XC3202 TOREX | Alldatasheet
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Low Power Consumption Hall IC (Magnetic Sensor) *Ｃ is a capacitor for noise reduction and input voltage stability. The recommended value is 10nF～100nF ■GENERAL DESCRIPTION The XC3202 series is a Hall effect magnetic sensor IC with a built-in CMOS output driver. The device features low power consumption and small packaging which is ideally suited for ba ttery powered portable applications such as mobile phones, electronic dictionaries and handheld game consoles. When the magnetic flux density (Omnipolar) is larger than the operating magnetic flux density (Bop), the CMOS output driver will be tu rned on (Detect Low). The output driver will be turned off (Release High) when the output is lower than the release magnetic flux density (Brp). ■APPLICATIONS
- Cover detector, Home security systems
- Mobile phones
- Electronic dictionaries
- Portable game consoles
- Home electronics (refrigerators, washing machines etc) ■FEATURES Supply Voltage Range : 2.4~5.5V Average Supply Current : 8μA Operating Magnetic Flux Density : South Pole 3mT(TYP .) North Pole -3mT(TYP.) Release Magnetic Flux Density : South Pole 2mT(TYP .) North Pole -2mT(TYP.) Hysteresis Width : South Pole 1mT(TYP .) North Pole 1mT(TYP.) Packages : SOT-23D QFN-0601 (under development) Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT ETR0412-005 OUTPUTXC3202 VDD VOUT VSS C -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) Average Supply Current : Idd (μA) XC3202A183 VINr=.5.5V 3.0V 2.4V ■ TYPICAL PERFORMANCE CHARACTERISTICS
- Supply Current (avg) vs. Ambient Temperature
■PIN CONFIGURATION * QFN-0601 is under development. * QFN-0601 is under development. * QFN-0601 is under development. DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION ① Product Type A CMOS Output ②③④ Product No. 183 Based on the internal standard MR-G SOT-23D (Halogen & Antimony free) ⑤⑥-⑦ Packages Taping Type (*2) ZR-G QFN-0601 (Halogen & Antimony free) (under development) PIN NUMBER SOT-23D QFN-0601 PIN NAME FUNCTION 1 1 V DD Power Input 2 3 V OUT Output Pin 3 5 V SS Ground - 2,4,6 NC No Connection ■PIN ASSIGNMENT ■PRODUCT CLASSIFICATION
- Ordering Information XC3202①②③④⑤⑥-⑦(*1) (*1) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. (*2) The device orientation is fixed in its embossed tape pocket. For reverse orientatio n, please contact your local Torex sales office or representative. (Standard orientation: ⑤R-⑦, Reverse orientation: ⑤L-⑦)
Ta=25℃, VDD=3V PARAMETER SYMBOL CONDITONS MIN. TYP. MAX. UNITS CIRCUIT On-state Output Voltage VOUT IOUT=1mA - 0.1 0.3 V ③ IDD (en) - 3 6 mA ② IDD (dis) - 5 10 μA ① Supply Current IDD (avg) - 8 16 μA ② Detection Time tawake - 75 150 μs Detection Period tperiod - 75 150 ms Duty Cycle DTY - 0.1 - % ② PARAMETER SYMBOL RATINGS UNITS Supply Voltage V DD 7 V Magnetic Flux Density B Unlimited - Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -55 ～+150 ℃ SOT-23D 150 Power Dissipation QFN-0601 Pd under development mW Maximum Junction Temperature Tjc 125 ℃ Maximum Output Current I OUT 40 mA PARAMETER SYMBOL CONDITONS RATINGS UNITS CIRCUIT Supply Voltage V DD Operating 2.4～5.5 V - ■BLOCK DIAGRAMS ■ABSOLUTE MAXIMUM RATINGS * This IC should be used within the stated absolute maximum ratings in order to prevent damage. ■ELECTRICAL CHARACTERISTICS Ta=25℃ ■OPERATING CONDITION VOUT VSS Logical Latch Latch VDD Hall Plate Amp Hall Plate Amp Power switch
PARAMETER SYMBOL MIN. TYP. MAX. UNITS CIRCUIT Operating Magnetic Flux Density: South Pole Bops 2 3 4 mT ③ Operating Magnetic Flux Density: North Pole Bopn -4 -3 -2 mT ③ Release Magnetic Flux Density: South Pole Brps 1 2 - mT ③ Release Magnetic Flux Density: North Pole Brpn - -2 -1 mT ③ Hysteresis Width Bhy(Bop-Brp) 0.5 1 - mT ③ ■OPERATIONAL *1: When the magnetic flux density to the IC becomes larger than Bop, the IC goes into an on-state and outputs a low signal (V OUT=Low) at the leading edge of the next “tawake” pulse. *2: When the magnetic flux density to the IC becomes lower than Brp, the IC goes into an off-state and outputs a high signal (VOUT=High) at the leading edge of the next “tawake” pulse. During the other periods, the previous state is maintained.
- Timing chart
- Operating by flux density ■MAGNETIC CHARACTERISTCSOutput Voltage Output Voltage Off-state Off-state On-state On-state Magnetic flux density (North Pole) Magnetic flux density (South Pole) Ta=25OC, V DD=3V, 1mT=10Gauss VOUT tawake Time tperiod Time Time IDD Bop B Hig h Low Time IDD Brp B VOUT Hig h Low tawake Time tperiod Time
測定回路 1 測定回路 2 1.VDD 3.VOUT 2.VSS OSC:Oscilloscope OSC 測定回路 3 Bcoil Vcoil 1.VDD 3.VOUT 2.VSS OSC OSC:Oscilloscope A 1.VDD 3.VOUT 2.VSS V ■TEST CIRCUITS Circuit ① Circuit ② Circuit ③
■PACKAGING INFORMATION
- SOT-23D
- Position of sensor
- QFN-0601 (under development) ●Position of sensor 0.43mm0.65mm 1.0mm 0.4+0.1 -0.05 1.6±0.1 (1.9) 3.0±0.1 2.85±0.151.15±0.15 0～0.1 0.45±0.1 0.15±0.05 (0.95) 0.8 1.5 0.65
① represents production number: standard / custom production MARK PRODUCT SERIES ② denotes production registered number: standard / custom production 1, …, 9, A, …, Z in order (G, I, J, O, Q, W are excluded) ③ represents the last 1 digit of the manufacturing year: standard / custom production (e.g) MARK YEAR 9 2009 0 2010 ④ represents manufacturing month: standard / custom production MARK MANUFACTURING MONTH MARK MANUFACTURING MONTH MARK MANUFACTURING MONTH A January E May J September B February F June K October C March G July L November D April H August M December ⑤ denotes production lot number A, …, Z, in order (G, I, J, O, Q, W are excluded) ■ MARKING RULE ④ ⑤ ② ③① 1pin→ QFN0601 SOT-23D ① ② ③ ④ ⑤ *QFN-0601 is under development
- The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.