SSOT-24 TOREX | Alldatasheet
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Technical content
- SSOT-24 ■Packaging Information ■Reference Pattern Layout Dimension Unit: mm Packaging Information / Reference Pattern Layout Dimensions 0.75 0.5 1.85 1.3 0.6
- リール/Reel
- テーピング仕様/Taping Specifications テーピング仕様 / Ta ping Specifications Unit: mm 3,000pcs/reel direction of feed R Type :[Device orientation : Right] Standard feed 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 +0180 +160
- SSOT-24 Power Dissipation Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient Temperature (85℃) Board Mount (Tjmax=125℃) 3. Power Dissipation vs. Ambient Temperature (105℃) Board Mount (Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) Thermal Resistance (℃/W） 25 500 200.00 85 200 Ambient Temperature (℃) Power Dissipation Pd (mW) Thermal Resistance (℃/W） 25 500 200.00 85 100 Evaluation Board (Unit: mm) Pd vs. Ta Power Dissipation Pd (mW) Ambient Temperature Ta(℃) Pd vs. Ta Power Dissipation Pd (mW) Ambient Temperature Ta(℃)
RoHS対応品 RoHS Compliance 項 目材 料備 考 Item Material Note ① 封止樹脂 エポキシ樹脂 難燃グレード /Flammability rating Resin Epoxy resin UL94V-0 ② リードフレーム 銅系 Lead frame Copper alloy 端子処理 鉛フリーはんだメッキ Lead plating Lead(Pb) free solder plating ③ ダイアタッチ エポキシ Die attach Epoxy ④ ボンディングワイヤ Au Bonding wire ⑤ シリコンチップ Si Silicon chip 捺印表示 レーザー Marking Laser marking SSOT-24 構造図 SSOT-24 Perspective Ver.09