SBT-BGA-7015

SBT-BGA-7015 IRONWOOD | Alldatasheet

Document overview

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Technical content

Features

Wide temperature range (-55C to +180C)• High current capability (up to 4A)• Excellent signal integrity at high frequencies• Low and stable contact resistance for reliable production yield• Highly compliant to accommodate wide co-planarity variations• Automated probe manufacturing enables low cost and short lead • time SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Specifications Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 10/16/2013 Material: Material <not specified> Finish: Weight: 21.40 SBT-BGA-7015 Drawing SCALE: 2.5:1 SHEET: 1 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-7015 Dwg DRAWN BY: M. Raske

24.475±0.125 Socket Base Outline 0.65 typ 5.08 21.725±0.050 (x4) 2X 0.85 THRU Non plated hole 2.54 2.3375 2.0875 0.33 (x625) 26.725 Backing Plate Outline 24.2250±0.1250 Socket Base Outline 1.6100±0.0100 (4) non plated mounting hole *7.55 7.80 A1 corner Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask *Note: BGA pattern is not symmetrical with respect to the mounting holes. It is offset 0.25mm to the right of center with respect the mounting holes. Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 10/16/2013 Material: Material <not specified> Finish: Weight: 21.40 SBT-BGA-7015 Drawing SCALE: 4:1 SHEET: 2 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-7015 Dwg DRAWN BY: M. Raske

D E TOP VIEW A1 Corner H SIDE VIEW e b BOTTOM VIEW A1 Ball Pad corner

0.15 M C A B

0.08 M C

A DETAIL H SCALE 8 : 1 0.10 C 0.10 C 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 28x28 array DIM Minimum Maximum A 1.35 A1 0.21 0.35 b 0.35 0.45 D 19.0 BSC E 19.0 BSC e 0.65 BSC Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 10/16/2013 Material: Material <not specified> Finish: Weight: 21.40 SBT-BGA-7015 Drawing SCALE: 4:1 SHEET: 3 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-7015 Dwg DRAWN BY: M. Raske

1.61 (4) 21.725 4.5875 1.5875 Backing Plate Specification Scale1:1 ITEM NO. DESCRIPTION Material

1 Socket Base, SBT BGA, 19x19mm

0.25mm shift 7075-T6 Aluminum Alloy

2 Test PCB FR4 High temp

3 Bottom guide, 19x19mm, 0.65mm pitch 28x28 array Semitron MDS 100 4 Middle guide 19x19mm, 0.65mm pitch 28x28 array Semitron MDS 100 5 Floating Guide, 19x19mm 0.65mm pitch 28x28 array Semitron MDS 100

6 Socket Lid 19MM, M10 THD 7075-T6 Alumium

7 Compression Screw M10 7075-T6 Alumium

8 Backing plate 19mm IC Ni plated 7075-T6 Aluminum

9 Pogo Pin, SBT-BGA 0.5mm-0.8mm

10 Test Chip High Temp FR4

11 Compression Plate 19MM 7075-T6 Alumium

12 #0-80 x 0.5, SH Cap Screw Alloy Steel 13 #0-80 Shoulder Screw, 0.062" thread length Stainless Steel (303)

14 Dowel pin, 1/32" X 1/4", SS Stainless Steel (18-8)

15 #0-80 X .188" LG FL HD, Slotted, Polypropylene PP Homopolymer

16 Floating Guide Spring Alloy Steel (SS)

17 Insulation Plate FR4 Standard

Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Assy, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 10/16/2013 Material: Material <not specified> Finish: Weight: 21.40 SBT-BGA-7015 Drawing SCALE: 3:1 SHEET: 4 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-7015 Dwg DRAWN BY: M. Raske