MMFTP84 VBSEMI | Alldatasheet
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Technical content
P-Channel 60 V (D-S) MOSFET
FEATURES
- Halogen-free According to IEC 61249-2-21 Definition TrenchFET ® Power MOSFET High-Side Switching Low On-Resistance: 3 Low Threshold: - 2 V (typ.) Fast Swtiching Speed: 20 ns (typ.) Low Input Capacitance: 20 pF (typ.) Compliant to RoHS Directive 2002/95/EC Notes: a. Surface mounted on FR4 board. b. Pulse width limited by maximum junction temperature. PRODUCT SUMMARY VDS (V) R DS(on) ()V GS(th) (V) I D (mA) - 60 3 at VGS = - 10 V - 1 to - 3 ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless oth erwise noted Parameter Symbol Limit Unit Dr ain-Source Voltage VDS - 60 V Gate-Source Voltage VGS ± 20 Continuous Drain Currenta TA = 25 °C ID - 500 mATA = 100 °C - 350 Pulsed Drain Currentb IDM -1500 Power Dissipationa TA = 25 °C PD 460 mWTA = 100 °C 240 Maximum Junction-to-Ambienta RthJA 350 °C/W Operating Junction and Storage Tempera ture Range TJ, Tstg - 55 to 150 °C G TO-236 (SOT-23) S D S G D P-Channel MOSFET -500 E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw MMFTP84 A ll data sheet.com
Notes: a. Pulse test: PW 300 µs duty cycle 2 %. b. Switching time is essentially independent of operating temperature. Stresses beyond those listed under “Abs olute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS TA = 25 °C, unless otherwise noted Parameter Symbol Test Conditio ns Limits Unit Min. Typ. a Max. Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = - 10 µA - 60 V Gate-Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1 - 3 Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 10 µA VDS = 0 V, VGS = ± 10 V ± 200 nA VDS = 0 V, VGS = ± 10 V, TJ = 85 °C ± 500 VDS = 0 V, VGS = ± 5 V ± 100 Zero Gate Voltage Drain Current IDSS VDS = - 60 V, VGS = 0 V - 25 VDS = - 60 V, VGS = 0 V, TJ = 85 °C - 250 On-State Drain Currenta ID(on) VGS = - 10 V, VDS = - 4.5 V - 50 mA VGS = - 10 V, VDS = - 10 V - 600 Drain-Source On-Resistancea RDS(on) VGS = - 4.5 V, ID = - 25 mA 4 VGS = - 10 V, ID = - 100 mA 3 VGS = - 10 V, ID = - 100 mA, TJ =125 °C 9 Forward Transconductancea gfs VDS = - 10 V, ID = - 100 mA 80 mS Diode Forward Voltage VSD IS = - 100 mA, VGS = 0 V - 1.4 V Dynamic Total Gate Charge Qg VDS = - 30 V, VGS = - 15 V ID - 100 mA 2.0 nCGate-Source Charge Qgs 1.2 Gate-Drain Charge Qgd 0.8 Input Capacitance Ciss VDS = - 25 V, VGS = 0 V f = 1 MHz pFOutput Capacitance Coss 10 Reverse Transfer Capacitance Crss 5 Switchingb Tur n-On Tim e td(on) VDD = - 25 V, RL = 150 ID - 200 mA, VGEN = - 10 V, Rg = 10 ns Turn-Off Time td(off) 35 E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw MMFTP84 A ll data sheet.com
TYPICAL CHARACTERISTICS 25 ° C, unless otherwise noted Output Characteristics On-Resistance vs. Drain Current Gate Charg e 0.0 0.2 0.4 0.6 0.8 1.0 012345 VDS - Drain-to-Source Voltage (V) - Drain Current (A)ID VGS = 10 V 3 V 2 V 4 V 5 V V 0 200 400 600 800 1000 ID - Drain Current (mA) VGS = 4.5 V VGS = 10 V - On-Resistance (Ω)RDS(on) VGS = 5 V ID = 500 mA - Gate-to-Source Voltage (V) Qg - Total Gate Charge (nC) VGS VDS = 30 V VDS = 48 V Transfer Characteristics Capacitance On-Resistance vs. Junction T emperature 300 600 900 1200 02468 10 VGS - Gate-to-Source Voltage (V) - Drain Current (mA)ID TJ = - 55 °C 125 °C 25 °C 0 5 10 15 20 25 VDS - Drain-to-Source Voltage (V) C - Capacitance (pF) Crss Coss Ciss VGS = 0 V 0.0 0.3 0.6 0.9 1.2 1.5 1.8 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (°C) VGS = 10 V at 500 mA VGS = 4.5 V at 25 mA RDS(on) - On-Resistance (Normalized) E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw MMFTP84 A ll data sheet.com
TYPICAL CHARACTERISTICS 25 °C, un less otherwise noted Source-Drain Diode Forward Volt age Threshold Voltage Variance Over Temperature 1.2 1.5 100 1000 0.00 0.3 0.6 0.9 TJ = 25 °C TJ = 125 °C VSD - Source-to-Drain Voltage (V) - Source Current (A)I S TJ = - 55 °C VGS = 0 V - 0.3 - 0.2 - 0.1 - 0.0 0.1 0.2 0.3 0.4 0.5 - 50 - 25 0 25 50 75 100 125 150 VGS(th) Variance (V) ID = 250 µA TJ - Junction Temperature (°C) On-Resistance vs. Gate-Source Voltage Sing le Pulse Power, Junction-to-Ambient 02468 10 VGS - Gate-to-Source Voltage (V) ID = 500 mA ID = 200 mA RDS(on) - On-Resistance (Ω) 0.01 2.5 100 6000.1 Power (W) Time (s) 1.5 0.5 TA = 25 °C Normalized Thermal Transient Imped ance, Junction-to-Ambient 10-3 10-2 0 0 60 1110-110-4 100 0.1 0.01 0.2 0.1 0.05 0.02 Single Pulse Duty Cycle = 0.5 Square Wave Pulse Duration (s) Normalized Effective Transient Thermal Impedance 1. Duty Cycle, D = 2. Per Unit Base = RthJA = 350 °C/W 3. TJM - TA = PDMZthJA(t) Notes: 4. Surface Mounted PDM E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw MMFTP84 A ll data sheet.com
SOT-23 (TO-236): 3-LEAD b EE1 S e D A2A A1 C Seating Plane 0.10 mm 0.004" C C L q Gauge Plane Seating Plane 0.25 mm Dim MILLIMETERS INCHES Min Max Min Max A 0.89 1.12 0.035 0.044 A1 0.01 0.10 0.0004 0.004 A2 0.88 1.02 0.0346 0.040 b 0.35 0.50 0.014 0.020 c 0.085 0.18 0.003 0.007 D 2.80 3.04 0.110 0.120 E 2.10 2.64 0.083 0.104 E1 1.20 1.40 0.047 0.055 e 0.95 BSC 0.0374 Ref e1 1.90 BSC 0.0748 Ref L 0.40 0.60 0.016 0.024 L1 0.64 Ref 0.025 Ref S 0.50 Ref 0.020 Ref q 3°8 ° 3°8 ° ECN: S-03946-Re v. K, 09-Jul-01 DWG: 5479 E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw MMFTP84 A ll data sheet.com
RECOMMENDED MINIMUM PADS FOR SOT-23 0.106 (2.692) Recommended Minimum Pads Dimensions in Inches/(mm) 0.022 (0.559) 0.049 (1.245) 0.029 (0.724) 0.037 (0.950) 0.053 (1.341) 0.097 (2.459) E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw MMFTP84 A ll data sheet.com
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