XC6351_V01 TOREX | Alldatasheet

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Charge Pump Voltage Inverter IC ■ GENERAL DESCRIPTION The XC6351A series are charge pump voltage inverter ICs that have 4 MOSFETs built in. Since highly efficient negative voltages can be generated with only 2 external capacitors connected, GaAs bias power supplies & OpAmp's negative power supplies etc., can be easily accommodated on a standard PCB. A mini-molded, 6 pin, SOT-26 and USP-6B packages provides for space saving and makes high density mounting possible. Low power consumption and high efficiency make this series perfect for use with battery operated applications. Since the IC's operations stop when output is shutdown via the CE (chip enable) function, total power consumption reduction is possible in applications which use this IC. ■TYPICAL APPLICATION CIRCUIT ■FEATURES Operating Voltage Range : 1.2V ~ 5.0V Oscillation Frequency : 120kHz : 35kHz ( custom ) Low Supply Current : 310μA ( TYP. ) : 100 μA (35kHz custom TYP.) High Efficiency : 90% (TYP.) ( RL = 2kΩ) Stand-by Current : 2.0 μA (MAX.) CE(Chip Enable) Function Operating Ambient Temperature : -30°C ～ +80°C Packages : SOT-26 ,USP-6B Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL PERFORMANCE CHARACTERISTICS ETR0801_004 ■APPLICATIONS

  • Negative power supplies
  • Power supplies for Opamp
  • Cellular and portable phones
  • Miniature LCD panels
  • PDAs
  • Various battery powered systems

DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION ①②③ Oscillation Frequency 120 120kHz 035 35kHz (custom) ④⑤-⑥ Packages Taping Type MR SOT-26(3,000pcs/Reel) MR-G SOT-26(3,000pcs/Reel) DR USP-6B(3,000pcs/Reel) DR-G USP-6B(3,000pcs/Reel) PIN NUMBER SYMBOL FUNCTION SOT-26 USP-6B 1 6 GND Ground 2 5 CE/ Chip Enable (Low Active) 3 4 C1+ External Capacitor +Pin 4 3 V OUT Reverse Output 5 2 V IN Power Supply 6 1 C1- External Capacitor -Pin CE/PIN STATUS H Stand-by L Active ■BLOCK DIAGRAM Note: 1. In operation, the following conditions will be repeated alternately: P1 & N3 ON: N2 & N4 OFF P1 & N3 OFF: N2 & N4 ON 2. In standby mode, P1, N3 & N4 will be ON and N2 will be OFF. The output pin V OUT will be connected to GND. C1+ C1- VIN CE/ BufferOscillator Chip Enable GND P1 N2 N4N3 VOUT ■PRODUCT CLASSIFICATION

  • Ordering Information XC6351A ①②③④⑤-⑥(*1) (*1) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. ■PIN CONFIGURATION GND CE C1+ C1- VIN VOUT *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V IN (No. 2) pin. ■PIN FUNCTIOS ASSIGNMENT ■PIN ASSIGNMENT

PARAMETER SYMBOL RATINGS UNITS VIN Input Voltage V IN 6.0 V VOUT Pin Voltage V OUT -6～0.3 V C1+ Pin Voltage C1+ -0.3～VIN + 0.3 V C1- Pin Voltage C1- VOUT - 0.3～0.3 V CE/ Pin Voltage CE/ -0.3～VIN + 0.3 V VOUT Pin Current IOUT 50 mA Power Dissipation SOT-26 Pd 150 mW 600 (40mm x 40mm Standard board ) (*1) USP-6B 100 1000 (40mm x 40mm Standard board ) (*1) Operating Temperature Range Topr -30～＋80 ℃ Storage Temperature Range Tstg -40～＋125 ℃ PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Supply Current I DD - 310 520 μA 1 Operating Voltage Range V IN RL＝5kΩ 1.2 - 5.0 V 2 Oscillation Frequency f OSC 75 120 192 kHz 1 Power Transition Efficiency EFFI RL＝2kΩ - 90 - % 2 Voltage Transition Efficiency V EFFI RL＝∞ 95 - - % 2 Output Impedance R OUT RL＝5kΩ - 45 90 Ω 2 Stand -by Current I STB CE/＝VIN - - 2.0 μA 3 CE/ 'H' Level Voltage V CEH 0.9 - - V 3 CE/ 'L' Level Voltage V CEL - - 0.25 V 3 PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Supply Current I DD - 100 170 μA 1 Operating Voltage Range V IN RL＝5kΩ 1.2 - 5.0 V 2 Oscillation Frequency f OSC 21 35 56 kHz 1 Power Transition Efficiency EFFI RL＝2kΩ - 90 - % 2 Voltage Transition Efficiency VEFFI RL＝∞ 95 - - % 2 Output Impedance R OUT RL＝5kΩ - 45 90 Ω 2 Stand -by Current I STB CE/＝VIN - - 2.0 μA 3 CE/ 'H' Level Voltage V CEH 0.9 - - V 3 CE/ 'L' Level Voltage V CEL - - 0.25 V 3 ■ABSOLUTE MAXIMUM RATINGS Ta = 25℃ ■ELECTRICAL CHARACTERISTICS fosc＝35kHz, Ta=25℃ Measuring Conditions: Unless otherwise stated, VIN = 5.0V, CE/ = 0V Each rating voltage is based on the GND (*1) This is a reference data taken by using the test board. Please see the power dissipation page for the mounting condition. fosc＝120kHz, Ta=25℃ Measuring Conditions: Unless otherwise stated, VIN = 5.0V, CE/ = 0V

■TEST CIRCUITS External components: CIN = 1μF (ceramic capacitor) C1 = C2 = 1μF (ceramic capacitor)* * With the custom 35kHz frequency, C1 = C2 = 3.3μF

■ NOTES ON USE ■ TYPICAL APPLICATION CIRCUIT

  • Standard Circuit External components: CIN = 1μF (ceramic capacitor) C1 = C2 = 1μF (ceramic capacitor)* * With the custom 35kHz frequency, C1 = C2 = 3.3 μF 1. Please use the IC & external components: within the s pecified electrical characteri stics range and ensure that absolute maximum ratings are not exceeded. 2. For C1 & C2, please use a capacitor with as small an ESR value as possible. 3. In order to reduce impedance between the IC's input pin and the power supply, we recommend that a capacitor (C IN) be connected to the input side. 4. If an external power supply is applied to the output pin in order to have V OUT connected to GND during standby, large current flows through the IC are a possibility. Further, do not use a capacito r at C2 that has a large capacitance value.

■TYPICAL PERFORMANCE CHARACTERISTICS (1) Output Voltage vs. Output Current (2) Efficiency vs. Output Current (3) Oscillation Frequency vs. Ambient Temperature (4) Oscillation Frequency vs. Input Voltage fosc fosc

2.4 1.0 0.7 0.95 0.95 ■PACKAGING INFORMATION

  • SOT-26
  • USP-6B
  • USP-6B Reference Pattern Layout
  • USP-6B Reference Metal Mask Design Unit : mm Unit : mm
  • SOT-26 Reference Pattern Layout
  • SOT-26 Power Dissipation (40mm x 40mm Standard board) Power dissipation data for the SOT-26 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient： Natural convection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material： Glass Epoxy (FR-4) Thickness： 1.6mm Through-hole： 4 x 0.8 Diameter Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 600 166.6780 270 100 200 300 400 500 600 700 25 45 65 85 105 125 Power Dissipation Pd (mW) Ambient Temperature Ta (℃) Pd vs. T a
  • USP-6B Power Dissipation (40mm x 40mm Standard board) Power dissipation data for theUSP-6B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient： Natural conv ection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material： Glass Epoxy (FR-4) Thickness： 1.6mm Through-hole： 4 x 0.8 Diameter Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 100.0080 450 200 400 600 800 1000 1200 25 45 65 85 105 125 Power Dissipation Pd (mW) Ambient Temperature Ta ( ℃) Pd vs. T a

⑤⑥ ④ ②③ ①1 MARK OSCILLATION FREQUENCY PRODUCT SERIES② ③ 0 3 35kHz XC6351A035MR-G 1 2 120kHz XC6351A120MR-G MARK PRODUCT SERIES A XC6351AxxxMx-G MARK PRODUCT SERIES ① ② ③ 5 1 A XC6351AxxxDR-G MARK OSCILLATION FREQUENCY PRODUCT SERIES④ ⑤ 0 3 35kHz XC6351A035DR-G 1 2 120kHz XC6351A120DR-G ■MARKING RULE ① represents product series ②,③ represents oscillation frequency ④ represents production lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) ①,②,③ represents product series ④,⑤ represents oscillation frequency ⑥ represents production lot number 0 to 9,A to Z repeated (G, I, J, O, Q, W excluded) Note: No character inversion used.

  • SOT-26
  • USP-6B ① ② ③ ④ 123 654 SOT-26 (TOP VIEW)
  1. The product and product specific ations contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives befor e use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation a nd characteristics of our products. We neither make warranties or repres entations with respect to the accuracy or completeness of the information contained in this dat asheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical fa cilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to im prove the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their des igns, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD.