XC25BS6 TOREX | Alldatasheet

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Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit September 17, 2003 V1 Preliminary „ CMOS Low Power Consumption „ APPLICATIONS „ Low Operating Supply Voltage 2.3V (MIN.) z Crystal Oscillation Modules „ Output Frequency 32.768kHz z Clocks for Micro-computers, DSPs, etc. „ Oscillation Frequency 2MHz ~ 36MHz (fundamental) z Communication Equipment „ Built-In Divider Circuit Selectable from divisions of z Various System Clocks 1024, 512, 256, 128 z Clock Time-Base „ Output 3-State „ Ultra Small Package SOT-26 „ Chip Form „ GENERAL DESCRIPTION „ FEATURES Oscillation Frequency 2MHz ~ 36MHz (fundamental) - Oscillation feedback resistor built-in - External oscillation capacitor Divider Ratio f0/1024, f0/ 512, f0/256, f0/128 Output 3-State Operating Supply 2.3 ~ 4.0V Voltage Range Supply Current 0.5 µA (MAX.) when stand-by mode Chip Form Chip size 1.3 x 0.8mm Package SOT-26 mini mold „ PIN CONFIGURATION „ PIN ASSIGNMENT * The stand-by control pin (pin #4) has a pull-down resistor built-in. „ PAD LAYOUT FOR CHIP FORM „ PAD LOCATIONS (Unit:µm) * The stand-by control pin (pin #4) has a pull-down resistor built-in. „ BLOCK DIAGRAM „ CE, Q0 PIN FUNCTION 'L' or Open High Impedance Clock Output 399.0 CE 'H'

9 VDD Power Suppl y

189.0 1172.0 430.0 4 VSS Ground 952.0 3 (NC) No Connection 741.0 PIN NUMBER PIN NAME FUNCTIONS 1 / XT Crystal Oscillator Connection (Output) VSS Ground 187.0 PAD DIMENSIONS X Y 672.0 672.0 672.0 128.0 610.0 328.0 672.0 1172.0 1172.0CE VDD FUNCTIONS Crystal Oscillator Connection (Output) Ground Stand-by Control * Power Supply Clock Output Power Supply Crystal Oscillator Connection (Input) 6X T VSS

5 VDD

Stand-by Control * CE PIN NAME / XT PIN NUMBER 128.0 Crystal Oscillator Connection (Input)XT 128.0 Semiconductor Ltd. The XC25BS6 is a low operating voltage, low current consumption series of CMOS ICs with built-in crystal oscillator and divider circuits designed for clock generators. Oscillation capacitors Cg and Cd are externally set up. Output is selectable from any one of the following values for f0:f0/1024, f0/512, f0/256, and f0/128. With oscillation feedback resistors built-in, it is possible to configure a stable fundamental oscillator using about 10pF of external oscillation capacitor and an external crystal. The series has a stand-by function. The oscillation completely stops in the stand-by state and output will be one of high-impedance. 1/XT VSS XT VDD CE VDD CEXT /XT VSS VSS(NC) VDD (1300,800) (0,0) Chip Size Chip Thickness Chip Back Pad Aperture : 1300 x 800µm : 280±20µm : VDD level : 88 x 88 µm Note) There are two VSS pads and two VDD pads. Please connect both VSS pads to GND, and connect both VDD pads to a power supply. Counter VDD /XT XT VSS CE Data Sheet 1

Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary „ ABSOLUTE MAXIMUM RATINGS Ta=25OC ** SOT-26 package, When implemented on a glass epoxy PCB. „ PRODUCT CLASSIFICATION  Ordering Information XC25BS6 12345 Divider Ratio: Package: 128 = 128 divider C : Chip Form 256 = 256 divider W : Wafer Form 512 = 512 divider M : SOT-26 A24 = 1024 divider Device Orientation: R : Embossed Tape : Standard Feed L : Embossed Tape : Reverse Feed T : Chip Tray W : Wafer „ MARKING RULE

1 Represents XC25BS6 Series

2 Represents XC25BS6 Series

3 Represents divider ratio

4 Represents the assembly lot no. (Based on internal standards) „ PACKAGING INFORMATION  SOT-26 A f0/1024 MARK Divider Ratio 2 f0/256 MARK Divider Ratio f0/128 f0/512

DESCRIPTION

DESCRIPTIONDESIGNATOR DESIGNATOR - 65 ~ + 150 (Chip Form) OCTstgStorage Temperature Range Topr - 40 ~ + 85 OCOperating Temperature Range mAQ0 Output Current Pd 150 ** mWContinuous Power Dissipation VQ0 VSS -0.3 ~ VDD +0.3 IQ0 ± 50 CE Pin Voltage Q0 Pin Voltage V VDD VSS -0.3 ~ VSS +7.0 VSupply Voltage VCE VSS -0.3 ~ VDD +0.3 V SYMBOL RATINGS UNITSPARAMETER MARK Product Name B XC25BS6 MARK Product Name

6 XC25BS6

Semiconductor Ltd. 654 321 1 2 3 4 Data Sheet 2

Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary „ WIRE BONDING CONNECTION „ TYPICAL APPLICATION CIRCUIT * Please use oscillation capacitors Cg, Cd =10pF externally * The same power supply can be used for VDD and CE. „ NOTES ON USE (1) The oscillation circuit of this IC does not have internal oscillation capacitors. Please make the oscillation circuitry using an external crystal transducer and oscillation capacitors Cg and Cd. *) A higher harmonic wave oscillation may occur without Cg and Cd. *) Cg and Cd can be connected either to GND or VDD. (Cg and Cd in the above circuit example are connected to GND.) *) It is recommended to use around for 10pF of Cg and Cd. For trimmer capacitors, 10pF as a standard value is appropriate. *) The crystal oscillation frequency should be measured at the output of the Q0 pin. When a probe is directly connected to the XT pin or the /XT pin, oscillation frequency will change and a precise value can not be taken. (2) Please insert a by-pass capacitor of 0.1µF between VDD and GND. (3) The use of a matching resistor Rq0 of 50Ω connected in series to the Q0 pin is recommended in order to counter unwanted radiations. (5) When the CE pin is not controlled by external signals, please connect the CE pin to VDD power supply. *) When the CE pin is not connected, the IC goes into stand-by mode due to the internal pull-down resistor. (6) As for the supply voltage, it is recommended to apply a low noise power supply, such as a series regulator. Using a power supply like a switching regulator might lead to an unstable oscillation jitter which in turn may lead the oscillation frequency to fluctuate due to the ripple of the switching regulator. (4) Please place a by-pass capacitor and the matching resistor as close to the IC as possible. If the by-pass capacitor is placed away from the IC, it may cause abnormal oscillation. If the matching resistor is placed away from the IC, it may cause unwanted radiations in the pattern between the Q0 pin and the resistor. * There are two VSS pads and VDD pads. Please connect both VSS pads to GND, and connect both VDD pads to a power supply. Semiconductor Ltd. VDD CEXT /XT VSS VSS VDD (NC) fQ0 measurement VDD /XT XT VSS CE CgCd Rq0 0.1uF Data Sheet 3

Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary „ DC ELECTRICAL CHARACTERISTICS XC25BS6xxxxx 3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, No load, Ta=25 OC) * External oscillation capacitor „ AC ELECTRICAL CHARACTERISTICS XC25BS6xxxxx 3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, CL=15pF, Ta=25 OC) *1 R&D guarantee „ AC ELECTRICAL CHARACTERISTICS MEASUREMENT WAVE FORMS (1) Output Rise Time , Output Fall Time (2) Duty Cycle MΩ KΩ V MHz V V 0.5 1.6 MΩ µA mA µA V V 0.2 0.5 1.0 - 0.5 3.0 55 90 - 0.6 CE=0.3V XT Pin, CE=/XT=3.0V Q0 Pin, VDD=4.0V, CE=0V CE=0V CE=3.0V - (0.8) (1.6) - (1.0) (1.8) - 0.5 2.4 - (0.4) (0.8) - (0.5) (1.0) 2.3 - - - - 0.4 (2.3) 3.0 4.0 2- 3 6 VDD=2.7V, IOL=4mA CE=3.0V fOSC=4MHz, XC25BS6128 fOSC=8MHz, XC25BS6256 fOSC=16MHz, XC25BS6512 fOSC=36MHz, XC25BS6A24 FUNCTIONS Cf=Cd=10pF (External) VDD=2.7V, IOH= - 4mA UNIT MIN TYP MAX STANDARD VALUE Rp1 Rp2 Rf IOZ IDD1 IDD2 VCEH VCEL CE Pull-Down Resistance 1 CE Pull-Down Resistance 2 Output Disable Leakage Current Operating Supply Voltage Supply Current 1 CE H Level Voltage CE L Level Voltage Internal Oscillation Feedback Resistance Crystal Oscillation Frequency H Level Output Voltage L Level Output Voltage Supply Current 2 PARAMETER VDD SYMBOL fOSC VOH VOL PARAMETER SYMBOL FUNCTIONS STANDARD VALUE UNIT MIN TYP MAX Output Rise Time Tr VDD=3.0V (10% to 90%) *1 - Output Start Time Ton *1 - 50 55 Output Fall Time Tf VDD=3.0V (10% to 90%) *1 Duty Cycle DUTY 45 3.0 10 15 ns 10 15 ns ms 0.9VDD 0.1VDD tr tf 0.9VDD 0.1VDD Semiconductor Ltd. 0.5VDD DUTY Measurement Level TW T DUTY = (TW/T) x 100 [%] Data Sheet 4