CHBT-BGA-7000 IRONWOOD | Alldatasheet
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Technical content
19.61 13.52 47.60 6.92 5.36 30.72 49.07 0.60 U U Recommended Torque = 12 in-lbs 22.96 3.19 38.02 17.90 2.37 15.02 3.42 5.00
0.30 SECTION U-U
FEATURES: Wide temperature range (-55C to +150C)• High current capability (up to 2.8A)• Excellent signal integrity at high frequencies• Low and stable contact resistance for reliable production yield• Highly compliant to accommodate wide co-planarity variations• Automated probe manufacturing enables low cost and short lead time• CHBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Specification Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 2/11/13 Material: Material <not specified> Finish: Weight: 68.94 CHBT-BGA-7000 Drawing SCALE: 1.4:1 SHEET: 1 OF 5 ENG: S. Huang FILE: CHBT-BGA-7000 Dwg DRAWN BY: S. Huang
2.54 0.85±0.05 (x3) non plated alignment hole 1.71±0.10 (x4) Non plated mounting hole 21.4750±0.125 (x4) Socket base size 37.225±0.125 Socket base size 5.08 15.00 (x4) 0.25 pad (x650) 18.725±0.050 (x4) Backing plate size 1.8625 2.1125 * 0.50 typ. 1.6125 * 1.2500±0.1250 (x4) 1.250±0.125 (x4) R1.85 (x4) 0.60 (x4) Orientation mark Note: BGA pattern is shifted to the right by 0.25mm with respect to the mounting holes. Max Component Ht. 15mm Max Component Ht. 3.4mm Max Component Ht. 2.4mm--close latch Max Component Ht. 3.2mm--open latch Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask Keep out area Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 2/11/13 Material: Material <not specified> Finish: Weight: 68.94 CHBT-BGA-7000 Drawing SCALE: 3:1 SHEET: 2 OF 5 ENG: S. Huang FILE: CHBT-BGA-7000 Dwg DRAWN BY: S. Huang
D E A1 location 0.15 Z 0.15 Z Y X 0.08 Z 0.08 Z e b A1 location
0.15 M X Y Z
0.08 M Z
Ironwood Package code: BGA650B1 BOTTOM VIEW SIDE VIEW Array: 31x31 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5-1994. 3. Dimension b is measured at the maximum solder bll diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelisml measurement shall exclude any effect of mark on top surface of package. DIM MIN MAX A 1.4 A1 0.16 0.26 b 0.27 0.37 D 16.00 D1 15.00 E 16.00 E1 15.00 e 0.50 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 2/11/13 Material: Material <not specified> Finish: Weight: 68.94 CHBT-BGA-7000 Drawing SCALE: 3.5:1 SHEET: 3 OF 5 ENG: S. Huang FILE: CHBT-BGA-7000 Dwg DRAWN BY: S. Huang
22.725 1.71 (x4) 18.725±0.05 (x4) 4.00 (x4) 2.50 5.00 0.30 3.00 2.00 (x5) PIN DETAIL Scale: 16:1 Backing Plate Detail View ITEM NO. DESCRIPTION Material
1 Clamshell Socket Base 16mm IC 7075-T6 Aluminum Alloy
2 M10 Comression Screw 7075-T6 Aluminum Alloy
3 Clamshell Latch 7075-T6 Aluminum Alloy
4 Clam shell lid for 17mm IC 7075-T6 Aluminum Alloy
5 CBT Compression Plate 16mm IC 7075-T6 Aluminum Alloy
6 Floating Guide 31x31 array 0.50mm pitch Kapton Polyimide/Cirlex 7 Middle guide for 16x16mm, 31x31 0.50mm pitch BGA650 Semitron MDS 100 8 Bottom guide for 16x16mm, 31x31 0.50mm pitch BGA650 Semitron MDS 100 9 Test Chip for 16x16mm 31x31 array 0.50mm pitch Material <not specified> 10 Test PCB 16x16mm 31x31 array 0.50mm pitch Material <not specified> 11 16x16mm Clamshell Backing Plate 7075-T6 Aluminum Alloy
12 Hinge Pin and Snap Ring, 3mm OD, 25mm long, SS Stainless Steel (ferritic)
13 Dowel pin, 1/32" X 1/4", SS Stainless Steel (18-8)
14 Screw, M3 x 12mm, Low Head Cap, SS 18-8 Stainless Steel
15 Spring Clamshell lid assembly Steel Music Wire
16 Precision Compression Spring, Zinc-Plated Music Wire,
1/2" Length, .12" OD, .016" Wire Zinc Plated Music Wire
17 Floating Guide Spring Alloy Steel (SS)
18 HyperCore SBT pin, 0.5mm pitch N/A 19 #0-80, 90 deg., head pin guide screw, Peek material PEEK unfilled 20 #0-80 x 0.5, SH Cap Screw 18-8 Stainless Steel 21 Insulating washer, 4mm OD. Kapton Polyimide/Cirlex
22 Insulating disk, 2mm OD with 2 mil thk Adesive Kapton Polyimide/Cirlex
Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Assy exploded view Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 2/11/13 Material: Material <not specified> Finish: Weight: 68.94 CHBT-BGA-7000 Drawing SCALE: 1.8:1 SHEET: 4 OF 5 ENG: S. Huang FILE: CHBT-BGA-7000 Dwg DRAWN BY: S. Huang
Rev Date Initials Description A 02/11/13 SH Original B 12/22/14 DH Added material to bottom guide Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Revisions Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 2/11/13 Material: Finish: Weight: CHBT-BGA-7000 Drawing SCALE: 1.8:1 SHEET: 5 OF 5 ENG: S. Huang FILE: CHBT-BGA-7000 Dwg DRAWN BY: S. Huang