SV05

SV05 DYNEX | Alldatasheet

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Technical content

SV05..F

APPLICATIONS

n A.C. Motor Drives n Snubber Diode n Welding n High Frequency Rectification n UPS

FEATURES

IF(AV) 145A IFSM 2500A Q r 150µC trr 2.2µs 2500 2400 2200 2000 SV05 25F M or K SV05 24F M or K SV05 22F M or K SV05 20F M or K Conditions V RSM = VRRM + 100V For 1/2" 20 UNF thread, add suffix K, e.g. SV05 25FK. For M12 thread, add suffix M, e.g. SV05 25FM. For stud anode add 'R' to type number, e.g. SV05 25FMR. For outline DO8C add suffix 'C' to typ number, e.g. SV05 25FKC. Type Number Repetitive Peak Reverse Voltage V RRM V Outline type codes: DO8 and DO8C. See Package Details for further information. CURRENT RATINGS Symbol Parameter Conditions Units Max. IF(AV) Mean forward current IF(RMS) RMS value IF Continuous (direct) forward current Half wave resistive load, Tcase = 65oC 145 A Tcase = 65oC 225 A Tcase = 65oC 195 A SV05..F Fast Recovery Diode Advance Information Replaces March 1998 version, DS4144-3.4 DS4144-4.0 January 2000

SV05..F SURGE RATINGS Conditions Max. Units 2.5 kA 31 x 103 A2sI2t for fusingI2t Surge (non-repetitive) forward currentIFSM ParameterSymbol 10ms half sine; with 0% VRRM, Tj = 150oC 2.0 kA 20 x 103 A2sI2t for fusingI2t Surge (non-repetitive) forward currentIFSM 10ms half sine; with 50% VRRM, Tj = 150oC THERMAL AND MECHANICAL DATA dc Conditions Max. Units oC/W- 0.02Thermal resistance - case to heatsinkR th(c-h) Thermal resistance - junction to caseR th(j-c) Mounting torque 15Nm with mounting compound Symbol Parameter - 0.23 oC/W Min. trr Symbol Typ. UnitsParameter VFM Forward voltage IRRM Peak reverse current Reverse recovery time Q RA1 Recovered charge (50% chord) IRM Reverse recovery current K Soft factor VTO Threshold voltage rT Slope resistance VFRM Forward recovery voltage di/dt = 1000A/µs, Tj = 125oC - 250 V At Tvj = 150oC - 2.5 m Ω At Tvj = 150oC - 1.4 V --- - 140 A - 150 µC 2.2 - µs At VRRM , Tcase = 150oC- m A At 600A peak, Tcase = 25oC - 2.8 V Conditions Max. IF = 600A, diRR /dt = 80A/µs Tcase = 150oC, VR = 100V CHARACTERISTICS Tstg Storage temperature range -55 150 oC Nm16.513.5Mounting torque- Tvj Virtual junction temperature On-state (conducting) - 150 oC

SV05..F CURVES Fig.1 Maximum (limit) forward characteristics 500 600 700 800 900 1000Instantaneous forward current IF - (A) Instantaneous forward voltage VF - (V) Measured under pulse conditions Tj = 150˚C Tj = 25˚C 4.5 DEFINITION OF K FACTOR AND Q RA1 0.5x IRR IRR dIR /dt t1 t2 τ Q RA1 = 0.5x IRR (t1 + t2) k = t1/t2

SV05..F Fig.2 Maximum (limit) forward characteristics 100 200 300 400 500 Instantaneous forward current IF - (A) Instantaneous forward voltage VF - (V) Measured under pulse conditions Tj = 150˚C Tj = 25˚C

SV05..F Fig.3 Recovered charge Fig.4 Typical reverse recovery current vs rate of rise of reverse current 1 10 100 1000 Rate of rise of reverse current dIR /dt - (A/µs) 100 1000 10000Reverse recovered charge QS - (µC) IRR Q S tp = 1ms IF dIR /dt Q S = ∫ Conditions: Tj = 150 ˚C, VR = 100V 50µs IF = 1000A IF = 500A IF = 200A IF = 100A 1 10 100 1000 Rate of rise of reverse current dIR /dt - (A/µs) 100 1000 Reverse recovery current IRR - (A) IF = 1000A Conditions: Tj = 150˚C, VR = 100V

SV05..F 1001010.10.01 Time - (s) 0.1 0.01

0.001 Thermal impedance - (˚C/W)

d.c. Fig.5 Maximum (limit) transient thermal impedance - junction to case - (˚C/W)

SV05..F PACKAGE DETAILS - DO8 and DO8C For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Nominal weight: 120g Mounting torque: 15Nm –10% Thread M12 1/2" 20 UNF 60 max Type No + K - 20.6 – 0.6 Type No + M - 18.0 – 0.5 12 – 0.5 Ø27 max 8 min 3.17 max Thread M12 1/2" 20 UNF 163 – 10 Type No + K - 20.6 – 0.6 Type No + M - 18.0 – 0.5 8 min Ø27 max 8 min 3.17 max Ø8.4 – 0.3 20 max Nominal weight: 120g Mounting torque: 15Nm –10%

SV05..F CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS4144-4 Issue No. 4.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:- Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc- tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.