STM201N VBSEMI | Alldatasheet

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N-Channel 100 V (D-S) MOSFET

FEATURES

  • TrenchFET ® Power MOSFET 1 0 0 % U I S T e s t e d

APPLICATIONS

 High Frequency Boost Converter  LED Backlight for LCD TV Notes: a. Surface mounted on 1" x 1" FR4 board. b. t = 10 s. c. Maximum under steady stat e conditions is 85 °C/W. d. Based on T C = 25 °C. PRODUCT SUMMARY VDS (V) RDS(on) () ID (A)d Qg (Typ.) 100 0.124 at VGS = 10 V 4.2 4.6 nC 0.128 at VGS = 4.5 V 3.9 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS 100 VGate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID 4.2 A TC = 70 °C 3.5 TA = 25 °C 3.0a, b TA = 70 °C 2.4a, b Pulsed Drain Current IDM 16 Continuous Source-Drain Diode Current TC = 25 °C IS 4.0 TA = 25 °C 2a, b Single Avalanche Current L = 0.1 mH IAS 6 A Single Avalanche Energy EAS 1.8 mJ Maximum Power Dissipation TC = 25 °C PD 4.8 WTC = 70 °C 3 TA = 25 °C 2.4a, b TA = 70 °C 1.5a, b Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambienta, c t  10 s R thJA 42 53 °C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 21 26 D S D D G D SO-8 Top View 1 S S N-Channel MOSFET G D S STM201N www.VBsemi.com g A ll data sheet.com

Notes: a. Pulse test; pulse width  300 µs, duty cycle  2 % b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the de vice. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Test Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 µA 100 V VDS Temperature Coefficient VDS/TJ ID = 250 µA 110 mV/°CVGS(th) Temperature Coefficient VGS(th)/TJ - 7.5 Gate-Source Threshold Voltage VGS(th) VDS = VGS , ID = 250 µA Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 100 V, VGS = 0 V 1 µAVDS = 100 V, VGS = 0 V, TJ = 55 °C 10 On-State Drain Currenta ID(on) VDS 5 V, VGS = 10 V 8A Drain-Source On-State Resistancea RDS(on) VGS 10 V, ID = 2.7 A VGS 4.5 V, ID = 2.5 A Forward Transconductancea gfs VDS = 10 V, ID = 2.7 A 7S Dynamicb Input Capacitance Ciss VDS = 50 V, VGS = 0 V, f = 1 MHz 470 pFOutput Capacitance Coss 50 Reverse Transfer Capacitance Crss 25 Total Gate Charge Qg VDS = 50 V, VGS = 10 V, ID = 2.7 A 7.1 11 nCVDS = 50 V, VGS = 6 V, ID = 2.7 A 4.6 7 Gate-Source Charge Qgs 1.7 Gate-Drain Charge Qgd 2 Gate Resistance Rg f = 1 MHz 3  Tur n-On Delay Time td(on) VDD = 50 V, RL = 23.8  ID  2.1 A, VGEN = 6 V, Rg = 1  10 15 ns Rise Time tr 10 15 Turn-Off Delay Time td(off) 10 15 Fall Time tf 10 15 Tur n-On Delay Time td(on) VDD = 50 V, RL = 23.8  ID  2.1 A, VGEN = 10 V, Rg = 1  10 15 Rise Time tr 10 15 Turn-Off Delay Time td(off) 12 20 Fall Time tf 10 15 Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS TC = 25 °C 4 A Pulse Diode Forward Current ISM 8 Body Diode Voltage VSD IS = 2.1 A, VGS = 0 V 0.8 1.2 V Body Diode Reverse Recovery Time trr IF = 2.1 A, dI/dt = 100 A/µs, TJ = 25 °C 50 80 ns Body Diode Reverse Recovery Charge Qrr 75 120 nC Reverse Recovery Fall Time ta 28 ns Reverse Recovery Rise Time tb 22 STM201N www.VBsemi.com 0.124 0.128 1 3 V g A ll data sheet.com

TYPICAL CHARACTERISTICS (25 °C, unless otherwis e noted) Output Characteristics On-Resistance vs. Drain Current Gate Charge VGS = 10 V thru 6 V 4 V VDS - Drain-to-Source Voltage (V) - Drain Current (A)ID 5 V - On-Resistance ()RDS(on) 0.00 0.05 0.10 0.15 0.20 0.25 02468 ID - Drain Current (A) VGS = 10 V VGS = 4.5V 024 68 ID = 2.7 A - Gate-to-Source Voltage (V) Qg - Total Gate Charge (nC) VGS VDS = 50 V VDS = 80 V 024 68 VDS = 50 V VDS = 80 V Transfer Characteristics Capacitance On-Resistance vs. Junction Temper ature 0123456 TC = 125 °C 25 °C VGS - Gate-to-Source Voltage (V) - Drain Current (A)ID - 55 °C 100 200 300 500 600 0 1 02 03 04 05 06 0 VDS - Drain-to-Source Voltage (V) rss Coss Ciss C - Capacitance (pF) C 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 - 50 - 25 0 25 50 75 100 125 150 VGS = 10 V ID = 2.7 A TJ - Junction Temperature (°C) (Normalized) - On-Resistance RDS(on) STM201N www.VBsemi.com g A ll data sheet.com

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Source-Drain Diode Forward Voltage Threshold Voltage TJ = 150 °C TJ = 25 °C VSD - Source-to-Drain Voltage (V) - Source Current (A)IS 2.0 2.4 2.8 3.2 3.6 4.0 - 50 - 25 0 25 50 75 100 125 150 ID = 250 µA (V)VGS(th) TJ - Temperature (°C) On-Resistance vs. Gate-to-Source Voltage Single Pulse Power 0.0 0.1 0.2 0.3 0.4 02468 1 0 ID = 2.7 A - On-Resistance ()RDS(on) VGS - Gate-to-Source Voltage (V) Power (W) Time (s) 10 10000.10.010.001 1001 Safe Operating Area, Junction-to-Ambient - Drain Current (A)I D 0.01 0 0 0 10 111 . 0 0.1 TA = 25 °C Single Pulse 10 ms 1 s DC 100 µs 100 1 ms VDS - Drain-to-Source Voltage (V) * VGS minimum VGS at which RDS(on) is specified Limited by R *DS(on) BVDSS Limited 10 s 100 ms STM201N www.VBsemi.com g A ll data sheet.com

TYPICAL CHARACTERISTICS (25 °C, unless otherwis e noted) * The power dissipation P D is based on T J(max.) = 150 °C, using junction-to-cas e thermal resistance, and is mo re useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Current Derating* 0 25 50 75 100 125 150 TC - Case Temperature (°C) ID - Drain Current (A) Power Derating 25 50 75 100 125 150 TC - Case Temperature (°C) Power Dissipation (W) STM201N www.VBsemi.com g A ll data sheet.com

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Normalized Thermal Transient Impedance, Junction-to-Ambient 10-3 10-2 1 10 60010-110-4 100 0.1 0.01 0.2 0.1 0.05 0.02 Single Pulse Duty Cycle = 0.5 Square Wave Pulse Duration (s) Normalized Effective Transient Thermal Impedance 1. Duty Cycle, D = 2. Per Unit Base = RthJA = 75 °C/W 3. TJM - TA = PDMZthJA(t) Notes: 4. Surface Mounted PDM Normalized Thermal Transient Impedance, Junction-to-Foot 10-3 10-2 1010-110-4 1 0.1 0.01 0.2 0.1 0.05 0.02 Duty Cycle = 0.5 Square Wave Pulse Duration (s) Normalized Effective Transient Thermal Impedance Single Pulse STM201N www.VBsemi.com g A ll data sheet.com

A 1.35 1.75 0.053 0.069 A1 0.10 0.20 0.004 0.008 B 0.35 0.51 0.014 0.020 C 0.19 0.25 0.0075 0.010 D 4.80 5.00 0.189 0.196 E 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC H 5.80 6.2 0 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.50 0.93 0.020 0.037 q 0 °8 °0 °8 ° S 0.44 0.64 0.018 0.026 ECN: C-06527-Rev. I, 11-Sep-06 DWG: 5498 431 2 568 7 HE h x 45 C All Leads q 0.101 mm 0.004"LBA 1 A e D 0.25 mm (Gage Plane) SOIC (NARROW): 8-LEAD JEDEC Part N umber: MS-012 S STM201N www.VBsemi.com g A ll data sheet.com

RECOMMENDED MINIMUM PADS FOR SO-8 0.246 (6.248) Recommended Minimum Pads Dimensions in Inches/(mm) 0.172 (4.369) 0.152 (3.861) 0.047 (1.194) 0.028 (0.711) 0.050 (1.270) 0.022 (0.559) Return to Index STM201N www.VBsemi.com g A ll data sheet.com

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