SBT-BGA-6503

SBT-BGA-6503 IRONWOOD | Alldatasheet

Document overview

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Technical content

Features

Wide temperature range (-55C to +180C)• High current capability (up to 4A)• Excellent signal integrity at high frequencies• Low and stable contact resistance for reliable production yield• Highly compliant to accommodate wide co-planarity variations• Automated probe manufacturing enables low cost and short • lead time Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Skt Assy Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 5/29/14 Material: N/A Finish: N/A Weight: 15.01 SBT-BGA-6503 Drawing SCALE: 3:1 SHEET: 1 OF 5 ENG: V. Panavala FILE: SBT-BGA-6503 DRAWN BY: V. Panavala

20.725 Backing Plate Oultine 15.725±0.05 18.225 Socket Base Outline 2.6375* 2.2625 11.2000 (x4) 1.700±0.100 Non- plated Hole 0.4200 0.80 Typ. 0.850±0.025 Non- Plated Hole 2.540±0.025 5.080±0.025 19.450 19.075 A1 Marking Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask *Note: BGA pattern is not symmetrical with respect to the mounting holes. Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 5/29/14 Material: N/A Finish: N/A Weight: 15.01 SBT-BGA-6503 Drawing SCALE: 5:1 SHEET: 2 OF 5 ENG: V. Panavala FILE: SBT-BGA-6503 DRAWN BY: V. Panavala

A 0.1 Z Z D E 0.10 b e

0.05 Z X Y

0.05 Z 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Ironwood Package Code: BGA225E DIM Minimum Maximum A 3.25 A1 0.16 0.40 b 0.25 0.55 D 13.0 BSC E 13.0 BSC e 0.8 BSC Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 5/29/14 Material: N/A Finish: N/A Weight: 15.01 SBT-BGA-6503 Drawing SCALE: 5:1 SHEET: 3 OF 5 ENG: V. Panavala FILE: SBT-BGA-6503 DRAWN BY: V. Panavala

20.725 1.27 15.725 5 15 1.59 Pin Detail Scale 16:1 Insulation Plate Specification ITEM NO. Description Material 1 Socket Base, SBT-BGA 13 X 13; 0.375 shift 7075-T6 Aluminum Alloy

2 SBT Ni plt socket lid 13mm 7075-T6 Aluminum Alloy

3 Compression Screw M10 7075-T6 Alumium Alloy

4 Backing Plate 13 X 13 7075-T6 Aluminum Alloy

5 Compression Plate, 12.95 X 12.95 7075-T6 Aluminum Alloy

6 SBT-BGA IC guide 13x13mm Torlon 4203

7 Floating Guide - 15x15 array, 0.8mm pitch, 0.375 shift Semitron MDS 100 8 Middle Pogo Guide - 15x15 , 0.8mm pitch, 0.375 shift Semitron MDS 100 9 Bottom Pogo Guide - 15x15 array, 0.8mm pitch, 0.375 shift Semitron MDS 100

10 Insulation Plate FR4

11 Test CHIP 15x15 array, 0.8mm pitch FR4 High temp 12 Target PCB 15x15 array, 0.8mm pitch FR4 High temp

13 Floating Guide Spring Alloy Steel (SS)

14 SBT Pin, SBT-BGA 0.5mm-0.8mm

15 Dowel Pin, 1/32" x 3/8", SS Chrome Stainless Steel

16 #0-80 Shoulder Screw, 0.062" thread length Stainless Steel (303) 17 #0-80 X .625 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE Alloy Steel 18 #0-80, 90 deg., head pin guide screw, Peek material 5.5715mm overall Length PEEK unfilled Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Material Info Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 5/29/14 Material: N/A Finish: N/A Weight: 15.01 SBT-BGA-6503 Drawing SCALE: 3:1 SHEET: 4 OF 5 ENG: V. Panavala FILE: SBT-BGA-6503 DRAWN BY: V. Panavala

Rev Date Initials Description A 05/29/14 VP Original B 12/23/14 DH Changed IC Guide material from Ultem to torlon C 2/27/15 RP/MR P-P196A was P-P149A, R3200 was R1391 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Revision Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 5/29/14 Material: Finish: Weight: SBT-BGA-6503 Drawing SCALE: 3:1 SHEET: 5 OF 5 ENG: V. Panavala FILE: SBT-BGA-6503 DRAWN BY: V. Panavala