SBT-BGA-8005 IRONWOOD | Alldatasheet

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Technical content

13.44 15.73 1.75 0.25 J 13.48 13.23 0.15 PCB side compression

0.45 BGA side compression

SCALE 25 : 1 SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +180C) High current capability (up to 4A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable production yield Highly compliant to accommodate wide co-planarity variations Automated probe manufacturing enables low cost and short lead time Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SBT-BGA169 13x13mm 0.45mm pitch Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 9/6/2012 Material: Material <not specified> Finish: Weight: 6.22 SBT-BGA-8005 Drawing SCALE: 4:1 SHEET: 1 OF 4 ENG: V. Panavala FILE: SBT-BGA-8005 DRAWN BY: V. Panavala

13.475±0.125 Socket Base Outline 1.7±0.1 (x4) NON-PLATED MOUTNING HOLES 0.85±0.025 (x2) NON-PLATED ALIGNMENT HOLES 10.725±0.05 3.00 *2.9125 2.7750 0.45 Typ. 0.45 Typ. 5.40 5.175 15.7250 Backing Plate Outline 2.00 13.225 Socket Base Outline A1 Corner BGA+ target PCB Socket base A1 mark *Note: BGA pattern is not symmetrical with respect to the mounting holes Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 9/6/2012 Material: Material <not specified> Finish: Weight: 6.22 SBT-BGA-8005 Drawing SCALE: 5:1 SHEET: 2 OF 4 ENG: V. Panavala FILE: SBT-BGA-8005 DRAWN BY: V. Panavala

D E e b A1 Corner .015 C A B .05 SEE NOTE #3 0.03 A A DETAIL A SCALE 12 : 1 .075 C .20 C SEE NOTE #5 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. DIM Minimum Maximum A 2.5 A1 .17 .23 b .23 .29 E 6.104 BSC D 6.247 BSC e 0.45 BSC ARRAY 13 X 13 PIN COUNT 169 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 9/6/2012 Material: Material <not specified> Finish: Weight: 6.22 SBT-BGA-8005 Drawing SCALE: 10:1 SHEET: 3 OF 4 ENG: V. Panavala FILE: SBT-BGA-8005 DRAWN BY: V. Panavala

10.725 15.725 10.725 1.71±0.10 THRU 113° 3.50 0.254 ITEM NO. DESCRIPTION Material

1 Dowel pin, 1/32" X 1/4", SS Stainless Steel (18-8)

2 Insulation plate 8mm 0.254mm thick FR4 Standard 3 Screw, #0-80 X .188", Flat, SS Stainless Steel (18-8) 4 SBT Pin, 0.4mm pitch N/A

5 Floating Guide Spring Alloy Steel (SS)

6 Compression Screw M6x1 Stainless Steel (18-8)

7 SBT 8x8mm socket base with 0.25mm pocket offset 8 Floating Guide SBT-BGA169 13x13mm 0.45mm pitch Kapton Polyimide 9 Middle Guide SBT-BGA 169 13x13mm 0.45mm pitch PEEK Ceramic filled 10 SBT-BGA Bottom guide 6.1x6.25mm 0.45mm 13x13 array PEEK Ceramic filled 11 BGA169 0.45mm 13x13 array FR4

12 Backing Plate 8x8mm IC 7075-T6 Aluminum Alloy

13 Screw, #0-80 X .375", Flat, SS Material <not specified>

14 Socket Lid Swivel Lid 8mm IC 7075-T6 Aluminum Alloy

15 Compression Plate 6x6mm IC 7075-T6 Aluminum Alloy

16 BGA chip 6.1x6.25mm 0.45mm 13x13 array 17 #0-80 Shoulder Screw, 0.062" thread length Stainless Steel (303) 18 IC guide 6.1x6.25mm Kapton Polyimide Rev Date Initials Description A 09/06/12 VP Original B 02/19/14 DH Changed current rating of pin Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Specification Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 9/6/2012 Material: Material <not specified> Finish: Weight: 6.22 SBT-BGA-8005 Drawing SCALE: 1:1 SHEET: 4 OF 4 ENG: V. Panavala FILE: SBT-BGA-8005 DRAWN BY: V. Panavala