XC6201_V01 TOREX | Alldatasheet

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Positive Voltage Regulators ■GENERAL DESCRIPTION The XC6201 series are highly precise, low power consumption, positive voltage regulators manufactured using CMOS and laser trimming technologies. The series provides large currents with a significantly small dropout voltage. The XC6201 consists of a current limiter circuit, a driver transistor, a precision reference voltage and an error amplifier. Output voltage is selectable in 0.1V steps between 1.3V ~ 6.0V. SOT-25, SOT-89 and USP-6B packages are available. ■APPLICATIONS

  • Smart phones / Mobile phones
  • Portable game consoles
  • Digital still cameras / Camcorders
  • Digital audio equipment
  • Reference voltage sources
  • Multi-function power supplies ■TYPICAL APPLICATION CIRCUIT ■FEATURES Maximum Output Current : 250mA (TYP.) Dropout Voltage : 0.16V @ 100mA : 0.40V @ 200mA Maximum Operating Voltage : 10V Output Voltage Range : 1.3V ~ 6.0V (0.1V increments) Fixed Voltage Accuracy : ±1% (VOUT(T)>2.0V) ±2% Low Power Consumption : 2.0 μA (TYP.) Operating Ambient Temperature : -40℃ ~ 85 ℃ Packages : SOT-25, SOT-89 USP-6B Environmentally Friendly : EU RoHS Compliant, Pb Free Tantalum or Ceramic Capacitor compatible ■TYPICAL PERFORMANCE CHARACTERISTICS XC6201P332 ETR0301-007
  • Supply Current vs. Input Voltage

DESIGNATOR ITEM SYMBOL DESCRIPTION ① Product Number 01 - ② Type of Regulator P 3-pin regulator ③④ Output Voltage 13～60 e.g. 30:3.0V 50:5.0V ⑤ Output Voltage Accuracy 1 ±1% 2 ±2% ⑥⑦-⑧ Packages (Order Unit) MR SOT-25 (3,000 pcs/Reel) MR-G SOT-25 (3,000 pcs/Reel) PR SOT-89 (1,000 pcs/Reel) PR-G SOT-89 (1,000 pcs/Reel) DR USP-6B (3,000 pcs/Reel) DR-G USP-6B (3,000 pcs/Reel) ■PRODUCT CLASSIFICATION

  • Ordering Information X C 6 2 0 1 P ③④⑤⑥⑦-⑧(*1) ① ② (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. * +1% accuracy can be set at V OUT(T) > 2.0V. ■BLOCK DIAGRAM

3, 4 － 2,4,6 NC No Connection PARAMETER SYMBOL RATINGS UNITS Input Voltage V IN 12.0 V Output Current I OUT 500 mA Output Voltage V OUT VSS-0.3～VIN+0.3 V Power Dissipation SOT-25 Pd 250 mW SOT-89 500 USP-6B 120 Operating Temperature Topr -40～+85 ℃ Storage Temperature Tstg -55～+125 ℃ ■PIN CONFIGURATION ■PIN ASSIGNMENT *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS (No.5) pin. NC VSS NC VIN NC VOUT ■ABSOLUTE MAXIMUM RATINGS Ta = 25℃

PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Output Voltage VOUT(E) (*2) VIN=2.3V IOUT=10mA 1.274 1.300 1.326 V ② Maximum Output Current I OUTmax VIN=2.3V VOUT(E)≧1.17V 60 - - mA ② Load Regulation △VOUT VIN=2.3V 1mA≦IOUT≦30mA - 10 30 mV ② Dropout Voltage (*3) Vdif1 I OUT=30mA - 200 600 mV ② Vdif2 I OUT=60mA - 500 810 Supply Current I SS V IN=2.3V - 2.0 5.0 μA ① Line Regulation △VOUT △VIN･△VOUT IOUT=10mA Input Voltage V IN 1.8 - 10 V - Output Voltage Temperature Characteristics △VOUT IOUT=40mA PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Output Voltage VOUT(E) (*2) VIN=2.8V IOUT=40mA 1.764 1.800 1.836 V ② Maximum Output Current I OUTmax VIN=2.8V VOUT(E)≧1.62V 80 - - mA ② Load Regulation △VOUT VIN=2.8V 1mA≦IOUT≦40mA - 10 30 mV ② Dropout Voltage (*3) Vdif1 I OUT=40mA - 200 370 mV ② Vdif2 I OUT=80mA - 450 710 Supply Current I SS V IN=2.8V - 2.0 5.0 μA ① Line Regulation △VOUT △VIN･△VOUT IOUT=40mA Input Voltage VIN 1.8 - 10 V - Output Voltage Temperature Characteristics △VOUT △Topr･△VOUT IOUT=40mA PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Output Voltage VOUT(E) (*2) VIN=3.7V IOUT=40mA 2.646 2.700 2.754 V ② Maximum Output Current I OUTmax VIN=3.7V VOUT(E)≧2.43V 100 - - mA ② Load Regulation △VOUT VIN=3.7V 1mA≦IOUT≦60mA - 15 40 mV ② Dropout Voltage (*3) Vdif1 I OUT=60mA - 200 370 mV ② Vdif2 I OUT=120mA - 450 710 Supply Current I SS V IN=3.7V - 2.0 5.0 μA ① Line Regulation △VOUT △VIN･△VOUT IOUT=40mA Input Voltage V IN 1.8 - 10 V - Output Voltage Temperature Characteristics △VOUT △Topr･△VOUT IOUT=40mA ■ELECTRICAL CHARACTERISTICS XC6201P132 VOUT(T)=1.3V (*1) Ta=25℃ XC6201P182 VOUT(T)=1.8V (*1) Ta=25℃ XC6201P272 VOUT(T)=2.7V (*1) Ta=25℃

PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Output Voltage VOUT(E) (*2) VIN=4.3V IOUT=40mA 3.234 3.300 3.366 V ② Maximum Output Current I OUTmax VIN=4.3V VOUT(E)≧2.97V 150 - - mA ② Load Regulation △VOUT VIN=4.3V 1mA≦IOUT≦80mA - 20 50 mV ② Dropout Voltage (*3) Vdif1 I OUT=80mA - 200 360 mV ② Vdif2 I OUT=160mA - 450 700 Supply Current I SS V IN=4.3V - 2.0 5.0 μA ① Line Regulation △VOUT △VIN･△VOUT IOUT=40mA Input Voltage V IN 1.8 - 10 V - Output Voltage Temperature Characteristics △VOUT △Topr･△VOUT IOUT=40mA PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS CIRCUIT Output Voltage VOUT(E) (*2) VIN=6.0V IOUT=40mA 4.900 5.000 5.100 V ② Maximum Output Current I OUTmax VIN=6.0V VOUT(E)≧4.57V 200 - - mA ② Load Regulation △VOUT VIN=6.0V 1mA≦IOUT≦100mA - 30 70 mV ② Dropout Voltage (*3) Vdif1 I OUT=100mA - 160 340 mV ② Vdif2 I OUT=200mA - 400 600 Supply Current I SS V IN=6.0V - 2.0 6.0 μA ① Line Regulation △VOUT △VIN･△VOUT IOUT=40mA Input Voltage V IN 1.8 - 10 V - Output Voltage Temperature Characteristics △VOUT △Topr･△VOUT IOUT=40mA NOTE: *1: VOUT(T) = Nominal output voltage. *2: VOUT(E) = Effective output voltage (i.e. the output voltage when “VOUT(T)+1.0V” is provided while maintaining a certain I OUT value). *3: Vdif = (VIN1- VOUT1) VIN1 :An Input Voltage when VOUT1 appears as the input voltage is gradually decreased. VOUT1 : A voltage equal to 98% of the output voltage when a stabilized (VOUT(T) + 1.0V) is input. XC6201P332 VOUT(T)=3.3V (*1) Ta=25℃ XC6201P502 VOUT(T)=5.0V (*1) Ta=25℃ ■ELECTRICAL CHARACTERISTICS (Continued)

Circuit ① : Supply Current ■TEST CIRCUITS Circuit ② : Output Voltage, Oscillation, Line Regulation, Dropout Voltage, Load Regulation

OUTPUT VOLTAGE CIN CL (TANTALUM) CL (LOW ESR) ■OPERATIONAL EXPLANATION With the XC6201 series regulator, in order to ensure the stabilized output voltage, we suggest that an output capacitor (CL) of 1μF or more be connected between the output pin (VOUT) and the VSS pin. For using low ESR capacitor (e.g. ceramic capacitors), please make sure that the output voltage is more than 1.7V. When the output voltage is from 1.3V to 1.6V, the output capacitor should be a tantalum capacitor with a capacitance of 2.2μF. We also suggest an input capacitor (CIN) should be connected between the VIN and the VSS in order to stabilize input power source. VIN=1.8V~10V,VOUT=1.7~6.0V CIN=1.0μF(Ceramic),CL=1.0μF(ceramic) (Tantalum) (Tantalum)

  1. Please use this IC within the stated absolute maximum ratings. The IC is liable to malfunction should the ratings be exceeded. When a voltage higher than the VIN flows to the VOUT like when using two power supplies, please connect a Schottky barrier diode between the VOUT and the VIN and do not exceed the VOUT rating. 2. An oscillation may occur by the impedance between a power supply and the input of the IC. Where the impedance is 10Ωor more, please use an input capacitor (C IN) of at least 1 μF. In case of high output current, operation can be stabilized by increasing the input capacitor value. Also an oscillation may occur if the input capacitor value is smaller than the input impedance when the output capacitance (CL) is large. In such cases, operations can be stabilized by either increasing the input capacitor value or reducing the output capacitor value. 3. Please ensure that output current (I OUT) is less than Pd / (V IN - VOUT) and do not exceed the rated power dissipation value (Pd) of the package. ■ NOTE ON USE

■TYPICAL PERFORMANCE CHARACTERISTICS (1) Output Voltage vs. Output Current

(2) Output Voltage vs. Input Voltage ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P132 XC6201P132 XC6201P182 XC6201P182 XC6201P272 XC6201P272

(2) Output Voltage vs. Input Voltage (Continued) ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P332 XC6201P332 XC6201P502 XC6201P502

(3) Dropout Voltage vs. Output Current ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P132 XC6201P182 XC6201P272 XC6201P332 XC6201P502

(4) Supply Current vs. Input Voltage ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P132 XC6201P132 XC6201P182

(4) Supply Current vs. Input Voltage (Continued) ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P332

(5) Output Voltage vs. Ambient Temperature ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(6) Supply Current vs. Ambient Temperature ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(7) Input Transient Response ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P132 XC6201P182 XC6201P272 XC6201P332 XC6201P502 Time (1ms/div) Time (1ms/div) Time (1ms/div) Time (1ms/div) Time (1ms/div)

(8) Load Transient Response ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P132 XC6201P182 XC6201P272 XC6201P332 XC6201P502 Time (2ms/div) Time (2ms/div) Time (2ms/div) Time (2ms/div) Time (2ms/div)

(9) Ripple Rejection Rate (10) Output Noise Density ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6201P132 XC6201P182 XC6201P272 XC6201P332 XC6201P502XC6201P502 XC6201P302

2.4 1.0 0.7 0.95 0.95 4.4 1.45 0.85 0.8 1.51.5 0.80.8 1.2 1.4 ■PACKAGING INFORMATION

  • SOT-25
  • SOT-89 1 3 2.9±0.2 0.4 +0.1 -0.05 1.6 +0.2 -0.1 1.9±0.2 2.8±0.2 1.1±0.1 1.3MAX 0.15 +0.1 -0.05 0.2MIN 0～0.1 5 4 (0.95) Unit : mm Unit : mm
  • SOT-25 Reference Pattern Layout
  • SOT-89 Reference Pattern Layout

■PACKAGING INFORMATION (Continued)

  • USP-6B Reference Pattern Layout ●USP-6B Reference Metal Mask Design
  • USP-6B Unit : mm
  • SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient： Natural conv ection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material： Glass Epoxy (FR-4) Thickness： 1.6mm Through-hole： 4 x 0.8 Diameter Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 600 166.6785 240 100 200 300 400 500 600 700 25 45 65 85 105 125 Power Dissipation Pd (mW) Ambient Temperature Ta (℃) Pd vs. T a 40.0 2.54 1.4 28.9
  • SOT-89 Power Dissipation Power dissipation data for the SOT-89 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient： Natural conv ection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material： Glass Epoxy (FR-4) Thickness： 1.6mm Through-hole： 5 x 0.8 Diameter Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 100.0085 400 200 400 600 800 1000 1200 25 45 65 85 105 125 Power Dissipation Pd (mW Ambient Temperature Ta ( ℃) Pd vs T a 28.9 40.02.5
  • USP-6B Power Dissipation Power dissipation data for theUSP-6B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient： Natural conv ection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material： Glass Epoxy (FR-4) Thickness： 1.6mm Through-hole： 4 x 0.8 Diameter Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 100.0085 400 200 400 600 800 1000 1200 25 45 65 85 105 125 Power Dissipation Pd (mW) Ambient Temperature Ta ( ℃) Pd vs. T a 40.02.5 28.9

1 XC6201xxxxxx

MARK PRODUCT SERIES Voltage= 0.1 ~ 3.0V Voltage= 3.1 ~ 6.0V 5 6 XC6201P xxxxx 8 9 XC6201TxxxPx MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) ■MARKING RULE

  • SOT-89, SOT-25 ① represents the product series ② represents type of regulator ③ represents output voltage ④ represents assembly lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) 123 S O T - 8 9 (TOP VIEW) ① ② ③ ④ 123 SOT-25 (TOP VIEW)

P 3pin Regulator XC6201PxxxDx T V IN=7V(Rated) XC6201TxxxDx MARK VOLTAGE (V) PRODUCT SERIES ④ ⑤ 3 3 3.3 XC6201x33xDx 5 0 5.0 XC6201x50xDx

  • USP-6B ①② represents product series ③ represents type of regulator ④⑤ represents output voltage ■MARKING RULE (Continued) USP-6B (TOP VIEW) ⑥ represents assembly lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) Note: No character inversion used.
  1. The product and product specific ations contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives befor e use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation a nd characteristics of our products. We neither make warranties or repres entations with respect to the accuracy or completeness of the information contained in this dat asheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to im prove the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their des igns, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD.