XC25BS3 TOREX | Alldatasheet

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1/10 XC25BS3 ETR1501_003 PIN NUMBER SOT-26 USP-6B PIN NAME FUNCTION 1 3 CE Chip Enable 2 2 V SS GND 3 1 Q0 PLL Output 4 6 Q1 Reference Oscillation, GND, Comparative Frequency/2, or PLL Output/2 Output * 5 5 V DD Power Supply 6 4 CLKin Reference Clock Input ◆CMOS Low Power Consumption ◆Input Frequency : 14kHz ~ 35MHz ◆Divider Ratio : 1~ 2047 Divisions (Laser Trimming) ◆Multiplier Ratio : 20 ~ 2047 Multiplications (Laser Trimming) ◆Comparative Frequency : 14kHz ~ 500kHz ◆Output Frequency : 9MHz ~ 80MHz ■GENERAL DESCRIPTION The XC25BS3 series are high frequency, low power consumption PLL clock generator ICs with built-in crystal oscillator circuit, divider circuit & multiplier PLL circuit. Laser trimming gives the option of being able to select from divider ratios (M) of 1 to 2047 and multiplier ratio (N) of 20 to 2047. Output frequency (Q0) is equal to reference oscillation (fCLKin) multiplied by N/M, wi thin a range of 9MHz to 80MHz. Q1 output is selectable from input reference frequency (f0), Ground (GND), PLL output frequency/2 (Q0/2), and comparative frequency/2 (f0/M/2) . Reference oscillation can input 14kHz to 35MHz of reference clock. Further, comparative frequency, within a range of 14kHz to 500kHz, can be obtained by dividing the reference oscillation. By halting oscillation via the CE pin, consumption current can be controlled. Output will be one of high impedance. ■APPLICATIONS

  • Crystal oscillation modules
  • Microcontroller
  • PDAs
  • Portable audio systems
  • Various system clocks ■PIN CONFIGURATION ■FEATURES Output Frequency : 9MHz ~ 80MHz (Q0=fCLKin×N/M) Reference Oscillation : 14kHz ~ 35MHz (fCLKin) Divider Ratio (M) : Selectable from divisions of 1 ~ 2047 Multiplier Ratio (N) : Selectable from multiplications of 20 ~ 2047 Output : 3-State Q1 output selectable from reference oscillation, GND, PLL output frequency/2, comparative frequency/2. Operating Voltage Range: 2.97V ~ 5.5V Low Power Consumption: CMOS (stand-by function included)*1 Ultra Small Package : SOT-26, USP-6B *1 High output impedance during stand-by ■PIN ASSIGNMENT *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V DD pin. VDD CLKin VSS CE SOT-26 (TOP VIEW) * Q1 Output is selectable from the above mentioned functions.

“H” Q0/Q1 Clock Output “L” Stand-by Output Pin = High Impedance Open Stand-by Output Pin = High Impedance (VSS pin pull-down due to IC's internal resistance) DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION ①②③ Product Number Integer : Based on internal standards e.g. Product number 001 → ①②③ = 001 M : SOT-26 ④ Package D : USP-6B Ｒ : Embossed tape, standard feed ⑤ Device Orientation Ｌ : Embossed tape, reverse feed ■PRODUCT CLASSIFICATION

  • Ordering Information XC25BS3①②③④⑤ ■PACKAGING INFORMATION
  • USP-6B ■FUNCTION LIST
  • CE,Q0/Q1 True Logic
  • SOT-26 "H" = High level "L" = Low level

① ② ③ PRODUCT SERIES B S 3 XC25BS30xxDx S 3 S XC25BS3SxxDx MARK ④ ⑤ PRODUCT SERIES 0 7 XC25BS3007Dx 0 1 XC25BS3S01Dx MARK ① ② PRODUCT SERIES B 3 XC25BS30xxMx SYMBOL ② ③ PRODUCT SERIES SYMBOL ② ③ PRODUCT SERIES 1 0 1 XC25BS3x01Mx K 1 7 XC25BS3x17Mx 2 0 2 XC25BS3x02Mx L 1 8 XC25BS3x18Mx 3 0 3 XC25BS3x03Mx M 1 9 XC25BS3x19Mx 4 0 4 XC25BS3x04Mx N 2 0 XC25BS3x20Mx 5 0 5 XC25BS3x05Mx P 2 1 XC25BS3x21Mx 6 0 6 XC25BS3x06Mx R 2 2 XC25BS3x22Mx 7 0 7 XC25BS3x07Mx S 2 3 XC25BS3x23Mx 8 0 8 XC25BS3x08Mx T 2 4 XC25BS3x24Mx 9 0 9 XC25BS3x09Mx U 2 5 XC25BS3x25Mx A 1 0 XC25BS3x10Mx V 2 6 XC25BS3x26Mx B 1 1 XC25BS3x11Mx X 2 7 XC25BS3x27Mx C 1 2 XC25BS3x12Mx Y 2 8 XC25BS3x28Mx D 1 3 XC25BS3x13Mx Z 2 9 XC25BS3x29Mx E 1 4 XC25BS3x14Mx 0 3 0 * XC25BS3x30Mx F 1 5 XC25BS3x15Mx 1 3 1 * XC25BS3x31Mx H 1 6 XC25BS3x16Mx … … … … ■MARKING RULE

  • SOT-26 ①②Represents product series ③Represents ② and ③ of product number as in ordering information ④,⑤Represents ② and ③ of product number as in ordering information (ex) ④Represents assembly lot number 0 to 9, A to Z, reverse character 0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.) * Character inversion is used. ⑥Represents production lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excepted) Note: No character inversion used. USP-6B (TOP VIEW) SOT-26 (TOP VIEW)
  • USP-6B ⑤⑥ ④ ②③ ①1 ①②③Represents product series

PARAMETER SYMBOL CONDITIONS UNITS Supply Voltage V DD V SS-0.3～VSS+7.0 V CLKin Pin Voltage V CK V SS-0.3～VDD+0.3 V CE Pin Voltage V CE V SS-0.3～VDD+0.3 V Q0 Pin Voltage V Q0 V SS-0.3～VDD+0.3 V Q1 Pin Voltage V Q1 V SS-0.3～VDD+0.3 V Q0 Output Current I Q0 ±50 mA Q1 Output Current I Q1 ±50 mA SOT-26 150 Power Dissipation USP-6B Pd 100 mW Storage Temperature Range Topr -30 ～+80 ℃ Operating Temperature Range Tstg -40 ～+125 ℃ ■BLOCK DIAGRAM ■ABSOLUTE MAXIMUM RATINGS Ta = 25℃

PARAMETER SYMBOL MIN. TYP . MAX. UNITS Input Frequency fCLKin 13.000 － 20.000 MHz Q0 Pin Output Multiplier Ratio N/M － 4.000 － Multiplier Output Frequency 1 fQ0 52.000 － 80.000 MHz Output Frequency 2 Q1 fCLKin － PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS Supply Voltage V DD 2.97 3.30 3.63 V Input Voltage "High" V IH 2.7 － － V Input Voltage "Low" V IL － － 0.6 V Input Current "High" I IH V CK=3.3V － － 3.0 μA Input Current "Low" I IL V CK=0V -3.0 － － μA Output Voltage "High" V OH V DD=2.97V, IOH=-8mA 2.5 － － V Output Voltage "Low" V OL V DD=2.97V, IOL=8mA － － 0.4 V Supply Current 1 I DD1 CE=3.3V － 5.5 11.0 mA Supply Current 2 I DD2 CE=0V － － 5.0 μA CE "High" Voltage V CEH 2.70 － － V CE "Low" Voltage VCEL － － 0.45 V CE Pull-Down Resistance 1 Rp1 CE=3.3V 0.5 1.5 2.5 MΩ CE Pull-Down Resistance 2 Rp2 CE=0.3V 20.0 50.0 80.0 kΩ PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS Output Rise Time T TLH V DD=3.3V (20% to 80%) (*2) － 5.0 － ns Output Fall Time T THL V DD=3.3V (20% to 80%) (*2) － 5.0 － ns Duty Ratio DUTY 40 50 60 % Output Start Time Ton (*2) － － 20 ms PLL Output Jitter Tj 1σ(*2) － 60 － ps ■ELECTRICAL CHARACTERISTICS

  • Set Value (example 1) fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25℃, No Load
  • DC Characteristics XC25BS30xxMR
  • AC Characteristics XC25BS30xxMR fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25℃, CL=15pF *2 R&D guarantee

XC25BS30xxMR (Continued) PARAMETER SYMBOL MIN. TYP . MAX. UNITS Input Frequency fCLKin 10.000 － 16.000 MHz Q0 Pin Output Multiplier Ratio N/M － 3.000 － Multiplier Output Frequency 1 fQ0 30.000 － 48.000 MHz Output Frequency 2 Q1 GND － PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS Supply Voltage V DD 2.97 3.30 3.63 V Input Voltage "High" V IH 2.7 － － V Input Voltage "Low" V IL － － 0.6 V Input Current "High" I IH V CK=3.3V － － 3.0 μA Input Current "Low" I IL V CK=0V -3.0 － － μA Output Voltage "High" V OH V DD=2.97V, IOH=-8mA 2.5 － － V Output Voltage "Low" V OL V DD=2.97V, IOL=8mA － － 0.4 V Supply Current 1 I DD1 CE=3.3V － 4.0 8.0 mA Supply Current 2 I DD2 CE=0V － － 5.0 μA CE "High" Voltage V CEH 2.70 － － V CE "Low" Voltage VCEL － － 0.45 V CE Pull-Down Resistance 1 Rp1 CE=3.3V 0.5 1.5 2.5 MΩ CE Pull-Down Resistance 2 Rp2 CE=0.3V 20.0 50.0 80.0 kΩ PARAMETER SYMBOL CONDITIONS MIN. TYP . MAX. UNITS Output Rise Time T TLH V DD=3.3V (20% to 80%) (*2) － 5.0 － ns Output Fall Time T THL V DD=3.3V (20% to 80%) (*2) － 5.0 － ns Duty Ratio DUTY 40 50 60 % Output Start Time Ton (*2) － － 20 ms PLL Output Jitter Tj 1σ(*2) － 60 － ps fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25℃, No Load

  • DC Characteristics XC25BS30xxMR
  • AC Characteristics XC25BS30xxMR fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25℃, CL=15pF *2 R&D guarantee
  • Set Value (example 2) ■ELECTRICAL CHARACTERISTICS (Continued)

■TYPICAL APPLICATION CIRCUITS ■NOTES ON USE (1) Please insert a by -pass capacitor of 0.1μF. (2) Rq0 and Rq1 are matching resistors. Their use is recommended in order to counter unwanted radiations. (3) Please place a by-pass capacitor and matching resistor s as close to the IC as possible. The output may not be locked if the by-pass capacitor is not close enough to the IC. Further, there is a possibility of unwanted radiation occurrence between the resistor and the IC pin if the matching resistors are not close enough to the IC. (4) When selecting GND for the Q1 pin, although the IC will be connected to GND internally, it is also recommended that the PCB be connected to GND. (5) When the CE pin is not controlled by external signals, it is recommended that a time constant circuit of R1=1k Ω× C1=0.1μF be added for stability. (6) With this IC, output is achieved by dividing and multiplyi ng the reference oscillation by means of the PLL circuit. In cases where this output is further used as a reference oscillation of another PLL circuit, the final output signal's jitter may increase, so all necessary precautions should be taken to avoid this. (7) It is recommended that a low noise power supply, such as a series regulator, be used for the supply voltage. Using a power supply such as a switching regulator might lead to a larger jitter, which in turn may lead to an inability to lock due to the ripple of the switching regulator. (8) As for this IC, synchronization of input and output signal’s edge is not guarante ed though the input frequency operates to the output frequency multiply.

  • Circuit Example ①Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2 ②Q1 Pin - GND

■REFERENCE LAND PATTERN ①Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2 ②Q1 Pin - GND

■AC CHARACTERISTICS WAVEFORMS 1) Output Rise Time / Output Fall Time 2) Duty Ratio 3) Output Start Time

  1. The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this catalog is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this catalog. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this catalog. 4. The products in this catalog are not developed, designed, or approved for use with such equipment whose failure of malfunction ca n be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this catalog within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this cata log may be copied or reproduced without the prior permission of Torex Semiconductor Ltd.