltage: VOUT (V) Input Voltage IOUT=30mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D J02 Time (1ms/div) Input Voltage: VIN (V) 17.94 17.97 18.00 18.03 18.06 18.09 18.12 Output Voltage: VOUT (V) Input Voltage IOUT=1mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D J02 Time (1ms/div) Input Voltage: VIN (V) 17.94 17.97 18.00 18.03 18.06 18.09 18.12 Output Voltage: VOUT (V) Input Voltage IOUT=30mA, tr=tf=5μs CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D 332 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 Time (1ms/div) Output Voltage: VOUT (V) 120 150 Output Current: I OUT (mA) Output Current VIN=5.3V, tr=tf=5μs CIN=CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D 502 4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 Time (1ms/div) Output Voltage: VOUT (V) 120 150 Output Current: I OUT (mA) Output Current VIN=7.0V, tr=tf=5μs CIN=CL=1.0μF (ceramic), Ta=25℃ Output Voltage

■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （7） Load Transient Response (Continued) XC6701B 332 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=5.3V, tr=5μs IOU T=30mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage XC6701B 332 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=5.3V, tr=5μs IOU T=1mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage XC6701B 502 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=7.0V, tr=5μs IOUT=30mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage XC6701B 502 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=7.0V, tr=5μs IOUT=1mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage XC6701B/D C02 10.6 10.8 11.0 11.2 11.4 11.6 11.8 12.0 12.2 12.4 12.6 Time (1ms/div) Output Voltage: VOUT (V) 120 150 Output Current: I OUT (mA) Output Current VIN=14.0V, tr=tf=5μs CIN=CL=1.0μF (ceramic), Ta=25℃ Output Voltage XC6701B/D J02 16.6 16.8 17.0 17.2 17.4 17.6 17.8 18.0 18.2 18.4 18.6 Time (1ms/div) Output Voltage: VOUT (V) 120 150 Output Current: I OUT (mA) Output Current VIN=20.0V, tr=tf=5μs CIN=CL=1.0μF (ceramic), Ta=25℃ Output Voltage （8） Rising Response Time

-15 -10 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=14.0V, tr=5μs IOUT=1mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage XC6701B C02 -15 -10 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=14.0V, tr=5μs IOUT=30mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage XC6701B J02 -20 -16 -12 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=20.0V, tr=5μs IOUT=1mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage XC6701B J02 -20 -16 -12 Time (1ms/div) Input Voltage: VIN (V) Output Voltage: VOUT (V) VIN=20.0V, tr=5μs IOUT=30mA, CL=1μF (ceramic), Ta=25℃ Input Voltage Output Voltage （9） CE Rising Response Time （8） Rising Response Time (Continued) ■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Output Voltage XC6701B 332 Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=5.3V, tr=5μs IOU T=1mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage XC6701B 332 Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=5.3V, tr=5μs IOUT=30mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage

Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=7.0V, tr=5μs IOUT=1mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage XC6701B 502 Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=7.0V, tr=5μs IOU T=30mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage XC6701B C02 -15 -10 Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=14.0V, tr=5μs IOUT=1mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage XC6701B C02 -15 -10 Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=14.0V, tr=5μs IOUT=30mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage XC6701B J02 -20 -16 -12 Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=20.0V, tr=5μs IOU T=1mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage XC6701B J02 -20 -16 -12 Time (1ms/div) CEInput Voltage: VCE (V) Output Voltage: VOUT (V) VIN=20.0V, tr=5μs IOU T=30mA, CL=1μF (ceramic), Ta=25℃ CE Input Voltage Output Voltage ■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （9） CE Rising Response Time (Continued)

■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （10） Ripple Rejection Rate XC6701B/D 332 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=5.3Vdc+0.5Vp-p, IOUT=1mA CL=1μF(ceramic),Ta=25℃ XC6701B/D 332 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=5.3Vdc+0.5Vp-p, IOUT=30mA CL=1μF(ceramic),Ta=25℃ XC6701B/D 502 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=7.0Vdc+0.5Vp-p, IOUT=1mA CL=1μF(ceramic),Ta=25℃ XC6701B/D 502 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=7.0Vdc+0.5Vp-p, IOUT=30mA CL=1μF(ceramic),Ta=25℃ XC6701B/D C02 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=14.0Vdc+0.5Vp-p, IOUT=1mA CL=1μF(ceramic),Ta=25℃ XC6701B/D C02 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=14.0Vdc+0.5Vp-p, IOUT=30mA CL=1μF(ceramic),Ta=25℃

■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （10） Ripple Rejection Rate (Continued) XC6701B/D J02 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=14.0Vdc+0.5Vp-p, IOUT=1mA CL=1μF(ceramic),Ta=25℃ XC6701B/D J02 0.01 0.1 1 10 100 Ripple Frequency: f (kHz) Ripple Rejection Rate: PSRR (dB) VIN=VCE=14.0Vdc+0.5Vp-p, IOUT=30mA CL=1μF(ceramic),Ta=25℃

• SOT-25
• USP-6C ■PACKAGING INFORMATION
• USP-6C Reference Pattern Layout
• USP-6C Reference Metal Mask Design 2.4 3 4 0.45 1.0 0.050.05 0.45 0.35 2.3 0.35 0.8 0.150.15 Unit :mm Unit :mm Unit : mm Unit : mm

• SOT-89-5
• SOT-223
• TO-252 ■PACKAGING INFORMATION (Continued)
• SOT-89 2.5±0.1 4.0±0.25 1.5±0.1 (0.1) (0.4)1.0±0.2 3.5±0.2 7.0±0.3 1.68 +0.12 -0.13 0.91MIN Unit :mm Unit :mm Unit :mm Unit :mm

• SOT-25 Power Dissipation Board Mount (Tj max = 125 ℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 600 85 240 166.67 Pd-Ta特性グラフ 100 200 300 400 500 600 700 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） ■PACKAGING INFORMATION (Continued) Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd vs. Ta Ambient Temperature Ta (℃) Power Dissipation Pd (mW) 評価基板レイアウト（単位：mm）

• SOT-89-5 Power Dissipation Board Mount (Tj max = 125 ℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1300 85 520 76.92 Pd-Ta特性グラフ 200 400 600 800 1000 1200 1400 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） て ■PACKAGING INFORMATION (Continued) Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd vs. Ta Ambient Temperature Ta (℃) Power Dissipation Pd (mW)

• USP-6C Power Dissipation Board Mount (Tj max = 125 ℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100.00 Pd-Ta特性グラフ 200 400 600 800 1000 1200 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） て Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd vs. Ta Ambient Temperature Ta (℃) Power Dissipation Pd (mW) ■PACKAGING INFORMATION (Continued)

• SOT-223 Power Dissipation Board Mount (Tj max = 125 ℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1500 85 600 66.67 Pd-Ta特性グラフ 200 400 600 800 1000 1200 1400 1600 25 45 65 85 105 125 周辺温度Ta（℃） 許容損失Pd（mW） Power dissipation data for the SOT-223 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd vs. Ta Ambient Temperature Ta (℃) Power Dissipation Pd (mW) ■PACKAGING INFORMATION (Continued)

• TO-252 Power Dissipation Power dissipation data for the TO-252 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1800 85 720 55.56 Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Pd vs Ta 200 400 600 800 1000 1200 1400 1600 1800 2000 25 45 65 85 105 125 Ambient Temperature Ta（℃） Power Dissipation Pd（mW） ■PACKAGING INFORMATION (Continued)

• SOT-89 Power Dissipation Power dissipation data for the SOT-89 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100.00 ■PACKAGING INFORMATION (Continued) 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Pd vs Ta 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient Temperature Ta（℃） Power Dissipation Pd（mW）

VOLTAGE (V) PRODUCT SERIES 0 1.8～3.0 1 3.1～6.0 2 6.1～9.0 3 9.1～12.0 A 12.1～15.0 B B 15.1～18.0 4 1.8～3.0 5 3.1～6.0 6 6.1～9.0 7 9.1～12.0 C 12.1～15.0 D D 15.1～18.0 MSRK SERIAL PRODUCT SERIES E 00* XC6701S00*** F 01* XC6701S01*** H 02* XC6701S02*** K 03* XC6701S03*** L 04* XC6701S04*** M 05* XC6701S05*** N 06* XC6701S06*** P 07* XC6701S07*** 8 08* XC6701S08*** 9 09* XC6701S09*** ■MARKING RULE ① represents product series ② ③ ④ ⑤ 2 3 123 ① ② ③ ④ ⑤ 524 123 123 ② represents type of regulators and output voltage Custom products : Represents last 2,3 digits of registered serial number.

MARK OUTPUT VOLTAGE（V） MARK SERIAL PRODUCT SERIES 1 001 XC6701S001** ③ represents output voltage ②③ ①1 1 3 ① ② ③ TO-252 USP-6C ■MARKING RULE (Continued) Custom products：Represents last 1 digits of registered serial number. 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) ④⑤ represents production lot number (G, I, J, O, Q, W excluded) *No character inversion used.

1. The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.