SSK-QFN-7000 IRONWOOD | Alldatasheet
Document overview
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Technical content
Features
Directly mounts to target PCB (needs tooling holes) with hardware Minimum real estate required Compression plate distributes forces evenly Clamshell lid Compression Plate: Black anodized Aluminum. Thickness = 8.5 mm. Compression Screw: Clear anodized Aluminum. Height = 25 mm, Fluted Knob Pogo Pin: Plungers - Hardened Steel/ Gold plated Barrel - Copper Alloy/ Gold plated Spring - Stainless Steel/ Gold wire Pogo Pin Guides: Torlon or Peek Socket Base: Black anodized Aluminum. Height = 6 mm. Clam Shell Lid: Black anodized Aluminum. Height = 16.5 mm. Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 3/4" long. M aterials: Pogo Pin Guide Screw: Pan head phillips, 18-8 SS, 0-80 thread, 3/16" long. Latch: Black anodized Aluminum. Customer's PCB © 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200 www.ironwoodelectronics.com 10 10 IC guide: Ultem 1000 Insulation Plate : FR4 0.0625'' (1.59 mm) Backing Plate : Black anodized Aluminum Recommended Torque 1-2 in-oz.
Ironwood Package code: QFN12H 12.475mm ±0.125mm 3.00mm 2.00mm 1.213mm ±0.125mm (x4) 1.218mm ±0.125mm (x4) 9.725mm (x4) Ø 0.850mm ±0.025mm (x2) Non plated alignment hole 0.30 x 0.32mm Orientation Mark pad (x 24) 3.303mm 3.61mm 3.00mm 0.50mm 0.50mm typ. 14.725mm Non plated mounting hole Ø 1.61mm ±0.05mm (x4) Backing plate size 12.225mm ±0.125mm Socket Body Size Socket Body Size 3.42mm 0.50mm PAGE 2 of 4 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. R ecom m ended PC B Layout Top View Target PC B R ecom m endations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Status: Released Drawing: M.A. Fedde Scale: 4:1 Rev: A Date: 11/10/10 Modified: File: SSK-QFN-7000 Dwg SSK-QFN-7000 Drawing Target PC B R ecom m endations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask All dimensions are in mm. © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com
A 0.80 A1 0.05 b 0.30 D E e
4.00 BSC
3.00 BSC
0.5 BSC
12 Leads
L 0.43 C om patible Q FN (M LF) Spec D E A e b Top View Side View Bottom View Dimensions are in millimeters. Interpret dimensions and toleraces per ASME Y14.5M-1994. L Ironwood Package code: QFN12H PAGE 3 of 4 Target PC B R ecom m endations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Status: Released Drawing: M.A. Fedde Scale: Rev: A Date: 11/10/10 Modified: File: SSK-QFN-7000 Dwg SSK-QFN-7000 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com
Target PC B R ecom m endations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Status: Released Drawing: M.A. Fedde Scale: Rev: A Date: 9/8/10 Modified:File: SSK-QFN-7000 Dwg SSK-QFN-7000 Drawing Description: Insulation Plate and Backing Plate All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) Top View Side View Note: Backing plate holes are tapped to accept 0-80 screws. © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 14.73mm 2.50mm 2.50mm 9.725mm ±0.025mm (x4) 3.00mm sqr. 5.94mm 1.50mm 3.50mm Ø 1.61mm ±0.05mm (x4) 1.27mm (x4) 1.59mm 6.35mm Insulation Plate Backing Plate 14.73mm