DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 15
Technical content
© 2014 Silicon Laboratories, Inc. All rights reserved.
FEATURES
Pin-Compatible, Single-channel Higher-Speed Upgrade to MAX1286 Single-Supply Operation: +2.7V to +3.6V DNL & INL: ±1LSB (max) 300ksps Sampling Rate Low Conversion-Mode Supply Current: 0.95mA @ 300ksps Low Supply Current in Shutdown: 0.2µA Internal 10-MHzTrack-and-Hold Internal ±0.6%, 30ppm/ºC +2.5V Reference SPI/QSPI/MICROWIRE 3-Wire Serial-Interface 8-Pin, 3mm x 3mm TDFN-EP Package
APPLICATIONS
Process Control and Factory Automation Data and Low-frequency Signal Acquisition Portable Data Logging Pen Digitizers & Tablet Computers Medical Instrumentation Battery-powered Instruments
DESCRIPTION
The TS7003 – a single-supply, single-channel, 12-bit analog-to-digital converter (ADC) - is a successive- approximation ADC that co mbines a high-bandwidth track-and-hold (T/H), a hi gh-speed serial digital interface, an internal +2.5V reference, and low conversion-mode power c onsumption. The TS7003 operates from a single +2.7V to+3.6V supply and draws less than 1mA at 300ksps. Connecting directly to any SPI™/QSPI™/ MICROWIRE™ microcontrollers and other interface- compatible computing devices, the TS7003’s 3-wire serial interface is easy to use and doesn’t require separate, external logic. An external serial-interface clock controls the TS7003’s conversion process and its output shift register operation. In PCB-space-conscious, low-power remote-sensor and data-acquisition applications, the TS7003 is an excellent choice for its low-power, ease-of-use, and small-package-footprint attributes. As a pin-compatible and higher-speed upgrade to the MAX1286, the TS7003 is fully specified over the - 40°C to +85°C temperature range and is available in a low-profile, 8-pin 3x3m m TDFN package with an exposed back-side paddle. A 300ksps, Single-supply, 12-Bit Serial-output ADC FUNCTIONAL BLOCK DIAGRAM
Page 2 TS7003 Rev. 1.0 ABSOLUTE MAXIMUM RATINGS Continuous Power Dissipation (TA = +70°C): 8-Pin TFDN33-EP (Derate 12.5mW/°C above +70°C) . 1000mW Operating Temperature Ranges: Electrical and thermal stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the op erational sections of the specifications is not implied. Exposure to any absolute maximum rating conditions for extended periods may affect device reliability and lifetime. PACKAGE/ORDERING INFORMATION ORDER NUMBER PART MARKING CARRIER QUANTITY TS7003ITD833 7003I Tape & Reel ----- TS7003ITD833T Tape & Reel 3000 Lead-free Program: Silicon Labs supplies only lead-free packaging. Consult Silicon Labs for products specified with wider operating temperature ranges.
TS7003 Rev. 1.0 Page 3 ELECTRICAL SPECIFICATIONS VDD = +2.7V to +3.6V; fSCLK = 4.8MHz, 50% duty cycle, 16 clocks/conversion cycle, 300ksps; 4.7μF capacitor at REF; TA = -40ºC to +85ºC, unless otherwise noted. Typical values apply at TA = +25°C. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (See Note 1) Resolution 12 Bits Relative Accuracy INL See Note 2 ±1.0 LSB Differential Nonlinearity DNL No missing c odes over temperature ±1.0 LSB Offset Error ZE ±6.0 LSB Gain Error GE See Note 3 ±6.0 LSB Gain-Error Temperature Coefficient TCGE ±1.6 ppm/°C DYNAMIC SPECIFICATIONS (fIN = 75kHz sine wave, 2.5VPP, fSAMPLE = 300ksps, fSCLK = 4.8MHz) Signal-to-Noise Plus Distortion Ratio SINAD 70 dB Total Harmonic Distortion THD Including the 5th harmonic -80 dB Spurious-Free Dynamic Range SFDR 80 dB Intermodulation Distortion IMD f A = 73kHz, fB = 77kHz 76 dB Full-Power Bandwidth FPBW -3dB point 10 MHz Full-Linear Bandwidth FLBW SINAD > 68dB 300 kHz CONVERSION RATE Conversion Time tCONV See Note 4 3.3 μs Track/Hold Acquisition Time tACQ 625 ns Aperture Delay tAD 10 ns Aperture Jitter tAJ < 50 ps Serial Clock Frequency tSCLK 0.5 4.8 MHz Duty Cycle 40 60 % ANALOG INPUT (AIN) Input Voltage Range VIN 0 VREF V Input Capacitance CINA 10 pF INTERNAL REFERENCE REF Output Voltage VREF 2.485 2.50 2.515 V REF Short-Circuit Current T A = +25°C 15 mA REF Output Tempco TCVREF 30 ppm/°C Load Regulation See Note 5; 0 to 0.75mA output load 3 5 mV/mA Capacitive Bypass at REF 4.7 10 μF DIGITAL INPUTS (SCLK, CS, SHDN) Input High Voltage VINH 2.4 V Input Low Voltage VINL 0.8 V Input Hysteresis VHYST 0.2 V Input Leakage IIN V INL = 0V or VINH = VDD ±1 μA Input Capacitance CIND 15 pF DIGITAL OUTPUT (DOUT) Output Voltage Low VOL I SINK = 5mA 0.4 V Output Voltage High VOH I SOURCE = 0.5mA VDD - 0.5 V Three-State Leakage Current IL VCS = +3V ±10 μA Three-State Output Capacitance C OUT VCS = +3V 15 pF POWER SUPPLY Positive Supply Voltage VDD See Note 6 2.7 3.6 V Positive Supply Current IDD See Note 7; V DD = +3.6V 0.95 1.25 mA Shutdown Supply Current ISHDN SCLK = VDD, SHDN = GND 0.2 2 μA Power-Supply Rejection PSR V DD = +2.7V to 3.6V, midscale input ±0.5 ±2.5 mV
Page 4 TS7003 Rev. 1.0 TIMING SPECIFICATIONS VDD = +2.7V to +3.6V, TA = -40ºC to +85ºC, unless otherwise noted. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SCLK Period tCP 208 ns SCLK Pulse-Width High tCH 83 ns SCLK Pulse-Width Low tCL 83 ns CS Fall to SCLK Rise Setup tCSS 45 ns SCLK Rise to CS Rise Hold tCSH 0 ns SCLK Rise to CS Fall Ignore tCSO 45 ns CS Rise to SCLK Rise Ignore tCS1 45 ns SCLK Rise to DOUT Hold tDOH C LOAD = 20pF 13 ns SCLK Rise to DOUT Valid tDOV C LOAD = 20pF 100 ns CS Rise to DOUT Disable tDOD C LOAD = 20pF; Refer to Figure 2 13 85 ns CS Fall to DOUT Enable tDOE C LOAD = 20pF; Refer to Figure 1 85 ns CS Pulse-Width High tCSW 100 ns Note 1: Tested at VDD = VDD(MIN). Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range has been calibrated. Note 3: Internal reference, offset, and reference errors nulled. Note 4: Conversion time is defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle. Note 5: External load should not change during conversion for specified accuracy. Guaranteed specification limit of 2mV/mA because of production test limitations. Note 6: Electrical characteristics are guaranteed from VDD(MIN) to VDD(MAX). For operations beyond this range, see Typical Operating Characteristics. Note 7: TS7003 tested with 20pF on DOUT and fSCLK = 4.8MHz, 0 to 3V. DOUT = full scale.
TS7003 Rev. 1.0 Page 5 TYPICAL PERFORMANCE CHARACTERISTICS VDD = +3V; fSCLK = 4.8MHz; CLOAD = 20pF; 4.7μF capacitor at REF; TA = 25ºC, unless otherwise noted. Integral Nonlinearity INL - LSB DIGITAL OUTPUT CODE -0.4 -0.3 -0.2 -0.1 0.1 1k 2k 0 3k Offset Error vs Supply Voltage POWER SUPPLY VOLTAGE - Volt OFFSET ERROR - LSB -0.2 -0.8 -1.4 -1.8 TEMPERATURE - ºC -15 35 60 85 10 -0.5 -1.5 1.2 0.8 0.6 -0.2 0.2 Differential Nonlinearity DNL - LSB DIGITAL OUTPUT CODE 4k 5k 1k 2k 0 3k 4k 5k 0.2 0.3 0.4 -0.25 -0.2 -0.15 -0.1 0.2 0.25 -0.05 0.05 0.2 0.15 3.6 OFFSET ERROR - LSB Offset Error vs Temperature -40 0.5 0.6 0.4 0.2 -0.2 Gain Error vs Supply Voltage POWER SUPPLY VOLTAGE - Volt GAIN ERROR - LSB Gain Error vs Temperature TEMPERATURE - ºC -15 35 60 85 10 GAIN ERROR - LSB -40 -0.4 -0.6 -1.2 -1.6 1.2 0.8 0.4 -0.4
Page 6 TS7003 Rev. 1.0 Internal Reference Output vs Supply Voltage REFERENCE OUTPUT - V Power Supply Current vs Power Supply Voltage Power Supply Current vs Temperature SUPPLY CURENT - mA 2.494 2.496 2.498 2.5 2.502 2.506 0.9 0.8 0.5 TYPICAL PERFORMANCE CHARACTERISTICS VDD = +3V; fSCLK = 4.8MHz; CLOAD = 20pF; 4.7μF capacitor at REF; TA = 25ºC, unless otherwise noted. POWER SUPPLY VOLTAGE - Volt TEMPERATURE - ºC -15 35 60 85 10 -40 POWER SUPPLY VOLTAGE - Volt TEMPERATURE - ºC -15 35 60 85 10 -40 0.7 0.6 CODE = 1111 1111 1111 RLOAD = ∞ CLOAD = 10pF CONVERTING SCLK = 4.8MHz STATIC 0.9 0.8 0.5 0.7 0.6 SUPPLY CURENT - mA STATIC, VDD = 3V CONVERTING, VDD = 3V 2.504 Internal Reference Output vs Temperature REFERENCE OUTPUT - V 2.498 2.5 2.502 2.504 2.506 2.510 2.508
TS7003 Rev. 1.0 Page 9 process, the input side of C HOLD is switched back to AIN so as to be charged to the input signal again. An ADC’s acquisition time is function of how fast its input capacitance can be charged. If an input signal’s driving-point source impedance is high, the acquisition time is lengthened and more time must be allowed between conversions. The acquisition time ACQ) is the maximum time the ADC requires to acquire the signal and is also the minimum time needed for the signal to be acquired. The TS7003’s acquisition time is calc ulated from the following expression: t ACQ = 9 x (RS + RIN) x 10pF where R IN = 100 Ω (the TS7003’s internal track/hold switch resistance), R S = the input signal’s source impedance, and tACQ is never less than 625ns. Because of the input st ructure of the TS7003, sources with output impedances of 1kΩ or less do not affect significantly the AC performance of the TS7003. The TS7003 can still be used in applications where the source impedance is higher so long as a 0.01μF capacitor is connected between the analog input and GND. Limiting the ADC’s input signal bandwidth, the use of an external, input capacitor forms an RC filter with the input’s source impedance. Input Bandwidth Considerations Since the TS7003’s input track-and-hold circuit exhibits a 10 MHz small-signal bandwidth, it is possible to measure periodic signals and to digitize high-speed transient events with signal bandwidths higher than the TS7003’s sampling rate by using undersampling techniques. To avoid the aliasing of high-frequency signals into the frequency band of interest, the use of external anti-alias filter circuits (discrete or integrated) is recommended. The time constant of the external anti-alias filter should be set so as not to interfere with the desired signal bandwidth. Analog Input Protection The TS7003 incorporates internal protection diodes that clamp the analog input between V DD and GND. These internal protection diodes allow the AIN pin to swing from GND - 0.3V to VDD + 0.3V without causing damage to the TS7003. However, for accurate conversions near full scale, the input signal must not exceed V DD by more than 50mV or be lower than GND by 50mV. If the analog inputs can exceed 50mV beyond the supplies, then the current in the forward-biased protection diodes should be limited to less than 2mA since large fault currents can affect conversion results. Internal Reference Considerations The TS7003 has an internal voltage reference that is factory-trimmed to 2.5V. The internal reference output is connected to the REF pin and is also connected to the ADC’s internal CDAC. The REF output can be used as a reference voltage source for other components external to the ADC and can source up to 750μA. To maintain conversion accuracy to within 1 LSB, a 4.7μF capacitor from the REF pin to GND is recommended. While larger-valued capacitors can be used to further reduce reference wide-band noise, larger capacitor values can increase the TS7003’s wake-up time when exiting from shutdown mode (see the “Using SHDN to Reduce Operating Supply Current” section for more information). When in shutdown (that is, when SHDN = 0), the TS7003’s internal 2.5-V reference is disabled. Serial Digital Interface Initialization after Power-Up and Starting a Conversion If the SHDN pin is not driven low upon an initial, cold- start condition, it may take up to 2.5ms for a fully- discharged 4.7 μF reference bypass capacitor to provide adequate charge for specified conversion accuracy. As a result, conversions should not be initiated during this reference capacitor charge-up delay. To initiate a conversion, the CS pin is toggled (or driven) low. At the CS’s falling edge, the TS7003’s internal track-and-hold is placed in hold mode and a conversion is initiated. Data can then be transferred out of the ADC using an external serial clock.
Page 14 Silicon Laboratories, Inc. TS7003 Rev. 1.0
400 West Cesar Chavez, Austin, TX 78701
+1 (512) 416-8500 ▪ www.silabs.com PACKAGE OUTLINE DRAWING 8-Pin 3mm x 3mm TDFN-EP Package Outline Drawing (N.B., Drawings are not to scale) Patent Notice Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analog-intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team. The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages. Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc. Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Trademark Information Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. http://www.silabs.com Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701 USA Smart. Connected. Energy-Friendly Products www.silabs.com/products Quality www.silabs.com/quality Support and Community community.silabs.com